Ball grid array plastic package

Claim 1

The method of producing a pad grid array package comprising a laminated plastic body comprising a planar substrate and a planar structural member, a centrally recessed cavity formed on the structural member, a metal pattern on the top and bottom surfaces of the substrate, a grid array of contact pads on the bottom surface of the substrate connected to said metal pattern on said bottom surface, and conductive vias in the substrate connecting the metallic patterns on the opposite surfaces of the substrate, each of the vias being positioned away from said contact pads, an electronic device mounted within said cavity, a plurality of electrical leads from said electronic device to the metallic pattern on the top surface of the substrate, and an encapsulating polymer within the cavity sealing said electronic device, and said electrical leads and said inner portion of the metallic pattern on the top surface of the substrate, which comprises a) assembling into a preassembly a plurality of coextensive sheets to be laminated into a planar main body, said preassembly including a substrate sheet, a bonding sheet and a structural member sheet, said substrate sheet having a metallization pattern on its top surface, a grid array of contact pads on its bottom surface, a metallization pattern on said bottom surface connected to the grid array of contact pads, and through-plated vias interconnecting individual metallizations on said top surface to individual metallizations on said bottom surface, said structural member sheet and said bonding sheet having a centrally located aperture which is large enough to leave exposed upon assembly inner portions of the metallizations on the top surface of the substrate sheet; b) subjecting the preassembly to heat and pressure so as to form a laminated body, the walls of the aperture in the structural member sheet and in the bonding sheet and the top surface of the substrate sheet forming a cavity; c) bonding the electronic device to the top surface of the substrate within the cavity; d) electrically connecting said electronic device to said inner portions of the metallization pattern on the top surface of the substrate sheet; and e) enclosing the cavity with a synthetic organic encapsulating polymer.

Claim 2

The method of producing a pad grid array package comprising a laminated plastic body comprising a planar substrate and a planar structural member, a centrally recessed cavity formed on the structural member, a metal pattern on the top and bottom surfaces of the substrate, a grid array of contact pads on the bottom surface of the substrate connected to said metal pattern on said bottom surface, and conductive vias in the substrate connecting the metallic patterns on the opposite surfaces of the substrate, each of the vias being positioned away from said contact pads, an electronic device mounted within said cavity, a plurality of electrical leads from said electronic device to the metallic pattern on the top surface of the substrate, and an encapsulating polymer within the cavity sealing said electronic device, and said electrical leads and said inner portion of the metallic pattern on the top surface of the substrate, which comprises a) assembling into a preassembly a plurality of coextensive sheets to be laminated into a planar main body, said preassembly including a substrate sheet, a bonding sheet and a structural member sheet, said substrate sheet having a metallization pattern on its top surface, a grid array of contact pads on its bottom surface, a metallization pattern on said bottom surface connected to the grid array of contact pads, and through-plated vias interconnecting individual metallizations on said top surface to individual metallizations on said bottom surface, said structural member sheet and said bonding sheet having a centrally located aperture which is large enough to leave exposed upon assembly inner portions of the metallizations on the top surface of the substrate sheet; b) subjecting the preassembly to heat and pressure so as to form a laminated body, the walls of the aperture in the structural member sheet and in the bonding sheet and the top surface of the substrate sheet forming a cavity; c) bonding the electronic device to the top surface of the substrate within the cavity; d) electrically connecting said electronic device to said inner portions of the metallization pattern on the top surface of the substrate sheet; and e) enclosing the cavity with a synthetic organic encapsulating polymer.

Claim 7

A method of producing a plastic laminate for use in fabricating a pad grid array plastic package comprising a) assembling into a preassembly a plurality of coextensive sheets to be laminated into a planar main body, said preassembly including a substrate sheet, a bonding sheet and a structural member sheet, said substrate sheet having a metallization pattern on its top surface, a grid array of contact pads on its bottom surface, a metallization pattern on said bottom surface connected to the grid array of contact pads, and through-plated vias interconnecting individual metallizations on said top surface to individual metallizations on said bottom surface, said structural member sheet and said bonding sheet having a centrally located aperture which is large enough to leave exposed upon assembly inner portions of the metallizations on the top surface of the substrate sheet; and b) subjecting the preassembly to heat and pressure so as to form a laminated body, the walls of the aperture in the structural member sheet and in the bonding sheet and the top surface of the substrate sheet forming a cavity.

Claim 8

A method of producing a plastic laminate for use in fabricating a pad grid array plastic package comprising a) assembling into a preassembly a plurality of coextensive sheets to be laminated into a planar main body, said preassembly including a substrate sheet, a bonding sheet and a structural member sheet, said substrate sheet having a metallization pattern on its top surface, a grid array of contact pads on its bottom surface, a metallization pattern on said bottom surface connected to the grid array of contact pads, and through-plated vias interconnecting individual metallizations on said top surface to individual metallizations on said bottom surface, said structural member sheet and said bonding sheet having a centrally located aperture which is large enough to leave exposed upon assembly inner portions of the metallizations on the top surface of the substrate sheet; and b) subjecting the preassembly to heat and pressure so as to form a laminated body, the walls of the aperture in the structural member sheet and in the bonding sheet and the top surface of the substrate sheet forming a cavity.