US5514475A
Expired / Lapsed
US
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Heat-resistant electrical insulating layer
Assignee: Nippon Steel Corp
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Filing: 1994-01-21
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Granted: 1996-05-07
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Expires: 2014-01-21
Abstract
Abstract A heat-resistant, electrical insulating layer which is suitable for use as an insulating substrate in printed circuit boards and as an insulating film for semiconductor devices and which surpasses a polyimide-based insulating layer with respect to heat resisting properties, dielectric properties, and water absorption. The insulating layer comprises a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst. The starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent. The crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents.
Inventors
- 👤 Kazunari Nawa
- 👤 Haruyuki Kano
- 👤 Yoshihisa Sone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:43
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; H10; H10W; H10W42/00; H10W42/20; H10W42/25; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678; Y10T442/00; Y10T442/30; Y10T442/3472; Y10T442/3528; Y10T442/3594
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
199 words
A copper-clad substrate for use in the fabrication of printed circuit boards, comprising an electrical insulating substrate having a copper foil bonded to each surface thereof, wherein said electrical insulating substrate consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, said electrical insulating substrate having a long-term heat resisting temperature of about 260° C., said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.1, and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 2
Dependent Claim
199 words
A copper-clad substrate for use in the fabrication of printed circuit boards, comprising an electrical insulating substrate having a copper foil bonded to each surface thereof, wherein said electrical insulating substrate consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, said electrical insulating substrate having a long-term heat resisting temperature of about 260° C., said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.1, and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 3
Dependent Claim
19 words
The copper-clad substrate of claim 1, wherein the starting material is naphthalene or a mixture of naphthalene and phenol.
Claim 4
Dependent Claim
20 words
The copper-clad substrate of claim 1, wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl groups.
Claim 5
Dependent Claim
13 words
The copper-clad substrate of claim 1, wherein the crosslinking agent is p-xylylene glycol.
Claim 6
Dependent Claim
21 words
The copper-clad substrate of claim 1, wherein the copper foil is bonded to the substrate with the aid of an adhesive.
Claim 7
Dependent Claim
26 words
The copper-clad substrate of claim 1, wherein the copper foil is surface-treated with an aromatic compound having at least two hydroxymethyl or halomethyl groups before cladding.
Claim 8
Dependent Claim
16 words
The copper-clad substrate of claim 1, wherein the copper foil is surface-treated with a chromating solution.
Claim 9
Dependent Claim
211 words
A copper-clad substrate for use in the fabrication of printed circuit boards, comprising an electrical insulating substrate having a copper foil bonded to each surface thereof, wherein said electrical insulating substrate consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin and glass fibers, said polycondensed fused polycyclic, polynuclear aromatic resin being prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, and said electrical insulating substrate having a long-term heat resisting temperature of about 260° C. said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.7; and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 10
Dependent Claim
211 words
A copper-clad substrate for use in the fabrication of printed circuit boards, comprising an electrical insulating substrate having a copper foil bonded to each surface thereof, wherein said electrical insulating substrate consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin and glass fibers, said polycondensed fused polycyclic, polynuclear aromatic resin being prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, and said electrical insulating substrate having a long-term heat resisting temperature of about 260° C. said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.7; and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 11
Dependent Claim
19 words
The copper-clad substrate of claim 8, wherein the starting material is naphthalene or a mixture of naphthalene and phenol.
Claim 12
Dependent Claim
20 words
The copper-clad substrate of claim 8, wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl groups.
Claim 13
Dependent Claim
13 words
The copper-clad substrate of claim 10, wherein the crosslinking agent is p-xylylene glycol.
Claim 14
Dependent Claim
42 words
The copper-clad substrate of claim 8, wherein the electrical insulating substrate is in the form of a rigid laminate substrate prepared by lamination of a plurality of plies of prepreg having glass fibers impregnated with the polycondensed fused polycyclic, polynuclear aromatic resin.
Claim 15
Dependent Claim
25 words
The copper-clad substrate of claim 12, the copper foil being bonded to the substrate by hot pressing simultaneously with lamination of plies of the prepreg.
Claim 16
Dependent Claim
24 words
The copper-clad substrate of claim 8, wherein the glass fibers are surface-treated with an aromatic compound having at least two hydroxymethyl or halomethyl groups.
Claim 17
Dependent Claim
22 words
The copper-clad substrate of claim 8, wherein the glass fibers are surface-treated with an alkoxysilane compound containing one or more amino groups.
Claim 18
Dependent Claim
26 words
The copper-clad substrate of claim 8, wherein the copper foil is surface-treated with an aromatic compound having at least two hydroxymethyl or halomethyl groups before cladding.
Claim 19
Dependent Claim
16 words
The copper-clad substrate of claim 8, wherein the copper foil is surface-treated with a chromating solution.
Claim 20
Dependent Claim
66 words
A multilayered printed circuit board, which comprises a plurality of layers each comprised of a printed circuit board formed from the copper-clad substrate of claim 8 and one or more interfacial insulating films placed alternately with the layers so as to insulate adjacent substrate layers, said one or more interfacial insulating films consisting essentially of the polycondensed fused polycyclic, polynuclear aromatic resin defined in claim 8.
Claim 21
Dependent Claim
187 words
A semiconductor device comprising a semiconductor and an electrical insulating film on said semiconductor, wherein the electrical insulating film consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, said electrical insulating film having a long-term heat resisting temperature of about 260° C., said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.1; and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 22
Dependent Claim
187 words
A semiconductor device comprising a semiconductor and an electrical insulating film on said semiconductor, wherein the electrical insulating film consists essentially of a polycondensed fused polycyclic, polynuclear aromatic resin prepared by a polycondensation reaction of a starting material with a crosslinking agent in the presence of an acid catalyst, wherein the starting material is selected from the group consisting of fused polycyclic aromatic hydrocarbons which may have a hydroxyl group as a ring substituent and mixtures of a fused polycyclic aromatic hydrocarbon and a monocyclic aromatic hydrocarbon both of which may have a hydroxyl group as a ring substituent and wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl or halomethyl groups as ring substituents, said electrical insulating film having a long-term heat resisting temperature of about 260° C., said temperature determined as the highest temperature at which the weight loss after 1000 hours of aging in air was within 2% by weight; a dielectric constant at 1 MHz of about 3.1; and a water absorption of about 0.4% or less as measured by immersion in water for 24 hours at 25° C.
Claim 23
Dependent Claim
19 words
The semiconductor device of claim 19, wherein the starting material is naphthalene or a mixture of naphthalene and phenol.
Claim 24
Dependent Claim
20 words
The semiconductor device of claim 19, wherein the crosslinking agent is an aromatic compound having at least two hydroxymethyl groups.
Claim 25
Dependent Claim
13 words
The semiconductor device of claim 21, wherein the crosslinking agent is p-xylylene glycol.
Claim 26
Dependent Claim
17 words
The semiconductor device of claim 19, which comprises the electrical insulating film as an interfacial insulating film.
Claim 27
Dependent Claim
16 words
The semiconductor device of claim 19, which comprises the electrical insulating film as a passivation film.
Claim 28
Dependent Claim
16 words
The semiconductor device of claim 19, which comprises the electrical insulating film as a buffer film.
Claim 29
Dependent Claim
17 words
The semiconductor device of claim 19, which comprises the electrical insulating film as an α-ray shielding film.
Claim 30
Dependent Claim
13 words
The semiconductor device of claim 19, wherein the device is a multichip module.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-07 | 1999-11-06 | 2000-05-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-07 | 2003-11-06 | 2004-05-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-07 | 2007-11-06 | 2008-05-07 | $7700.00 | Window Closed / Lapsed |