US4546478A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser
Assignee: Panasonic Holdings Corp
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Filing: 1984-05-25
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Granted: 1985-10-08
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Expires: 2004-05-25
Abstract
Abstract A mounting of semiconductor laser chip on a heat sink or metal mount is improved so as to enable high accuracy of position and direction. A heat sink or metal mount, on which a semiconductor laser chip is mounted, comprises two parts, namely a main mount or larger portion and a sub-mount or smaller portion. The semiconductor laser chip is soldered by a solder layer on the sub-mount utilizing a microscope so as to assure an accurate position and an accurate direction with respect to the sub-mount. Then, the sub-mount is soldered on the main mount by a solder layer with an accurate relation both in position and direction by engaging a linear ridge as a first engaging means provided on the upper face of the main mount with a straight groove and a rear end face as a second engaging means, or by engaging a square recess as a first engaging means and the square bottom of the sub-mount as a second engaging means with each other. As a result of the above-mentioned structure, accurate position and direction of the semiconductor laser chip with respect to the mount is easily obtainable with a high yield.
Inventors
- 👤 Hirokazu Shimizu
- 👤 Kunio Itoh
- 👤 Takashi Sugino
- 👤 Masaru Wada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 21:28
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/02326; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/90; H10W72/931
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
148 words
A semiconductor laser comprising: a semiconductor laser chip, a sub-mount having an upper surface on which said semiconductor laser chip is bonded by means of a solder layer, a main mount on which said sub-mount is boned by means of another solder layer, wherein the improvement is that said main mount is provided with a recess as engaging means to receive said sub-mount therein, said recess comprising flat side walls, a flat abutting wall and a flat bottom surface, said sub-mount is provided with flat side walls, a flat abutting rear end face and a flat under surface opposite to said sub-mount upper surface, and said sub-mount is bonded on said main mount in a manner so that said side walls, said abutting rear end face and said under surface of said sub-mount engage said side walls, said abutting wall and said bottom surface of said recess, respectively.
Claim 2
Dependent Claim
148 words
A semiconductor laser comprising: a semiconductor laser chip, a sub-mount having an upper surface on which said semiconductor laser chip is bonded by means of a solder layer, a main mount on which said sub-mount is boned by means of another solder layer, wherein the improvement is that said main mount is provided with a recess as engaging means to receive said sub-mount therein, said recess comprising flat side walls, a flat abutting wall and a flat bottom surface, said sub-mount is provided with flat side walls, a flat abutting rear end face and a flat under surface opposite to said sub-mount upper surface, and said sub-mount is bonded on said main mount in a manner so that said side walls, said abutting rear end face and said under surface of said sub-mount engage said side walls, said abutting wall and said bottom surface of said recess, respectively.
Claim 3
Dependent Claim
128 words
A semiconductor laser comprising: a semiconductor laser chip, a sub-mount on which said semiconductor laser chip is bonded, a main-mount on which said sub-mount is bonded, wherein the improvement is that said sub-mount has first, second and third generally planar faces arranged at angles to each other, said main-mount has first, second and third generally planar faces arranged at angles to each other, said sub-mount is determined of position in a first direction by touching said first face of said sub-mount to said first face of said main-mount, is determined of position in a second direction by touching said second face of said sub-mount to said second face of said main-mount, and is determined of position in a third direction by touching said third face of said main-mount.
Claim 4
Dependent Claim
128 words
A semiconductor laser comprising: a semiconductor laser chip, a sub-mount on which said semiconductor laser chip is bonded, a main-mount on which said sub-mount is bonded, wherein the improvement is that said sub-mount has first, second and third generally planar faces arranged at angles to each other, said main-mount has first, second and third generally planar faces arranged at angles to each other, said sub-mount is determined of position in a first direction by touching said first face of said sub-mount to said first face of said main-mount, is determined of position in a second direction by touching said second face of said sub-mount to said second face of said main-mount, and is determined of position in a third direction by touching said third face of said main-mount.
Claim 5
Dependent Claim
20 words
A semiconductor laser in accordance with claim 2, wherein said first, second and third directions are perpendicular to each other.
Claim 6
Dependent Claim
29 words
A semiconductor laser in accordance with claim 2, wherein said first, second and third faces are formed as side walls and a bottom of a recess in said main-mount.
Claim 7
Dependent Claim
142 words
A semiconductor laser comprising: a semiconductor laser chip; a sub-mount having an upper surface on which said semiconductor laser chip is bonded by means of a solder layer, a main mount on which said sub-mount is bonded by means of another solder layer, wherein the improvement is that said main mount is provided with a recess as engaging means to receive said sub-mount therein, said recess comprising side walls, an abutting wall and a bottom surface, said sub-mount is provided with side walls, an abutting rear end face and an under surface opposite to said sub-mount upper surface, and said sub-mount is bonded on said main mount in a manner so that said side walls, said abutting rear end face and said under surface of said sub-mount engage said side walls, said abutting wall and said bottom surface of said recess, respectively.
Claim 8
Dependent Claim
142 words
A semiconductor laser comprising: a semiconductor laser chip; a sub-mount having an upper surface on which said semiconductor laser chip is bonded by means of a solder layer, a main mount on which said sub-mount is bonded by means of another solder layer, wherein the improvement is that said main mount is provided with a recess as engaging means to receive said sub-mount therein, said recess comprising side walls, an abutting wall and a bottom surface, said sub-mount is provided with side walls, an abutting rear end face and an under surface opposite to said sub-mount upper surface, and said sub-mount is bonded on said main mount in a manner so that said side walls, said abutting rear end face and said under surface of said sub-mount engage said side walls, said abutting wall and said bottom surface of said recess, respectively.
References Cited (Backward Citations)
US4411057A
Cited
US4347655A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-07 | 1989-04-08 | 1989-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-07 | 1993-04-08 | 1993-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-07 | 1997-04-08 | 1997-10-08 | $7700.00 | Window Closed / Lapsed |