Abstract A method for manufacturing a multichip package including the steps of forming a first polyimide insulating layer on a surface of a ceramic multilayer substrate having a circuit wiring therein, forming a first wiring connected to the circuit wiring of the multilayer substrate with a part of the first wiring being exposed at an open surface of the first polyimide insulating layer, forming a second polyimide insulating layer on a surface of a semiconductor element, and forming a second wiring connected with a circuit wiring of the semiconductor element in the second polyimide insulating layer with a part of the second wiring being exposed at an open surface of the second polyimide insulating layer. The method also includes positioning the semiconductor element on the substrate such that the part of the first wiring and the part of the second wiring oppose each other, and applying a predetermined pressure and a predetermined temperature in a predetermined gas atmosphere for a predetermined time period to cause the first and second polyimide layers to be cured and bonded with each other and to cause the parts of first and second wirings to be adhered to each other by thermal bonding.
A method for manufacturing a multichip package comprising the steps of: forming a first polyimide insulating layer on a surface of a ceramic multilayer substrate having a circuit wiring therein; forming a first wiring connected to said circuit wiring of said multilayer substrate with a part of said first wiring being exposed at an open surface of said first polyimide insulating layer; forming a second polyimide insulating layer on a surface of a semiconductor element; forming a second wiring connected with a circuit wiring of said semiconductor element in said second polyimide insulating layer with a part of said second wiring being exposed at an open surface of said second polyimide insulating layer; positioning said semiconductor element on said substrate such that said part of said first wiring and said part of said second wiring oppose to each other; and applying a predetermined pressure and a predetermined temperature in a predetermined gas atmosphere for a predetermined time period to cause said first and second polyimide insulating layers to be cured and bonded with each other and to cause the parts of said first and second wiring to be connected to each other by thermocompression bonding.
Claim 2
Independent Claim
195 words
A method for manufacturing a multichip package comprising the steps of: forming a first polyimide insulating layer on a surface of a ceramic multilayer substrate having a circuit wiring therein; forming a first wiring connected to said circuit wiring of said multilayer substrate with a part of said first wiring being exposed at an open surface of said first polyimide insulating layer; forming a second polyimide insulating layer on a surface of a semiconductor element; forming a second wiring connected with a circuit wiring of said semiconductor element in said second polyimide insulating layer with a part of said second wiring being exposed at an open surface of said second polyimide insulating layer; positioning said semiconductor element on said substrate such that said part of said first wiring and said part of said second wiring oppose to each other; and applying a predetermined pressure and a predetermined temperature in a predetermined gas atmosphere for a predetermined time period to cause said first and second polyimide insulating layers to be cured and bonded with each other and to cause the parts of said first and second wiring to be connected to each other by thermocompression bonding.
Claim 3
Dependent Claim
26 words
A method accoding to claim 1, wherein said first and second wiring are made of gold, respectively, and bonded to each other by gold-to-gold thermocompression bonding.