Patent US4918824A successfully refreshed from Google Patents.
Patent US6400172B1 successfully refreshed from Google Patents.
US6400172B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor components having lasered machined conductive vias
Assignee: Micron Technology Inc
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Filing: 1999-12-30
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Granted: 2002-06-04
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Expires: 2019-12-30
Abstract
Abstract A method for fabricating semiconductor components, such as packages, interconnects and test carriers, is provided. The method includes laser machining conductive vias for interconnecting contacts on the component, using a laser beam that is focused to produce a desired via geometry. The vias can include enlarged end portions to facilitate deposition of a conductive material during formation of the vias, and to provide an increased surface area for forming the contacts. For example, by focusing the laser beam at a midpoint of a substrate of the component, an hour glass via geometry is provided. Alternately, the laser beam can be focused at an exit point, or at an entry point of the substrate, to provide converging or diverging via geometries. The method can also include forming contact pins on the conductive vias by bonding and shaping metal wires using a wire bonding process, or a welding process.
Inventors
- 👤 Salman Akram
- 👤 Warren M. Farnworth
- 👤 Alan G. Wood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:12
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H10; H10W; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0234; H10W20/0242; H10W20/0245; H10W20/20; H10W20/211; H10W20/212; H10W20/2125; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/614; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W90/00; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/0959; H05K2201/09818; H05K2201/09827; H05K2201/09845; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10734; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H05K3/0032; H10W70/099; H10W72/00; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; H10W90/20; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
105 words
A semiconductor package comprising: a substrate comprising a first surface and a second surface; a conductive via in the substrate comprising a laser machined opening extending from the first surface to the second surface and at least partially filled with a conductive material, the laser machined opening and the conductive via having an hour glass geometry; a first contact proximate to the first surface in electrical communication with the conductive via; a semiconductor die in electrical communication with the first contact; a second contact proximate to the second surface in electrical communication with the conductive via; and an external contact bonded to the second contact.
Claim 2
Dependent Claim
105 words
A semiconductor package comprising: a substrate comprising a first surface and a second surface; a conductive via in the substrate comprising a laser machined opening extending from the first surface to the second surface and at least partially filled with a conductive material, the laser machined opening and the conductive via having an hour glass geometry; a first contact proximate to the first surface in electrical communication with the conductive via; a semiconductor die in electrical communication with the first contact; a second contact proximate to the second surface in electrical communication with the conductive via; and an external contact bonded to the second contact.
Claim 3
Dependent Claim
14 words
The semiconductor package of claim 1 wherein the external contact comprises a metal ball.
Claim 4
Dependent Claim
14 words
The semiconductor package of claim 1 wherein the external contact comprises a metal wire.
Claim 5
Dependent Claim
30 words
The semiconductor package of claim 1 wherein the conductive material comprises a conductive polymer and the second contact comprises a concave depression sized and shaped to retain the external contact.
Claim 6
Dependent Claim
22 words
The semiconductor package of claim 1 wherein the second contact comprises a peripheral ridge sized and shaped to retain the external contact.
Claim 7
Dependent Claim
30 words
The semiconductor package of claim 1 wherein the external contact comprises a metal ball and the second contact comprises a peripheral ridge sized and shaped to retain the metal ball.
Claim 8
Dependent Claim
113 words
A semiconductor package comprising: a substrate having a first surface and a second surface; a conductive via in the substrate comprising a laser machined opening at least partially filled with a conductive material, the conductive via and the laser machined opening having a geometry which converges from the first surface to the second surface, or diverges from the first surface to the second surface; a first contact proximate to the first surface in electrical communication with the conductive material; a semiconductor die in electrical communication with the first contact; a second contact proximate to the second surface in electrical communication with the conductive material; and an external contact bonded to the second contact.
Claim 9
Dependent Claim
113 words
A semiconductor package comprising: a substrate having a first surface and a second surface; a conductive via in the substrate comprising a laser machined opening at least partially filled with a conductive material, the conductive via and the laser machined opening having a geometry which converges from the first surface to the second surface, or diverges from the first surface to the second surface; a first contact proximate to the first surface in electrical communication with the conductive material; a semiconductor die in electrical communication with the first contact; a second contact proximate to the second surface in electrical communication with the conductive material; and an external contact bonded to the second contact.
Claim 10
Dependent Claim
28 words
The semiconductor package of claim 7 wherein the external contact comprises a ball and the second contact comprises a peripheral ridge sized and shaped to retain the ball.
Claim 11
Dependent Claim
18 words
The semiconductor package of claim 7 wherein the external contact comprise a wire shaped to form a pin.
Claim 12
Dependent Claim
30 words
The semiconductor package of claim 7 wherein the external contact comprises a ball and the conductive material comprises a conductive polymer having a concave depression sized to retain the ball.
Claim 13
Dependent Claim
100 words
A test carrier for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a first contact proximate to the first surface configured to electrically engage the external contact on the component; a second contact proximate to the second surface configured to electrically engage a test apparatus; and a conductive via in the substrate comprising a laser machined opening at least partially filled with a conductive material in electrical communication with the first contact and the second contact, the laser machined opening and the conductive via having an hour glass geometry.
Claim 14
Dependent Claim
100 words
A test carrier for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a first contact proximate to the first surface configured to electrically engage the external contact on the component; a second contact proximate to the second surface configured to electrically engage a test apparatus; and a conductive via in the substrate comprising a laser machined opening at least partially filled with a conductive material in electrical communication with the first contact and the second contact, the laser machined opening and the conductive via having an hour glass geometry.
Claim 15
Dependent Claim
21 words
The test carrier of claim 11 wherein the external contact comprises a ball and the first contact comprises a conductive pocket.
Claim 16
Dependent Claim
19 words
The test carrier of claim 11 wherein the second contact comprise a metal wire bonded to the conductive material.
Claim 17
Dependent Claim
115 words
A test carrier configured for use with a test apparatus for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a first contact on the first surface comprising a conductive pocket configured to electrically engage the external contact on the component; a second contact on the second surface configured to electrically engage the test apparatus; and a conductive via in the substrate comprising a laser machined opening and a conductive material therein, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface.
Claim 18
Dependent Claim
115 words
A test carrier configured for use with a test apparatus for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a first contact on the first surface comprising a conductive pocket configured to electrically engage the external contact on the component; a second contact on the second surface configured to electrically engage the test apparatus; and a conductive via in the substrate comprising a laser machined opening and a conductive material therein, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface.
Claim 19
Dependent Claim
26 words
The test carrier of claim 14 wherein the conductive material comprises a conductive polymer having a concave depression sized and shaped to retain the second contact.
Claim 20
Dependent Claim
18 words
The test carrier of claim 14 wherein the second contact comprises a wire bonded to the conductive material.
Claim 21
Dependent Claim
22 words
The test carrier of claim 14 wherein the conductive material comprises a peripheral ridge sized and shaped to retain the second contact.
Claim 22
Dependent Claim
126 words
A test interconnect for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a conductive via comprising a laser machined opening in the substrate extending from the first surface to the second surface, and a conductive material in the laser machined opening, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface; a first contact proximate to the first surface in electrical communication with the conductive material configured to electrically engage the external contact on the component; and a second contact proximate to the second surface in electrical communication with the conductive material.
Claim 23
Dependent Claim
126 words
A test interconnect for testing a semiconductor component having an external contact comprising: a substrate comprising a first surface and a second surface; a conductive via comprising a laser machined opening in the substrate extending from the first surface to the second surface, and a conductive material in the laser machined opening, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface; a first contact proximate to the first surface in electrical communication with the conductive material configured to electrically engage the external contact on the component; and a second contact proximate to the second surface in electrical communication with the conductive material.
Claim 24
Dependent Claim
19 words
The test interconnect of claim 18 wherein the first contact comprises a wire shaped to form a compliant member.
Claim 25
Dependent Claim
13 words
The test interconnect of claim 18 wherein the second contact comprises a pad.
Claim 26
Dependent Claim
149 words
A test system for testing a semiconductor component having an external contact comprising: a wafer handler comprising an electrical connector in electrical communication with test circuitry; an interconnect mounted to the wafer handler comprising: a substrate comprising a first surface and a second surface; a laser machined opening in the substrate extending from the first surface to the second surface, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface; a conductive material in the laser machined opening; a first contact proximate to the first surface in electrical communication with the conductive material configured to electrically engage the external contact on the component; and a second contact proximate to the second surface in electrical communication with the conductive material configured to electrically engage the electrical connector.
Claim 27
Dependent Claim
149 words
A test system for testing a semiconductor component having an external contact comprising: a wafer handler comprising an electrical connector in electrical communication with test circuitry; an interconnect mounted to the wafer handler comprising: a substrate comprising a first surface and a second surface; a laser machined opening in the substrate extending from the first surface to the second surface, the lasered machined opening having a geometry which is either hour glass shaped, or converges from the first surface to the second surface, or diverges from the first surface to the second surface; a conductive material in the laser machined opening; a first contact proximate to the first surface in electrical communication with the conductive material configured to electrically engage the external contact on the component; and a second contact proximate to the second surface in electrical communication with the conductive material configured to electrically engage the electrical connector.
Claim 28
Dependent Claim
15 words
The test system of claim 21 wherein the electrical connector comprises a spring loaded pin.
Claim 29
Dependent Claim
19 words
The test system of claim 21 wherein the second contact comprises a wire shaped to form a spring segment.
References Cited (Backward Citations)
US5236551A
Cited
US5046239A
Cited
US5063177A
Cited
US5166097A
Cited
US5172050A
Cited
US5229647A
Cited
US5686317A
Cited
US5559444A
Cited
US5716218A
Cited
US5815000A
Cited
US5878485A
Cited
US5487999A
Cited
US5796264A
Cited
US5634267A
Cited
US5541525A
Cited
US5781022A
Cited
US5607818A
Cited
US5896036A
Cited
US5578526A
Cited
US5249450A
Cited
US5426072A
Cited
US5528080A
Cited
US5420520A
Cited
US5592736A
Cited
US5483741A
Cited
WO1995014314A1
Cited
US5495667A
Cited
US5756395A
Cited
US5674785A
Cited
US5869974A
Cited
US5929647A
Cited
US5783461A
Cited
US5801452A
Cited
US5834945A
Cited
US5915977A
Cited
US5931685A
Cited
US6107109A
Cited
US6114240A
Cited
US6294837B1
Cited
US6242935B1
Cited
US6314641B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-03 | 2005-12-03 | 2006-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-03 | 2009-12-03 | 2010-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-03 | 2013-12-03 | 2014-06-04 | $7700.00 | Window Closed / Lapsed |