Patent US6288905B1 successfully refreshed from Google Patents.
US6288905B1
Expired / Lapsed
US
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Contact module, as for a smart card, and method for making same
Assignee: Avante International Technology Inc
•
Filing: 1999-10-04
•
Granted: 2001-09-11
•
Expires: 2019-10-04
Abstract
Abstract A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a second surface and electrically-conductive vias built up on the first surface of the metal contacts. A layer of dielectric adhesive on the first surface of the pattern of metal contacts surrounds the electrically-conductive vias except the ends thereof distal from the metal contacts. An electronic device has electrical contacts connected to the exposed ends of the conductive vias, as by wire bonds or by flip-chip type connections. The module is preferably made by forming a pattern of conductive vias on the first surface of a sheet of electrical contact material, the pattern of vias corresponding to the pattern of contacts of an electronic device; applying dielectric adhesive on the first surface of the sheet of electrical material except in locations corresponding to the vias; patterning the sheet of electrical material to define a pattern of electrical contacts thereon, wherein ones of the electrical contacts are associated with at least corresponding ones of the vias; and attaching the electronic device with the contacts of the electronic device electrically connected to corresponding vias.
Inventors
- 👤 Kevin Kwong-Tai Chung
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:28
CPC Classifications
B; B32; B32B; B32B37/00; B32B37/14; B32B37/16; B32B37/20; B32B37/203; B32B3/00; B32B3/02; B32B3/08; B32B33/00; B32B7/00; B32B7/04; B32B7/12; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07743; G06K19/07745; G06K19/07747; H; H01; H01Q; H01Q1/00; H01Q1/12; H01Q1/22; H01Q1/2208; H01Q1/2225; H01Q1/36; H01Q1/38; H01Q23/00; H01Q7/00; H01Q7/005; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/65; H10W70/67; H10W70/688; H10W70/699; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; B32B2425/00; B32B2429/00; B32B2519/00; B32B2519/02; H05K1/03; H05K1/0393; H05K1/16; H05K1/165; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/14; H05K2203/1453; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/60; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/20; H10W90/22; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
130 words
A module having exposed contacts comprising: a pattern of sheet metal contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of sheet metal contacts and having at least two holes therethrough to the first surface of said sheet metal contacts; at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the first surface of the sheet metal contacts, each conductive via having an end distal from the first surface of said sheet metal contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 2
Dependent Claim
130 words
A module having exposed contacts comprising: a pattern of sheet metal contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of sheet metal contacts and having at least two holes therethrough to the first surface of said sheet metal contacts; at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the first surface of the sheet metal contacts, each conductive via having an end distal from the first surface of said sheet metal contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 3
Dependent Claim
16 words
The module of claim 1 wherein said conductive vias comprise metal deposited onto said metal contacts.
Claim 4
Dependent Claim
19 words
The module of claim 2 wherein said conductive vias and said metal contacts are formed of the same metal.
Claim 5
Dependent Claim
36 words
The module of claim 3 wherein said metal is selected from the group consisting of copper, aluminum, nickel, kovar, alloy 42, beryllium copper, brass, copper-based alloys, iron-based alloys, and combinations and alloys thereof, and laminates thereof.
Claim 6
Dependent Claim
51 words
The module of claim 4 further comprising a metal coating on the second surface of said metal contacts and on the distal end of said conductive vias, wherein said metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 7
Dependent Claim
28 words
The module of claim 2 wherein said metal of said conductive vias is plated metal deposited by one of chemical plating, immersion coating, electrolytic plating, and electroless plating.
Claim 8
Dependent Claim
17 words
The module of claim 1 wherein said conductive vias comprise electrically-conductive adhesive deposited onto said metal contacts.
Claim 9
Dependent Claim
13 words
The module of claim 7 wherein said electrically-conductive adhesive is a flexible adhesive.
Claim 10
Dependent Claim
20 words
The module of claim 1 wherein said conductive vias are formed in said holes in said layer of dielectric adhesive.
Claim 11
Dependent Claim
33 words
The module of claim 1 wherein the contacts of said electronic device are connected to said conductive vias by a connection selected from the group consisting of electrically-conductive adhesive, solder and wire bonding.
Claim 12
Dependent Claim
21 words
The module of claim 1 wherein said electronic device is attached to said dielectric adhesive layer by an insulating adhesive underfill.
Claim 13
Dependent Claim
22 words
The module of claim 1 wherein said electronic device is encapsulated on said dielectric adhesive layer by a high melt flow adhesive.
Claim 14
Dependent Claim
35 words
The module of claim 1 wherein said electronic device is attached to said dielectric adhesive layer by an insulating adhesive underfill and is encapsulated on said dielectric adhesive layer by a high melt flow adhesive.
Claim 15
Dependent Claim
174 words
A contact module having exposed contacts and including at least one electronic device comprising: a sheet metal layer having a first surface and an exposed second surface, said sheet metal layer having openings therethrough defining a pattern of at least two exposed sheet metal contacts; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said sheet metal layer, said dielectric adhesive layer having at least two holes therethrough each to the first surface of one of said at least two sheet metal contacts, respectively; at least two electrically-conductive vias substantially filling the at least two holes of said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the respective first surfaces of the at least two sheet metal contacts, each electrically-conductive via having an end distal from said sheet metal layer; and means for connecting at least two contacts of the at least one electronic device each to a respective distal end of one of said electrically-conductive vias.
Claim 16
Dependent Claim
174 words
A contact module having exposed contacts and including at least one electronic device comprising: a sheet metal layer having a first surface and an exposed second surface, said sheet metal layer having openings therethrough defining a pattern of at least two exposed sheet metal contacts; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said sheet metal layer, said dielectric adhesive layer having at least two holes therethrough each to the first surface of one of said at least two sheet metal contacts, respectively; at least two electrically-conductive vias substantially filling the at least two holes of said dielectric adhesive layer and including a layer of an oxidation resistant metal contacting the respective first surfaces of the at least two sheet metal contacts, each electrically-conductive via having an end distal from said sheet metal layer; and means for connecting at least two contacts of the at least one electronic device each to a respective distal end of one of said electrically-conductive vias.
Claim 17
Dependent Claim
17 words
The contact module of claim 14 wherein said electrically-conductive vias comprise metal deposited onto said metal layer.
Claim 18
Dependent Claim
46 words
The contact module of claim 15 wherein said electrically-conductive vias and said metal layer are of the same metal selected from the group consisting of copper, aluminum, nickel, kovar, alloy 42, beryllium copper, brass, copper-based alloys, iron-based alloys, and combinations and alloys thereof, and laminates thereof.
Claim 19
Dependent Claim
28 words
The contact module of claim 15 wherein said deposited metal of said electrically-conductive vias is deposited by one of chemical plating, immersion coating, electrolytic plating, and electroless plating.
Claim 20
Dependent Claim
18 words
The contact module of claim 14 wherein said electrically-conductive vias comprise electrically-conductive adhesive deposited onto said metal layer.
Claim 21
Dependent Claim
51 words
The contact module of claim 14 further comprising a metal coating on the second surface of said metal contacts and on the distal end of said electrically-conductive vias, said metal coating including at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 22
Dependent Claim
26 words
The contact module of claim 14 wherein said electrically-conductive vias are formed in the holes in said layer of dielectric adhesive by depositing electrically-conductive adhesive therein.
Claim 23
Dependent Claim
33 words
The contact module of claim 14 wherein said electrically-conductive vias are formed in the holes in said layer of dielectric adhesive by depositing metal onto the first surface of said metal contacts therein.
Claim 24
Dependent Claim
25 words
The contact module of claim 14 wherein said means for connecting includes connections selected from the group consisting of electrically-conductive adhesive, solder and wire bonding.
Claim 25
Dependent Claim
24 words
The contact module of claim 14 further comprising an insulating adhesive underfill attaching said at least one electronic device to said dielectric adhesive layer.
Claim 26
Dependent Claim
22 words
The contact module of claim 14 further comprising a high melt flow adhesive encapsulating said electronic device on said dielectric adhesive layer.
Claim 27
Dependent Claim
36 words
The contact module of claim 14 further comprising an insulating adhesive underfill attaching said electronic device to said dielectric adhesive layer and a high melt flow adhesive encapsulating said electronic device on said dielectric adhesive layer.
Claim 28
Dependent Claim
151 words
A module comprising: a pattern of metal foil contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts; a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes; at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 29
Dependent Claim
151 words
A module comprising: a pattern of metal foil contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts; a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes; at least two electrically-conductive vias substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 30
Dependent Claim
30 words
The module of claim 26 wherein said oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 31
Dependent Claim
60 words
The module of claim 26 further comprising an oxidation resistant metal coating on the at least one of the second surface of said metal foil contacts and the distal end of said conductive vias, wherein said oxidation resistant metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 32
Dependent Claim
153 words
A module comprising: a pattern of metal foil contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts; a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes; at least two vias of electrically-conductive adhesive substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 33
Dependent Claim
153 words
A module comprising: a pattern of metal foil contacts having a first surface and an exposed second surface; a layer of at least one of a B-staged thermoplastic and a cured thermosetting dielectric adhesive on the first surface of said pattern of metal foil contacts and having at least two holes therethrough to the first surface of said metal foil contacts; a layer of an oxidation resistant metal on the first surface of said metal foil contacts at least at the locations of the at least two holes; at least two vias of electrically-conductive adhesive substantially filling the holes in said dielectric adhesive layer and contacting the oxidation resistant metal on the first surface of the metal foil contacts, each conductive via having an end distal from the first surface of said metal foil contacts; and at least one electronic device having electrical contacts connected to the distal end of said conductive vias.
Claim 34
Dependent Claim
14 words
The module of claim 29 wherein said electrically-conductive adhesive is a flexible electrically-conductive adhesive.
Claim 35
Dependent Claim
30 words
The module of claim 29 wherein said oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 36
Dependent Claim
60 words
The module of claim 29 further comprising an oxidation resistant metal coating on the at least one of the second surface of said metal foil contacts and the distal end of said conductive vias, wherein said oxidation resistant metal coating includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 37
Independent Claim
213 words
A method for making a module including an electronic device comprising: providing a sheet of electrical contact material having first and second surfaces; providing an electronic device having a pattern of contacts thereon; applying a layer of at least one of a thermoplastic and a thermosetting dielectric adhesive on the first surface of the sheet of electrical contact material except in locations corresponding to locations of electrically-conductive vias, whereby the layer of dielectric adhesive has blind holes to the sheet of electrical contact material in locations corresponding to the locations of electrically conductive vias; one of B-staging and curing the layer of dielectric adhesive; forming a pattern of electrically-conductive vias on the first surface of the sheet of electrical contact material in the blind holes of the layer of dielectric adhesive, the pattern of electrically-conductive vias corresponding to the pattern of contacts of the electronic device; patterning the sheet of electrical contact material to define a pattern of exposed electrical contacts thereon after said one of B-staging and curing the layer of dielectric adhesive, wherein ones of the exposed electrical contacts are associated with at least corresponding ones of the electrically-conductive vias; and attaching the electronic device with the contacts of the electronic device electrically connected to corresponding ones of the electrically-conductive vias.
Claim 38
Independent Claim
213 words
A method for making a module including an electronic device comprising: providing a sheet of electrical contact material having first and second surfaces; providing an electronic device having a pattern of contacts thereon; applying a layer of at least one of a thermoplastic and a thermosetting dielectric adhesive on the first surface of the sheet of electrical contact material except in locations corresponding to locations of electrically-conductive vias, whereby the layer of dielectric adhesive has blind holes to the sheet of electrical contact material in locations corresponding to the locations of electrically conductive vias; one of B-staging and curing the layer of dielectric adhesive; forming a pattern of electrically-conductive vias on the first surface of the sheet of electrical contact material in the blind holes of the layer of dielectric adhesive, the pattern of electrically-conductive vias corresponding to the pattern of contacts of the electronic device; patterning the sheet of electrical contact material to define a pattern of exposed electrical contacts thereon after said one of B-staging and curing the layer of dielectric adhesive, wherein ones of the exposed electrical contacts are associated with at least corresponding ones of the electrically-conductive vias; and attaching the electronic device with the contacts of the electronic device electrically connected to corresponding ones of the electrically-conductive vias.
Claim 39
Dependent Claim
17 words
The method of claim 33 further comprising encapsulating the electronic device to the layer of dielectric adhesive.
Claim 40
Dependent Claim
25 words
The method of claim 34 wherein said encapsulating includes applying a high melt flow adhesive by one of roll coating, screen printing, stenciling and laminating.
Claim 41
Dependent Claim
21 words
The method of claim 33 wherein said forming a pattern of electrically-conductive vias precedes said applying a layer of dielectric adhesive.
Claim 42
Dependent Claim
21 words
The method of claim 33 wherein said applying a layer of dielectric adhesive precedes said forming a pattern of electrically-conductive vias.
Claim 43
Dependent Claim
22 words
The method of claim 33 wherein said forming a pattern of electrically-conductive vias precedes said patterning the sheet of electrical contact material.
Claim 44
Dependent Claim
22 words
The method of claim 33 wherein said patterning the sheet of electrical contact material precedes said forming a pattern of electrically-conductive vias.
Claim 45
Dependent Claim
29 words
The method of claim 33 wherein said forming a pattern of electrically-conductive vias includes building up metal vias on the first surface of the sheet of electrical contact material.
Claim 46
Dependent Claim
21 words
The method of claim 40 wherein said building up includes one of chemical plating, immersion coating, electrolytic plating, and electroless plating.
Claim 47
Dependent Claim
29 words
The method of claim 33 wherein said forming a pattern of electrically-conductive vias includes depositing electrically-conductive adhesive vias on the first surface of the sheet of electrical contact material.
Claim 48
Dependent Claim
22 words
The method of claim 42 wherein said depositing includes one of roll coating, screen printing, stenciling, mask printing, ink-jet printing and laminating.
Claim 49
Dependent Claim
28 words
The method of claim 33 wherein said applying a layer of dielectric adhesive includes applying an electrically-insulating adhesive by one of roll coating, screen printing, stenciling and laminating.
Claim 50
Dependent Claim
33 words
The method of claim 33 wherein said patterning the sheet of electrical contact material includes patterning a photoresist on the sheet of electrical contact material and etching the sheet of electrical contact material.
Claim 51
Dependent Claim
44 words
The method of claim 33 further comprising coating at least one of the pattern of electrical contacts and the electrically-conductive vias with a metal including at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
Claim 52
Dependent Claim
54 words
The method of claim 33 wherein said attaching the electronic device includes applying an electrically-conductive adhesive to the electrically-conductive vias or to the contacts of the electronic device, and positioning the electronic device such that corresponding ones of the electrically-conductive vias and contacts of the electronic device are joined together by the electrically-conductive adhesive.
Claim 53
Dependent Claim
44 words
The method of claim 33 further comprising, prior to said forming a pattern of electrically-conductive vias, coating at least the locations corresponding to the locations of electrically-conductive vias on the first surface of the sheet of electrical contact material with an oxidation resistant metal.
Claim 54
Dependent Claim
30 words
The method of claim 48 wherein the oxidation resistant metal includes at least one of nickel, tin, silver, gold, platinum, palladium, nickel-palladium, nickel-gold, a combination thereof, and an alloy thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-10 | 2005-03-12 | 2005-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-10 | 2009-03-12 | 2009-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-10 | 2013-03-12 | 2013-09-11 | $7700.00 | Window Closed / Lapsed |