US4890192A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film capacitor
Assignee: Rateze Remote Mgmt LLC
•
Filing: 1987-04-09
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Granted: 1989-12-26
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Expires: 2007-04-09
Abstract
Abstract A thin film capacitor having a top, middle and bottom plate forming two capacitors in series in which the middle plate is a plurality of isolated plates thereby forming a structure of a plurality of two capacitors in series which are all connected in parallel. The capacitor may be integrated into an electronic substrate. The capacitor may be formed by depositing films of the metal conductors and dielectrics and may be formed as an integral part of a semiconductor chip or interconnect substrate.
Inventors
- 👤 Lawrence N. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 20:50
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
91 words
An integrated thin film capacitor comprising, first, second and third metallic conductor layers, said first and second layer separated by a first insulator layer, said second and third layers separated by a second insulator layer, said second conductors positioned between said first and third conductors and being a plurality of separated conductors separated by insulators, and said first and third layers each forming an electrical connection to the capacitor and the first, second and third conductors forming a plurality of series connected capacitors, which series connected capacitors are connected in parallel.
Claim 2
Dependent Claim
91 words
An integrated thin film capacitor comprising, first, second and third metallic conductor layers, said first and second layer separated by a first insulator layer, said second and third layers separated by a second insulator layer, said second conductors positioned between said first and third conductors and being a plurality of separated conductors separated by insulators, and said first and third layers each forming an electrical connection to the capacitor and the first, second and third conductors forming a plurality of series connected capacitors, which series connected capacitors are connected in parallel.
Claim 3
Dependent Claim
17 words
The apparatus of claim 1 wherein said integrated capacitor is formed as part of an electrical substrate.
Claim 4
Dependent Claim
10 words
The apparatus of claim 2 wherein the conductors include niobium.
Claim 5
Dependent Claim
10 words
The apparatus of claim 2 wherein the conductors include tantalum.
Claim 6
Dependent Claim
19 words
The apparatus of claim 1 wherein said integrated capacitor is formed as a part of an integrated circuit chip.
Claim 7
Independent Claim
113 words
The method of providing a capacitor on an electronic substrate wafer comprising, coating a substrate with a first thin film of metal, applying a first dielectric coating over the first metal film, fabricating a plurality of separated and spaced metal films on the dielectric coating, said metal films being separated by a dielectric insulator, placing a second dielectric coating over the plurality of spaced metal films, applying a third thin film of metal over the second dielectric coating, and forming electrical connections to the capacitor on the first and third films wherein the first, second and third films form a plurality of series connected capacitors, which series connected capacitors are connected in parallel.
Claim 8
Independent Claim
113 words
The method of providing a capacitor on an electronic substrate wafer comprising, coating a substrate with a first thin film of metal, applying a first dielectric coating over the first metal film, fabricating a plurality of separated and spaced metal films on the dielectric coating, said metal films being separated by a dielectric insulator, placing a second dielectric coating over the plurality of spaced metal films, applying a third thin film of metal over the second dielectric coating, and forming electrical connections to the capacitor on the first and third films wherein the first, second and third films form a plurality of series connected capacitors, which series connected capacitors are connected in parallel.
Claim 9
Dependent Claim
11 words
The method of claim 6 wherein the metal films include niobium.
Claim 10
Dependent Claim
11 words
The method of claim 6 wherein the metal films include tantalum.
Claim 11
Dependent Claim
31 words
The method of claim 6 wherein the plurality of spaced metal films are formed by depositing a coat of metal, and anodizing to completion spaced portions of the coat of metal.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-25 | 1993-06-26 | 1993-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-25 | 1997-06-26 | 1997-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-25 | 2001-06-26 | 2001-12-26 | $7700.00 | Window Closed / Lapsed |