Encapsulation of electronic modules

Claim 1

AN ENCAPSULATED PACKAGE HAVING CIRCUITRY PERFORMING PARTICULAR ELECTRONIC FUNCTINS, SAID PACKAGE COMPRISING: A SUBSTRATE OF AN INERT MATERIAL HAVING A PLURALITY OF APERTURES EXTENDING THERETHROUGH, A PLURALITY OF CONDUCTIVE PINS, EACH OF WHICH IS INSERTED IN A PARTICULAR ONE IN SAID APERTURES, A MICROELECTRONIC CIRCUIT MOUNTED ON AT LEAST ONE SURFACE OF SAID SUBSTRATE INCLUDING CONDUCTIVE LANDS MOUNTED ON SAID SURFACE AND CONNECTED TO SAID CONDUCTIVE PINS, AT LEAST ONE RESISTOR OF A PRINTED THIN FILM OF RESISTIVE MATERIAL ASSOCIATED WITH SAID LANDS, AND AT LEAST ONE SEMICONDUCTOR DEVICE HAVING AT LEAST TWO CONTACT ELEMENTS WHICH ARE JOINED TO SAID CONDUCTIVE LANDS, A CONFORMAL COATING OF A NONSTRESS CHEMICALLY INERT SILICONE GEL DEPOSITED OVER SAID SURFACE AND COVERING SAID MICROELECTRONIC CIRCUIT, A METALLIC COVER HAVING A CONFIGURATION ADAPTED TO RECEIVE SAID SUBSTRATE AND INTO WHICH SAID SUBSTRATE IS INSERTED WITH SAID MICROELECTRONIC CIRCUIT RESIDING IN THE INTERIOR THEREOF, SAID COVER BEING INDENTED AT PARTICULAR POINTS TO SECURE SAID COVER TO SAID SUBSTRATE, AND A BACK SEAL LAYER OF CURED RUBBER-TYPE MATERIAL DISPOSED OVER THE SURFACE OF SAID SUBSTRATE OPPOSITE SAID ONE SURFACE ON WHICH SAID SEMICONDUCTOR IS MOUNTED, SAID BACK SEAL EXTENDING COMPLETELY OVER SAID OPPOSITE SURFACE AND INTO CONTACT WITH THE WALLS OF SAID METAL COVER SO AS TO PREVENT WATER VAPOR AND OTHER NOXIOUS INDUSTRIAL VAPORS FROM PENETRATING INTO THE REGION OF SAID MICROELECTRONIC CIRCUIT.