US5495667A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming contact pins for semiconductor dice and interconnects
Assignee: Micron Technology Inc
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Filing: 1994-11-07
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Granted: 1996-03-05
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Expires: 2014-11-07
Abstract
Abstract A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for testing a semiconductor die and are adapted to establish an electrical connection with the bond pads of the die. In a second embodiment, the contact pins are formed directly on the bond pads of a die and can be used for establishing a permanent or temporary electrical connection to the pads. The contact pins include a base portion attached to the die or interconnect, a compliant spring segment, and a contact ball at the tip. The contact pins are formed using a wire bonding process or a welding process in which a metal wire is simultaneously heated and shaped into a compliant structure as it is attached to the die or interconnect.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
- 👤 Alan G. Wood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:44
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; H; H10; H10W; H10W72/00; H10W72/90; G01R31/00; G01R31/28; G01R31/2851; G01R31/2884; H10W72/01; H10W72/011; H10W72/0112; H10W72/012; H10W72/015; H10W72/20; H10W72/50; G01R31/2886; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H10W72/01221; H10W72/01225; H10W72/071; H10W72/0711; H10W72/07141; H10W72/251; H10W72/252; H10W72/29; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
74 words
A method for forming a contact structure on an interconnect, said contact structure adapted to establish an electrical connection with a contact location on a semiconductor die, said method comprising: providing a substrate; attaching a wire to the substrate using a method selected from the group consisting of wire bonding and welding; heating and shaping the wire into a compliant structure during said attaching step; and severing the wire to form a contact pin.
Claim 2
Independent Claim
74 words
A method for forming a contact structure on an interconnect, said contact structure adapted to establish an electrical connection with a contact location on a semiconductor die, said method comprising: providing a substrate; attaching a wire to the substrate using a method selected from the group consisting of wire bonding and welding; heating and shaping the wire into a compliant structure during said attaching step; and severing the wire to form a contact pin.
Claim 3
Dependent Claim
32 words
The method as claimed in claim 1 and wherein: heating and shaping the wire is with a laser and a wire bonder tool manipulated to bend the wire into a predetermined shape.
Claim 4
Dependent Claim
20 words
The method as claimed in claim 1 and wherein: heating and shaping the wire is with a heated capillary tube.
Claim 5
Dependent Claim
18 words
The method as claimed in claim 1 and wherein: the wire is shaped to include a spring segment.
Claim 6
Dependent Claim
21 words
The method as claimed in claim 1 and wherein: the wire is shaped with a contact ball on an end thereof.
Claim 7
Independent Claim
108 words
A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising: forming a substrate; forming a conductive trace on the substrate; attaching a metal pin to the substrate in electrical communication with the conductive trace said metal pin formed of a wire that is attached to the substrate using an attachment method selected from the group consisting of wire bonding and welding; heating and shaping the wire as it is attached to the substrate to form a compliant spring segment; and following heating and shaping of the wire severing the wire.
Claim 8
Independent Claim
108 words
A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising: forming a substrate; forming a conductive trace on the substrate; attaching a metal pin to the substrate in electrical communication with the conductive trace said metal pin formed of a wire that is attached to the substrate using an attachment method selected from the group consisting of wire bonding and welding; heating and shaping the wire as it is attached to the substrate to form a compliant spring segment; and following heating and shaping of the wire severing the wire.
Claim 9
Dependent Claim
15 words
The method as claimed in claim 6 and wherein; the compliant spring segment is c-shaped.
Claim 10
Dependent Claim
15 words
The method as claimed in claim 6 and wherein: the compliant spring segment is s-shaped.
Claim 11
Dependent Claim
17 words
The method as claimed in claim 6 and wherein: the spring segment is wider at a base.
Claim 12
Dependent Claim
28 words
The method as claimed in claim 6 and wherein: the wire is attached to the substrate at an acute angle with respect to a plane of the substrate.
Claim 13
Dependent Claim
22 words
The method as claimed in claim 6 and further comprising: forming a contact ball on an end of the length of wire.
Claim 14
Independent Claim
87 words
A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising: forming a substrate; forming a conductive trace on the substrate; attaching a metal pin to the substrate in electrical communication with the conductive trace, said metal pin formed of a wire that is wire bonded to the substrate; heating and shaping the wire as it is wire bonded to form a compliant spring segment; and then severing the wire.
Claim 15
Independent Claim
87 words
A method for forming a contact pin for an interconnect, said contact pin adapted to establish an electrical connection with a contact location on a semiconductor die, comprising: forming a substrate; forming a conductive trace on the substrate; attaching a metal pin to the substrate in electrical communication with the conductive trace, said metal pin formed of a wire that is wire bonded to the substrate; heating and shaping the wire as it is wire bonded to form a compliant spring segment; and then severing the wire.
Claim 16
Dependent Claim
27 words
The method as claimed in claim 12 and wherein; heating and shaping the wire is by manipulating a wire bonding tool while a laser heats the wire.
Claim 17
Dependent Claim
24 words
The method as claimed in claim 12 and wherein: heating and shaping the wire is by manipulating a capillary tube having a heating element.
Claim 18
Dependent Claim
29 words
The method as claimed in claim 12 and wherein: the spring segment is attached to the substrate at an acute angle with respect to a plane of the substrate.
Claim 19
Dependent Claim
21 words
The method as claimed in claim 12 and wherein: the spring segment is wider at a base than at a tip.
Claim 20
Dependent Claim
19 words
The method as claimed in claim 12 and further comprising: forming a ball on an end of the wire.
Claim 21
Dependent Claim
26 words
The method as claimed in claim 12 and wherein: the conductive trace includes a bond site and the wire is wire bonded to the bond site.
Claim 22
Independent Claim
86 words
A method for forming a contact structure on a semiconductor die, said die including a substrate with integrated circuitry and a die pad in electrical communication with the integrated circuitry, said method comprising: forming a solder pad on the die pad; attaching a metal wire to the solder pad using a wire bonding process; heating and shaping the wire into a compliant structure during said wire bonding process; and after shaping the wire, severing the wire to form a compliant contact pin on the die pad.
Claim 23
Independent Claim
86 words
A method for forming a contact structure on a semiconductor die, said die including a substrate with integrated circuitry and a die pad in electrical communication with the integrated circuitry, said method comprising: forming a solder pad on the die pad; attaching a metal wire to the solder pad using a wire bonding process; heating and shaping the wire into a compliant structure during said wire bonding process; and after shaping the wire, severing the wire to form a compliant contact pin on the die pad.
Claim 24
Dependent Claim
34 words
The method as claimed in claim 19 and wherein: the metal wire is attached to the substrate at an acute angle with respect to a plane of the substrate to provide the compliant structure.
Claim 25
Dependent Claim
33 words
The method as claimed in claim 19 and further comprising: heating and shaping the metal wire with a spring segment as it is attached to the solder pad to provide the compliant structure.
Claim 26
Dependent Claim
21 words
The method as claimed in claim 19 and further comprising: forming a contact ball on an end of the metal wire.
Claim 27
Dependent Claim
29 words
The method as claimed in claim 19 and wherein: heating the metal wire is with a laser and shaping the metal wire is by manipulating a wire bonding tool.
Claim 28
Dependent Claim
21 words
The method as claimed in claim 19 and wherein: heating and shaping the metal wire is with a heated capillary tool.
Claim 29
Independent Claim
118 words
A method for forming a contact structure on a semiconductor die having a plurality of die pads in electrical communication with integrated circuitry formed on the die, said method comprising: forming a mask on the substrate having an opening aligned with the die pads; forming a shorting layer on the substrate to electrically connect the die pads; forming welding pads in the openings in electrical contact with the die pads; attaching metal wires to the welding pads using a welding process; heating and shaping the metal wires during the welding process into a compliant structure; severing the metal wire to form contact pins; and removing the shorting layer except in an area in contact with the welding pads.
Claim 30
Independent Claim
118 words
A method for forming a contact structure on a semiconductor die having a plurality of die pads in electrical communication with integrated circuitry formed on the die, said method comprising: forming a mask on the substrate having an opening aligned with the die pads; forming a shorting layer on the substrate to electrically connect the die pads; forming welding pads in the openings in electrical contact with the die pads; attaching metal wires to the welding pads using a welding process; heating and shaping the metal wires during the welding process into a compliant structure; severing the metal wire to form contact pins; and removing the shorting layer except in an area in contact with the welding pads.
Claim 31
Dependent Claim
29 words
The method as claimed in claim 25 and wherein: the metal wires are attached to the substrate at an acute angle with respect to a plane of the substrate.
Claim 32
Dependent Claim
24 words
The method as claimed in claim 25 and wherein: the contact pins are formed with a spring segment during the heating and shaping step.
Claim 33
Dependent Claim
20 words
The method as claimed in claim 25 and further comprising: forming a ball on an end of the contact pins.
Claim 34
Dependent Claim
17 words
The method as claimed in claim 25 and wherein: heating the metal wire is with a laser.
Claim 35
Dependent Claim
21 words
The method as claimed in claim 25 and wherein: heating and shaping the metal wire is with a heated capillary tool.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-05 | 1999-09-04 | 2000-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-05 | 2003-09-04 | 2004-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-05 | 2007-09-04 | 2008-03-05 | $7700.00 | Window Closed / Lapsed |