US5915753A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of producing a high-density printed wiring board for mounting
Assignee: Dai Nippon Printing Co Ltd
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Filing: 1998-01-16
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Granted: 1999-06-29
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Expires: 2018-01-16
Abstract
Abstract A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and selectively etching off the electroconductive metallic foil thereby forming a wiring pattern.
Inventors
- 👤 Tomohisa Motomura
- 👤 Osamu Shimada
- 👤 Yoshitaka Fukuoka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4617; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/40; H05K3/4007; H05K3/4644; H05K3/4647; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K2203/11; H05K2203/1189; H05K3/22; H05K3/24; H05K3/243; H05K3/42; H05K3/423; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49147; Y10T29/49151; Y10T29/49153
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
150 words
A method of producing a high-density wiring board for mounting, comparing the steps of: disposing a photosensitive resist layer on the main surface of an electroconductive metallic foil, subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing the surface of said electroconductive metallic foil in said photosensitive resist layer; depositing an electroconductive metal by plating on said exposed surface of the electroconductive metallic foil to form electroconductive bumps; peeling off the a remaining photosensitive layer on the main surface of the electroconductive metallic foil; superposing an insulating polymer sheet on a surface bearing said electroconductive bumps thereon; pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer sheet to emerge and form connecting terminal parts; and selectively removing by etching said electroconductive metallic foil thereby forming a wiring pattern.
Claim 2
Independent Claim
150 words
A method of producing a high-density wiring board for mounting, comparing the steps of: disposing a photosensitive resist layer on the main surface of an electroconductive metallic foil, subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing the surface of said electroconductive metallic foil in said photosensitive resist layer; depositing an electroconductive metal by plating on said exposed surface of the electroconductive metallic foil to form electroconductive bumps; peeling off the a remaining photosensitive layer on the main surface of the electroconductive metallic foil; superposing an insulating polymer sheet on a surface bearing said electroconductive bumps thereon; pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer sheet to emerge and form connecting terminal parts; and selectively removing by etching said electroconductive metallic foil thereby forming a wiring pattern.
Claim 3
Independent Claim
131 words
A method of producing a high-density wiring board for mounting, comprising the steps of: disposing a photosensitive resist layer on a surface of a wiring board having a wiring pattern thereon; subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing the surface of said wiring pattern; depositing a n electroconductive metal by plating on said exposed surface of said wiring pattern to form electroconductive bumps; peeling off a remaining photosensitive layer on the main surface of the wiring board; superposing an insulating polymer sheet on a surface forming said electroconductive bumps, and pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer sheet to emerge and form connecting terminal parts.
Claim 4
Independent Claim
131 words
A method of producing a high-density wiring board for mounting, comprising the steps of: disposing a photosensitive resist layer on a surface of a wiring board having a wiring pattern thereon; subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing the surface of said wiring pattern; depositing a n electroconductive metal by plating on said exposed surface of said wiring pattern to form electroconductive bumps; peeling off a remaining photosensitive layer on the main surface of the wiring board; superposing an insulating polymer sheet on a surface forming said electroconductive bumps, and pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer sheet to emerge and form connecting terminal parts.
Claim 5
Independent Claim
129 words
A method of producing a high-density wiring board for mounting, comprising the steps of: disposing a photosensitive resist layer on a surface of a wiring board having a wiring pattern thereon; subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing a surface of said wiring pattern; depositing an electroconductive metal by plating on said exposed surface of said wiring pattern to form electroconductive bumps; peeling off a remaining photosensitive layer on the main surface of the wiring board; disposing a fluid insulating polymer on a surface forming said electroconductive bumps; and pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer to emerge and form connecting terminal parts.
Claim 6
Independent Claim
129 words
A method of producing a high-density wiring board for mounting, comprising the steps of: disposing a photosensitive resist layer on a surface of a wiring board having a wiring pattern thereon; subjecting said photosensitive resist layer to selective exposure and development thereby forming holes for selectively exposing a surface of said wiring pattern; depositing an electroconductive metal by plating on said exposed surface of said wiring pattern to form electroconductive bumps; peeling off a remaining photosensitive layer on the main surface of the wiring board; disposing a fluid insulating polymer on a surface forming said electroconductive bumps; and pressing the resultant superposed layers in a direction of thickness thereof so that leading end parts of said electroconductive bumps pierce said insulating polymer to emerge and form connecting terminal parts.
Claim 7
Independent Claim
119 words
A method of manufacturing a wiring board, comprising: forming a photosensitive layer on a surface of a conductive foil; selectively exposing and developing the photosensitive layer to form holes in the photosensitive layer to expose the surface of respective portions of the conductive foil; forming a first conductive metal on the exposed surface of the conductive foil to form conductive bumps thereon; forming a second conductive metal on the conductive bumps; removing the photosensitive layer from the surface of the conductive foil; overlaying an insulating polymer sheet over the conductive bumps in a manner that leading end parts of the conductive bumps are projected over said insulating polymer sheet; and patterning the conductive foil to form a wiring pattern.
Claim 8
Independent Claim
119 words
A method of manufacturing a wiring board, comprising: forming a photosensitive layer on a surface of a conductive foil; selectively exposing and developing the photosensitive layer to form holes in the photosensitive layer to expose the surface of respective portions of the conductive foil; forming a first conductive metal on the exposed surface of the conductive foil to form conductive bumps thereon; forming a second conductive metal on the conductive bumps; removing the photosensitive layer from the surface of the conductive foil; overlaying an insulating polymer sheet over the conductive bumps in a manner that leading end parts of the conductive bumps are projected over said insulating polymer sheet; and patterning the conductive foil to form a wiring pattern.
Claim 9
Independent Claim
182 words
A method of manufacturing a semiconductor package, comprising: forming a photosensitive layer on a surface of a conductive foil, selectively exposing and developing the photosensitive layer to form holes in the photosensitive layer to expose the surface of respective portions of the conductive foil; forming a first conductive metal on the exposed surface of the conductive foil to form conductive bumps thereon; forming a second conductive metal on the conductive bumps to form connecting portions of the conductive bumps; removing the photosensitive layer from the surface of the conductive foil; overlaying an insulating polymer sheet over the conductive bumps in a manner that leading end parts of the conductive bumps are projected over said insulating polymer sheet to form connecting terminal parts; patterning the conductive foil to form a wiring pattern; placing a chip having connecting electrodes over the insulating polymer sheet in a manner that the connecting electrodes face the connecting terminal parts; and pressing and heating the wiring pattern, the insulating polymer sheet, and the chip to electrically connect the connecting electrodes of the chip to the connecting terminal parts.
Claim 10
Independent Claim
182 words
A method of manufacturing a semiconductor package, comprising: forming a photosensitive layer on a surface of a conductive foil, selectively exposing and developing the photosensitive layer to form holes in the photosensitive layer to expose the surface of respective portions of the conductive foil; forming a first conductive metal on the exposed surface of the conductive foil to form conductive bumps thereon; forming a second conductive metal on the conductive bumps to form connecting portions of the conductive bumps; removing the photosensitive layer from the surface of the conductive foil; overlaying an insulating polymer sheet over the conductive bumps in a manner that leading end parts of the conductive bumps are projected over said insulating polymer sheet to form connecting terminal parts; patterning the conductive foil to form a wiring pattern; placing a chip having connecting electrodes over the insulating polymer sheet in a manner that the connecting electrodes face the connecting terminal parts; and pressing and heating the wiring pattern, the insulating polymer sheet, and the chip to electrically connect the connecting electrodes of the chip to the connecting terminal parts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-06-28 | 2002-12-28 | 2003-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-06-28 | 2006-12-28 | 2007-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-06-28 | 2010-12-28 | 2011-06-29 | $7700.00 | Window Closed / Lapsed |