US4698662A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multichip thin film module
Assignee: AMI Semiconductor Inc
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Filing: 1985-02-05
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Granted: 1987-10-06
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Expires: 2005-02-05
Abstract
Abstract A package for thermal dissipation of heat from multiple integrated circuit chips is described. The package includes a silicon substrate for electrical connection to silicon integrated-circuit chips. The silicon substrate provides a high degree of thermal dissipation of heat generated by the chips. In addition, the invention comprehends that the silicon substrate is attached to a heat dissipating means. In the preferred embodiment, the heat dissipating means includes a metal heat sink. The package is capable of dissipating up to six watts per square centimeter of heat from the chips.
Inventors
- 👤 Peter L. Young
- 👤 Chiu-Chao Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/698; H10W40/00; H10W40/20; H10W40/25; H10W40/253; H10W70/611; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
64 words
A package having improved heat dissipation comprising: a silicon substrate having a first surface and a second surface; a plurality of thin film interconnect conductors formed in planes and disposed on said first substrate surface; a plurality of silicon chips in thermal communication with said first substrate surface; and a heat sink disposed on said second substrate surface and being in thermal contact therewith.
Claim 2
Dependent Claim
64 words
A package having improved heat dissipation comprising: a silicon substrate having a first surface and a second surface; a plurality of thin film interconnect conductors formed in planes and disposed on said first substrate surface; a plurality of silicon chips in thermal communication with said first substrate surface; and a heat sink disposed on said second substrate surface and being in thermal contact therewith.
Claim 3
Dependent Claim
17 words
The package of claim 1 wherein said silicon chips are disposed on said plurality of interconnect planes.
Claim 4
Dependent Claim
58 words
The package of claim 2 further comprising: a first layer of thermal adhesive between said silicon chips and said plurality of interconnect planes for bonding said silicon chips to said plurality of interconnect planes; and a second layer of thermal adhesive between said second substrate surface and said heat sink for bonding said substrate to said heat sink.
Claim 5
Dependent Claim
24 words
The package of claim 1 wherein said heat sink is formed of a material selected from the group consisting of copper, molybdenum, and aluminum.
Claim 6
Dependent Claim
26 words
The package of claim 1 wherein said plurality of interconnect planes includes a plurality of cavities and wherein said silicon chips are disposed within said cavities.
Claim 7
Dependent Claim
25 words
The package of claim 5 wherein said cavities are of a size to permit said silicon chips to be disposed on said first substrate surface.
Claim 8
Dependent Claim
54 words
The package of claim 6 further comprising: a first layer of thermal adhesive between said silicon chips and said first substrate surface for bonding said silicon chips to said substrate; and a second layer of thermal adhesive between said second substrate surface and said heat sink for bonding said substrate to said heat sink.
Claim 9
Dependent Claim
13 words
The package of claim 3 wherein said thermal adhesive comprises a thermal epoxy.
Claim 10
Dependent Claim
13 words
The package of claim 7 wherein said thermal adhesive comprises a thermal epoxy.
Claim 11
Dependent Claim
34 words
The package of claim 2 further comprising a plurality of solder bumps disposed between said silicon chips and said plurality of interconnect planes for connecting said silicon chips to said plurality of interconnect planes.
Claim 12
Dependent Claim
30 words
The package of claim 10 further comprising a first layer of thermal adhesive between said second substrate surface and said heat sink for bonding said substrate to said heat sink.
Claim 13
Dependent Claim
13 words
The package of claim 11 wherein said thermal adhesive comprises a thermal epoxy.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-05 | 1991-04-06 | 1991-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-05 | 1995-04-06 | 1995-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-05 | 1999-04-06 | 1999-10-06 | $7700.00 | Window Closed / Lapsed |