Bonding method

Abstract

Abstract PURPOSE:To improve workability, by detecting a metal fine-wire end drawing out of a capillary end after cutoff, vibrating the fine-wire by a detecting signal, and drawing out to form a ball. CONSTITUTION:A capillary 4 and a clamp 5 are drawn up to a designated position after connecting a wire 6 to the second junction region 7a. Junction regions 7a, 3a and a semiconductor chip 3 are electrified through the wire 6. The wire 6 further than the junction is checked for cracks. When there is a defect and the wire 6 is cut off at the next process, the wire end goes into the capillary and no ball is formed at the end. In such a condition, the clamp 5 is given ultrasonic vibration, and the wire 6 contained between the clamp 5 and capillary 4 is drawn out to a designated length. A ball 6a is made at its end by hydrogen burner 8. This constitution enhances the workability, becuase the ball is formed rapidly to transfer to the next process even if there is a defect at the wire at locations further than the junction.

Inventors

• 👤 Kenji Miyajima
• 👤 宮島　賢治

Bibliographic Details