Patent US6353328B2 successfully refreshed from Google Patents.
US6353328B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test system with mechanical alignment for semiconductor chip scale packages and dice
Assignee: Micron Technology Inc
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Filing: 2000-12-20
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Granted: 2002-03-05
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Expires: 2020-12-20
Abstract
Abstract A test system for testing semiconductor components, such as bumped dice and chip scale packages, is provided. The test system includes a base for retaining one or more components, and an interconnect for making temporary electrical connections with the components. The test system also includes an alignment fixture having an alignment surface for aligning the components to the interconnect. In addition, the components can include alignment members, such as beveled edges, bumps, or posts configured to interact with the alignment surface. The alignment fixture can be formed as a polymer layer, such as a layer of resist, which is deposited, developed and then cured using a wafer level fabrication process. The alignment surface can be an opening in the polymer layer configured to engage edges of the components, or alternately to engage the alignment members.
Inventors
- 👤 Salman Akram
- 👤 Warren M. Farnworth
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:32
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
96 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of external contacts and at least one alignment member having a height relative to a surface of the component; an interconnect comprising a plurality of contact members configured to make non-bonded electrical connections with the external contacts and an indentation configured to receive the at least one alignment member to align the external contacts to the contact members; and an alignment fixture on the interconnect comprising a surface configured to contact and align the component such that the indentation receives the alignment member.
Claim 2
Dependent Claim
96 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of external contacts and at least one alignment member having a height relative to a surface of the component; an interconnect comprising a plurality of contact members configured to make non-bonded electrical connections with the external contacts and an indentation configured to receive the at least one alignment member to align the external contacts to the contact members; and an alignment fixture on the interconnect comprising a surface configured to contact and align the component such that the indentation receives the alignment member.
Claim 3
Dependent Claim
16 words
The test system of claim 1 wherein the at least one alignment member comprises a post.
Claim 4
Dependent Claim
19 words
The test system of claim 1 wherein the surface is configured to contact the at least one alignment member.
Claim 5
Dependent Claim
26 words
The test system of claim 1 wherein the at least one alignment member comprises a plurality of posts located proximate to an edge of the component.
Claim 6
Dependent Claim
109 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of contact bumps having a first height and a plurality of alignment members having a second height greater than the first height; an interconnect comprising a plurality of first indentations at least partially covered with conductive layers configured to retain and electrically contact the contact bumps, and a plurality of second indentations configured to receive the alignment members to align the contact bumps to the first indentations; and an alignment fixture on the interconnect comprising an opening having a surface configured to contact and align the component such that the second indentations receive the alignment members.
Claim 7
Dependent Claim
109 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of contact bumps having a first height and a plurality of alignment members having a second height greater than the first height; an interconnect comprising a plurality of first indentations at least partially covered with conductive layers configured to retain and electrically contact the contact bumps, and a plurality of second indentations configured to receive the alignment members to align the contact bumps to the first indentations; and an alignment fixture on the interconnect comprising an opening having a surface configured to contact and align the component such that the second indentations receive the alignment members.
Claim 8
Dependent Claim
18 words
The test system of claim 5 wherein the alignment members comprise posts and the surface contacts the posts.
Claim 9
Dependent Claim
16 words
The test system of claim 5 wherein the alignment members comprise a polymer or a metal.
Claim 10
Dependent Claim
24 words
The test system of claim 5 wherein the component comprises an element selected from the group consisting of semiconductor packages and bumped semiconductor dice.
Claim 11
Dependent Claim
21 words
The test system of claim 5 wherein the alignment members have a generally rectangular cross section with a convex tip portion.
Claim 12
Dependent Claim
114 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of contact bumps, each contact bump having a first height, and a plurality of alignment members, each alignment member having a second height greater than the first height; an interconnect comprising a plurality of contact members configured to electrically contact the contact bumps and a plurality of indentations configured to receive the alignment members; and an alignment fixture on the interconnect comprising an opening with a surface configured to contact at least some of the alignment members to align the component on the interconnect such that the indentations receive the alignment members and the contact bumps electrically contact the contact members.
Claim 13
Dependent Claim
114 words
A test system for semiconductor components comprising: a semiconductor component comprising a plurality of contact bumps, each contact bump having a first height, and a plurality of alignment members, each alignment member having a second height greater than the first height; an interconnect comprising a plurality of contact members configured to electrically contact the contact bumps and a plurality of indentations configured to receive the alignment members; and an alignment fixture on the interconnect comprising an opening with a surface configured to contact at least some of the alignment members to align the component on the interconnect such that the indentations receive the alignment members and the contact bumps electrically contact the contact members.
Claim 14
Dependent Claim
13 words
The test system of claim 10 wherein the alignment fixture comprises adhesive tape.
Claim 15
Dependent Claim
12 words
The test system of claim 10 wherein the alignment fixture comprises resist.
Claim 16
Dependent Claim
13 words
The test system of claim 10 wherein the alignment members comprise a polymer.
Claim 17
Dependent Claim
27 words
The test system of claim 10 wherein the alignment members comprise a material selected from the group consisting of solder, nickel, copper, beryllium copper, and a polymer.
Claim 18
Dependent Claim
12 words
The test system of claim 10 wherein the alignment members comprise posts.
Claim 19
Dependent Claim
23 words
The test system of claim 10 wherein the alignment members comprise posts having a generally rectangular cross section and a convex tip portion.
Claim 20
Dependent Claim
100 words
A test system for a semiconductor component having a plurality of contact bumps with a first height comprising: at least one alignment post on the component having a second height relative to a surface of the component that is greater than the first height; an interconnect comprising a plurality of contact members configured to make temporary electrical connections with the contact bumps and an indentation configured to receive the at least one alignment post; and an alignment fixture on the interconnect comprising an opening configured to contact and align the at least one alignment post for reception by the indentation.
Claim 21
Dependent Claim
100 words
A test system for a semiconductor component having a plurality of contact bumps with a first height comprising: at least one alignment post on the component having a second height relative to a surface of the component that is greater than the first height; an interconnect comprising a plurality of contact members configured to make temporary electrical connections with the contact bumps and an indentation configured to receive the at least one alignment post; and an alignment fixture on the interconnect comprising an opening configured to contact and align the at least one alignment post for reception by the indentation.
Claim 22
Dependent Claim
21 words
The test system of claim 17 further comprising a plurality of alignment posts on the component proximate to peripheral edges thereof.
Claim 23
Dependent Claim
14 words
The test system of claim 17 wherein the alignment fixture comprises a cured material.
Claim 24
Dependent Claim
18 words
The test system of claim 17 wherein the alignment fixture comprises one or more layers of adhesive tape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-04 | 2005-09-03 | 2006-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-04 | 2009-09-03 | 2010-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-04 | 2013-09-03 | 2014-03-05 | $7700.00 | Window Closed / Lapsed |