US5909050A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
Assignee: Microchip Technology Inc
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Filing: 1997-09-15
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Granted: 1999-06-01
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Expires: 2017-09-15
Abstract
Abstract A combination inductive coil and integrated circuit semiconductor chip is provided in a single lead frame package. The lead frame is preferably made of a copper alloy and has a flat configuration. The chip is electrically connected to end portions of the inductive coil thus permitting the inductive coil to function as an antenna for the chip.
Inventors
- 👤 Lee Furey
- 👤 Joseph Fernandez
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 19:10
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W44/00; H10W44/501; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07749; H01; H01Q; H01Q1/00; H01Q1/12; H01Q1/22; H01Q1/2283; H01Q1/36; H01Q1/38; H01Q9/00; H01Q9/04; H01Q9/16; H01Q9/26; H01Q9/27; H10W70/00; H10W70/40; H10W70/421; H10W70/456; H10W76/00; H10W76/10; H10W76/17; H10W76/18; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
87 words
A combination inductive coil and integrated circuit semiconductor chip in a single lead frame package comprising, in combination: a single lead frame package; a lead frame located in said single lead frame package and having a coil configuration, said lead frame located in one horizontal plane; and an integrated circuit semiconductor chip located in said single lead frame package and coupled to said lead frame and having at least one terminal pad electrically connected to at least one portion of said coil configuration of said lead frame.
Claim 2
Dependent Claim
87 words
A combination inductive coil and integrated circuit semiconductor chip in a single lead frame package comprising, in combination: a single lead frame package; a lead frame located in said single lead frame package and having a coil configuration, said lead frame located in one horizontal plane; and an integrated circuit semiconductor chip located in said single lead frame package and coupled to said lead frame and having at least one terminal pad electrically connected to at least one portion of said coil configuration of said lead frame.
Claim 3
Dependent Claim
86 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said integrated circuit semiconductor chip having at least two terminal pads, one of said two terminal pads of said integrated circuit semiconductor chip being electrically connected to one end portion of said coil configuration of said lead frame, the other of said two terminal pads of said integrated circuit semiconductor chip being electrically connected to the other end portion of said coil configuration of said lead frame.
Claim 4
Dependent Claim
62 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 2 wherein both of said two terminal pads of said integrated circuit semiconductor chip being located on a top surface of said integrated circuit semiconductor chip, a bottom surface portion of said integrated circuit semiconductor chip being connected to a portion of said lead frame.
Claim 5
Dependent Claim
29 words
The combination inductive coil and integrated circuit in a single lead frame package of claim 3 wherein said single lead frame package is a plastic encapsulated lead frame package.
Claim 6
Dependent Claim
133 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 2 wherein said coil configuration of said lead frame being a substantially flat coil configuration, said coil configuration of said lead frame is a coil made of a copper alloy, said copper coil having two end portion, each of said two end portions having silver plated tip portions, one of said two terminal pads of said integrated circuit semiconductor chip, being electrically connected to a silver plated tip portion located at one of said two end portions of said copper coil, the other of said two terminal pads of said integrated circuit semiconductor chip being electrically connected to a silver slated tip portion located at the other of said two end portions of said copper coil.
Claim 7
Dependent Claim
32 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said coil configuration of said lead frame being a substantially flat coil configuration.
Claim 8
Dependent Claim
34 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 6 wherein said coil configuration of said lead frame is a coil made of a copper alloy.
Claim 9
Dependent Claim
37 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 6 wherein said copper coil having two end portions, each of said two end portions having silver plated tip portions.
Claim 10
Dependent Claim
41 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said integrated circuit semiconductor chip is a transmitter, said coil configuration of said lead frame is a transmitting antenna for said transmitter.
Claim 11
Dependent Claim
41 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said integrated circuit semiconductor chip is a receiver, said coil configuration of said lead frame is a receiving antenna for said receiver.
Claim 12
Dependent Claim
39 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said integrated circuit semiconductor chip being located over a substantially corner region of said coil configuration of said lead frame.
Claim 13
Dependent Claim
75 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 11 wherein said integrated circuit semiconductor chip having at least two terminal pads, one of said two terminal pads being electrically connected to one end portion of said coil configuration of said lead frame, the other one of said two terminal pads being electrically connected to the other end portion of said coil configuration of said lead frame.
Claim 14
Dependent Claim
65 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 12 wherein said one end portion of said coil configuration of said lead frame being located adjacent one side of said integrated circuit semiconductor chip, said other end portion of said coil configuration of said lead frame being located adjacent another side of said integrated circuit semiconductor chip.
Claim 15
Dependent Claim
66 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 12 wherein said one end portion of said coil configuration of said lead frame being located in a center portion of said coil configuration of said lead frame, said other end portion of said coil configuration of said lead frame extending underneath and past said integrated circuit semiconductor chip.
Claim 16
Dependent Claim
41 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 14 wherein said integrated circuit semiconductor chip being insulated from and attached to said corner region of said coil configuration of said lead frame.
Claim 17
Dependent Claim
38 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 1 wherein said integrated circuit semiconductor chip being located adjacent one side portion of said coil configuration of said lead frame.
Claim 18
Dependent Claim
133 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 16 wherein said integrated circuit semiconductor chip having at least two terminal pads, one of said two terminal pads being electrically connected to one end portion of said coil configuration of said lead frame, the other one of said two terminal pads being electrically connected to the other end portion of said coil configuration of said lead frame, said one end portion of said coil configuration of said lead frame being located in a center portion of said coil configuration of said lead frame spaced from said integrated circuit semiconductor chip, said other end portion of said coil configuration of said lead frame being located adjacent to one side portion of said integrated circuit semiconductor chip.
Claim 19
Dependent Claim
56 words
The combination inductive coil and integrated circuit semiconductor chip in a single lead frame package of claim 17 wherein said integrated circuit semiconductor chip being located on and attached to a portion of said lead frame having a substantially rectangular configuration and spaced from said other end portion of said coil configuration of said lead frame.
References Cited (Backward Citations)
US4857893A
Cited
US5196725A
Cited
US5181975A
Cited
US5598032A
Cited
US5541399A
Cited
US5559360A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-31 | 2002-11-30 | 2003-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-31 | 2006-11-30 | 2007-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-31 | 2010-11-30 | 2011-06-01 | $7700.00 | Window Closed / Lapsed |