US5073840A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board with coated metal support structure and method for making same
Assignee: MICROLITHICS Corp A CORP OF CO
•
Filing: 1988-10-06
•
Granted: 1991-12-17
•
Expires: 2008-10-06
Abstract
Abstract A circuit board is provided having an electrically conductive substrate. Preferably, the electrically conductive substrate comprises molybdenum and copper. The substrate is selectively coated with a dielectric material which is capable of withstanding volatilization at high temperatures. The coefficient of thermal expansion of the substrate is substantially equal to that of the circuitry components which are placed thereon. A method of providing such a support structure is also disclosed.
Inventors
- 👤 William G. Coors
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/44; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/053; H05K1/0296; H05K1/0298; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09554; H05K3/46; H05K3/4644; H05K3/4664
Claims Analysis
Total Claims: 76
Claim 1
Independent Claim
190 words
A support structure for supporting at least one circuitry component having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate comprising molybdenum and copper having first and second major surfaces and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion of a circuitry component to be supported by the support structure; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate for supporting a circuitry component, said dielectric material having at least one void for accommodating electrical connection therethrough between electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate, and having a linear coefficient of thermal expansion substantially matched to said effective linear coefficient of thermal expansion of said electrically conductive substrate; and at least one electrical interconnect means electrically connected to said electrically conductive substrate and disposed at lest partially within said at least one void for electrically connecting electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate.
Claim 2
Dependent Claim
190 words
A support structure for supporting at least one circuitry component having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate comprising molybdenum and copper having first and second major surfaces and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion of a circuitry component to be supported by the support structure; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate for supporting a circuitry component, said dielectric material having at least one void for accommodating electrical connection therethrough between electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate, and having a linear coefficient of thermal expansion substantially matched to said effective linear coefficient of thermal expansion of said electrically conductive substrate; and at least one electrical interconnect means electrically connected to said electrically conductive substrate and disposed at lest partially within said at least one void for electrically connecting electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate.
Claim 3
Dependent Claim
33 words
A support structure, as claimed in claim 1, wherein: said substrate includes a first layer having a molybdenum component and a second layer, substantially adjacent to said first layer, having a copper component.
Claim 4
Dependent Claim
29 words
A support structure, as claimed in claim 1, wherein: said electrically conductive substrate has an effective linear coefficient of thermal expansion between about 5 and about 8 ppm/° C.
Claim 5
Dependent Claim
29 words
A support structure, as claimed in claim 1, wherein: said electrically conductive substrate has an effective linear coefficient of thermal expansion between about 5.5 and about 6.3 ppm/° C.
Claim 6
Dependent Claim
27 words
A support structure, as claimed in claim 1, wherein: said layer of dielectric material includes material selected from the group consisting of glasses, ceramics and mixtures thereof.
Claim 7
Dependent Claim
19 words
A support structure, as claimed in claim 1, wherein: said layer of dielectric material comprises horosilicate reinforced with alumina.
Claim 8
Dependent Claim
24 words
A support structure, as claimed in claim 1, wherein: said layer of dielectric material has a thickness of about 0.001 to about 0.003 inches.
Claim 9
Dependent Claim
46 words
A support structure, as claimed in claim 1, further comprising: at least one thick film electrically conductive pathway disposed on said layer of dielectric material; and said at least one electrical interconnect means is in substantial vertical alignment with said at least one electrical contact means.
Claim 10
Independent Claim
210 words
A method for providing a support structure for supporting a circuitry component, the component having an effective coefficient of thermal expansion, the method comprising: providing an electrically conductive molybdenum and copper substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; providing a thick film layer of dielectric material being suspended in a binder, said dielectric material covering at least a portion of said electrically conductive substrate and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said electrically conductive substrate; defining at least one void in said layer of dielectric material contemporaneously with said providing said layer of dielectric material; heating said support structure in the absence of substantial volatilization of said dielectric material to a temperature sufficient to remove said binder wherein said dielectric material defines a first surface for supporting a circuitry component; and providing an electrically conductive material electrically connected to said electrically conductive substrate and disposed through said at least one void for electrically connecting electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate.
Claim 11
Independent Claim
210 words
A method for providing a support structure for supporting a circuitry component, the component having an effective coefficient of thermal expansion, the method comprising: providing an electrically conductive molybdenum and copper substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; providing a thick film layer of dielectric material being suspended in a binder, said dielectric material covering at least a portion of said electrically conductive substrate and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said electrically conductive substrate; defining at least one void in said layer of dielectric material contemporaneously with said providing said layer of dielectric material; heating said support structure in the absence of substantial volatilization of said dielectric material to a temperature sufficient to remove said binder wherein said dielectric material defines a first surface for supporting a circuitry component; and providing an electrically conductive material electrically connected to said electrically conductive substrate and disposed through said at least one void for electrically connecting electrical contact means of a circuitry component to be supported by the support structure and said electrically conductive substrate.
Claim 12
Dependent Claim
44 words
A method, as claimed in claim 9, wherein said step of providing an electrically conductive substrate includes: providing a first layer of material having a molybdenum component; and providing a second layer of material substantially adjacent to said first layer having a copper component.
Claim 13
Dependent Claim
38 words
A method, ac claimed in claim 9, wherein said step of providing an electrically conductive substrate includes: providing an electrically conductive substrate having an effective linear coefficient of thermal expansion between about 5 and about 8 ppm/° C.
Claim 14
Dependent Claim
38 words
A method, as claimed in claim 9, wherein said step of providing and electrically conductive substrate includes: providing an electrically conductive substrate having an effective linear coefficient of thermal expansion between about 5.5 and about 6.3 ppm/° C.
Claim 15
Dependent Claim
27 words
A method, as claimed in claim 9, further comprising the step of: providing at least one thick film electrically conductive pathway on said layer of dielectric material.
Claim 16
Dependent Claim
42 words
A method, as claimed in claim 9, wherein said steps of providing said dielectric material and said electrically conductive material through said at least one void include: selectively applying said dielectric material and said electrically conductive material by a silk screening process.
Claim 17
Dependent Claim
35 words
A method, as claimed in claim 9, wherein said step of providing a layer of dielectric material includes: providing a layer of dielectric material selected from the group consisting of glasses, ceramics and mixtures thereof.
Claim 18
Dependent Claim
31 words
A method, as claimed in claim 9, wherein said step of providing a layer of dielectric material includes; providing a layer of dielectric material comprising borosilicate glass reinforced with ceramic fibers.
Claim 19
Dependent Claim
35 words
A method, as claimed in claim 9, wherein said step of providing a layer of dielectric material includes: providing a layer of dielectric material having a thickness of from about 0.001 to about 0.003 inches.
Claim 20
Dependent Claim
46 words
A method, as claimed in claim 9, wherein said step of providing a layer of dielectric material includes: printing a layer of dielectric material on at least a portion of a major surface of said electrically conductive substrate and firing at a temperature above 400° C.
Claim 21
Dependent Claim
35 words
A method, as claimed in claim 9, further comprising the step of: substantially vertically aligning said at least one void with electrical contact means of a circuitry component to be supported by the support structure.
Claim 22
Dependent Claim
29 words
A method, as claimed in claim 9, wherein: said steps of providing a layer of dielectric material and defining said at least one void comprise a silk screening process.
Claim 23
Dependent Claim
158 words
A circuit board comprising: at least one circuitry component having an effective coefficient of thermal expansion; an electrically conductive molybdenum and copper substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said at least one circuitry component; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said at least one circuitry component, said layer of dielectric material forming a first surface for supporting said at least one circuitry component; and at least one electrical interconnect means electrically connected to said electrically conductive substrate and disposed at least partially within at least one void formed through said layer of dielectric material for electrically connecting electrical contact means of said at least one circuitry component and said electrically conductive substrate.
Claim 24
Dependent Claim
158 words
A circuit board comprising: at least one circuitry component having an effective coefficient of thermal expansion; an electrically conductive molybdenum and copper substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said at least one circuitry component; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said at least one circuitry component, said layer of dielectric material forming a first surface for supporting said at least one circuitry component; and at least one electrical interconnect means electrically connected to said electrically conductive substrate and disposed at least partially within at least one void formed through said layer of dielectric material for electrically connecting electrical contact means of said at least one circuitry component and said electrically conductive substrate.
Claim 25
Dependent Claim
21 words
A circuit board, as claimed in claim 21, wherein: said at least one circuitry component comprises a leadless ceramic chip carrier.
Claim 26
Dependent Claim
35 words
A circuit board, as claimed in claim 21; wherein: said electrically conductive substrate includes a first layer having a molybdenum component and the second layer substantially adjacent to said first layer having a copper component.
Claim 27
Dependent Claim
28 words
A circuit board, as claimed in claim 21, wherein: said electrically conductive substrate has an effective coefficient of thermal expansion between about 5 and about 8 ppm/° C.
Claim 28
Dependent Claim
28 words
A circuit board, as claimed in claim 21, wherein: said electrically conductive substrate has an effective coefficient of thermal expansion between about 5.5 and about 6.3 ppm/° C.
Claim 29
Dependent Claim
27 words
A circuit board, as claimed in claim 21, wherein: said layer of dielectric material includes material selected from the group consisting of glasses, ceramics and mixtures thereof.
Claim 30
Dependent Claim
20 words
A circuit board, as claimed in claim 21, wherein: said layer of dielectric material includes borosiliate glass and ceramic filler.
Claim 31
Dependent Claim
25 words
A circuit board, as claimed in claim 21, wherein: said layer of dielectric material has a thickness of from about 0.001 to about 0.003 inches.
Claim 32
Independent Claim
142 words
A method for providing a circuit board comprising: providing a circuitry component having an effective coefficient of thermal expansion; providing an electrically conductive substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said circuitry component; selectively applying a thick film layer of dielectric material, said dielectric material being suspended in a binder, to a portion of said electrically conductive substrate thereby forming at least one via hole in an area wherein dielectric material is not applied; heating the circuit board to a temperature sufficient to remove said binder and form a first surface for supporting said circuitry component; and providing an electrically conductive material through said at least one via hole for electrical connection between electrical contact means of said circuitry component and said electrically conductive substrate.
Claim 33
Independent Claim
142 words
A method for providing a circuit board comprising: providing a circuitry component having an effective coefficient of thermal expansion; providing an electrically conductive substrate having first and second major surfaces and having a coefficient of thermal expansion substantially matched to said effective coefficient of thermal expansion of said circuitry component; selectively applying a thick film layer of dielectric material, said dielectric material being suspended in a binder, to a portion of said electrically conductive substrate thereby forming at least one via hole in an area wherein dielectric material is not applied; heating the circuit board to a temperature sufficient to remove said binder and form a first surface for supporting said circuitry component; and providing an electrically conductive material through said at least one via hole for electrical connection between electrical contact means of said circuitry component and said electrically conductive substrate.
Claim 34
Dependent Claim
55 words
A method, as claimed in claim 33, wherein: said step of providing said circuitry component and said step of providing said electrically conductive substrate include substantially matching said coefficient of thermal expansion of said electrically conductive substrate to said effective coefficient of thermal expansion of said circuitry component at temperatures greater than about 200° C.
Claim 35
Dependent Claim
37 words
A method, as claimed in claim 29, wherein said step of heating comprises the step of: heating the circuit board in the absence of substantial volatilization of said dielectric material to a temperature greater than 400° C.
Claim 36
Dependent Claim
39 words
A method, as claimed in claim 29, wherein said step of providing an electrically conductive substrate comprises: providing an electrically conductive substrate comprising material selected form the group consisting of molybdenum, copper, tantalum, iron, chromium, iridium, niobium, and osmium.
Claim 37
Dependent Claim
46 words
A method, as claimed in claim 29, wherein said step of providing an electrically conductive substrate comprises: providing a first layer of material having a molybdenum component; providing a second layer of material substantially adjacent to said first layer of material and having a copper component.
Claim 38
Dependent Claim
35 words
A method, as claimed in claim 29, wherein said step of providing an electrically conductive substrate comprises: providing a substrate having an effective coefficient of thermal expansion between about 5 and about 8 ppm/° C.
Claim 39
Dependent Claim
37 words
A method, as claimed in claim 29, wherein said step of providing an electrically conductive substrate comprises: providing an electrically conductive substrate having an effective coefficient of thermal expansion between about 5.5 and about 6.3 ppm/° C.
Claim 40
Dependent Claim
35 words
A method, as claimed in claim 29, wherein said step of selectively applying a layer of dielectric material comprises: applying a layer including material selected from the group consisting of glasses, ceramics and mixtures thereof.
Claim 41
Dependent Claim
28 words
A method, as claimed in claim 29, wherein said step of selectively applying a layer of dielectric material comprises: applying a layer including borosilicate glass with ceramic filler.
Claim 42
Dependent Claim
35 words
A method, as claimed in claim 29, wherein said step of selectively applying a layer of dielectric material comprises: applying a layer of dielectric material having a thickness from about 0.001 to about 0.003 inches.
Claim 43
Dependent Claim
71 words
A method, as claimed in claim 34, wherein: said step of selectively applying a layer of dielectric material comprises printing a layer of dielectric material on at least a portion of a major surface of said electrically conductive substrate; and said step of providing an electrically conductive material through said at least one via hole comprises selectively printing said electrically conductive material on at least a portion of said dielectric material.
Claim 44
Dependent Claim
14 words
The method of claim 39 wherein said printing steps are accomplished by silk screening.
Claim 45
Dependent Claim
121 words
A support structure for supporting a circuitry component having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate having first and second major surfaces and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion of a circuitry component on the support structure; a layer of dielectric material covering a portion of said substrate and forming a first surface for supporting a circuitry; and said layer of dielectric material having at least one via hole and being in substantial vertical alignment with electrical contact means of said circuitry component on the support structure for permitting an electrical connection between said electrical contact means and said electrically conductive substrate.
Claim 46
Dependent Claim
121 words
A support structure for supporting a circuitry component having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate having first and second major surfaces and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion of a circuitry component on the support structure; a layer of dielectric material covering a portion of said substrate and forming a first surface for supporting a circuitry; and said layer of dielectric material having at least one via hole and being in substantial vertical alignment with electrical contact means of said circuitry component on the support structure for permitting an electrical connection between said electrical contact means and said electrically conductive substrate.
Claim 47
Dependent Claim
53 words
A support structure, as claimed in claim 41, wherein: said electrically conductive substrate is characterized in that said linear coefficient of thermal expansion of said electrically conductive substrate is substantially matched to the effective linear coefficient of thermal expansion of said circuitry component on the support structure at temperature greater than 200° C.
Claim 48
Dependent Claim
29 words
A support structure, as claimed in claim 41, wherein: said electrically conductive substrate has an effective linear coefficient of thermal expansion between about 5 and about 8 ppm/° C.
Claim 49
Dependent Claim
29 words
A support structure, as claimed in claim 41, wherein: said electrically conductive substrate has an effective linear coefficient of thermal expansion between about 5.5 and about 6.3 ppm/° C.
Claim 50
Dependent Claim
30 words
A support structure, as claimed in claim 41, wherein: said electrically conductive substrate comprises material selected from the group consisting of copper, molybdenum, tantalum, iron, chromium, iridium, niobium, and osmium.
Claim 51
Dependent Claim
35 words
A support structure, as claimed in claim 41, wherein: said electrically conductive substrate includes a first layer having a molybdenum component and a second layer, substantially adjacent to said first layer, having a copper component.
Claim 52
Dependent Claim
27 words
A support structure, as claimed in claim 41, wherein: said layer of dielectric material includes material selected from the group consisting of glasses, ceramics and mixtures thereof.
Claim 53
Dependent Claim
19 words
A support structure, as claimed in claim 41, wherein: said layer of dielectric material comprises borosilicate reinforced with alumina.
Claim 54
Dependent Claim
24 words
A support structure, as claimed in claim 41, wherein: said layer of dielectric material has a thickness of about 0.001 to about 0.003 inches.
Claim 55
Dependent Claim
153 words
A support structure for supporting one or more circuitry components having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate, having one or more voids defined therethrough, and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion a circuitry component to be support by the support structure; and one or more electrical interconnect means electrically connected to said electrically conductive substrate and disposed at least partially within said one or more voids for electrically connecting electrical contact means of one or more circuitry components to be supported by the support structure and said electrically conductive substrate.
Claim 56
Dependent Claim
153 words
A support structure for supporting one or more circuitry components having an effective linear coefficient of thermal expansion, the support structure comprising: an electrically conductive substrate having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; a thick film layer of dielectric material covering at least a portion of said electrically conductive substrate, having one or more voids defined therethrough, and having a linear coefficient of thermal expansion substantially matched to the effective linear coefficient of thermal expansion a circuitry component to be support by the support structure; and one or more electrical interconnect means electrically connected to said electrically conductive substrate and disposed at least partially within said one or more voids for electrically connecting electrical contact means of one or more circuitry components to be supported by the support structure and said electrically conductive substrate.
Claim 57
Dependent Claim
33 words
A support structure, as claimed in claim 50, wherein at least one of said one or more voids is in substantial vertical alignment with electrical contact means of one or more circuitry components.
Claim 58
Dependent Claim
24 words
A support structure, as claimed in claim 50, and further comprising one or more thick film electrically conductive pathways disposed on said dielectric material.
Claim 59
Dependent Claim
24 words
A support structure, as claimed in claim 52, wherein said one or more electrically conductive pathways comprise a conductive material suspended in a binder.
Claim 60
Dependent Claim
31 words
A support structure, as claimed in claim 52, wherein at least one of said one or more electrically conductive pathways is electrically connected to said one or more electrical interconnect means.
Claim 61
Dependent Claim
33 words
A support structure, as claimed in claim 52, wherein at least one of said one or more electrically conductive pathways is electrically connected to electrical contact means of one or more circuitry components.
Claim 62
Dependent Claim
52 words
A support structure, as claimed in claim 52, wherein said one or more voids are in substantial vertical alignment with electrical contact means of one or more circuitry components and at least one of said one or more conductive pathways is electrically connected to contact means of one or more circuitry components.
Claim 63
Dependent Claim
143 words
A support structure for supporting one or more circuitry components having an effective linear coefficient of thermal expansion, the support structure being made by the following process: providing an electrically conductive substrate having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; applying a thick film layer of dielectric material to at least a portion of said electrically conductive substrate; defining one or more voids in the layer of dielectric material contemporaneously with said step of applying said layer of dielectric material; and providing an electrically conductive material electrically connected to said electrically conductive substrate and disposed through said one or more voids for electrically connecting electrical contact means of one or more circuitry components to be supported by the support structure and said electrically conductive substrate.
Claim 64
Dependent Claim
143 words
A support structure for supporting one or more circuitry components having an effective linear coefficient of thermal expansion, the support structure being made by the following process: providing an electrically conductive substrate having a coefficient of thermal expansion substantially matched to the effective coefficient of thermal expansion of a circuitry component to be supported by the support structure; applying a thick film layer of dielectric material to at least a portion of said electrically conductive substrate; defining one or more voids in the layer of dielectric material contemporaneously with said step of applying said layer of dielectric material; and providing an electrically conductive material electrically connected to said electrically conductive substrate and disposed through said one or more voids for electrically connecting electrical contact means of one or more circuitry components to be supported by the support structure and said electrically conductive substrate.
Claim 65
Dependent Claim
43 words
A support structure, as claimed in claim 57, the process further comprising the step of substantially vertically aligning at least one of said one or more voids with contact means of one or more circuitry components to be supported by the support structure.
Claim 66
Dependent Claim
28 words
A support structure, as claimed in claim 57, the process further comprising the step of applying at least one thick film electrically conductive pathway on said dielectric material.
Claim 67
Dependent Claim
41 words
A support structure, as claimed in claim 59, wherein said step of applying said at least one electrically conductive pathway to said dielectric material is contemporaneous with said step of providing said electrically conductive material through said one or more voids.
Claim 68
Dependent Claim
29 words
A support structure, as claimed in claim connecting said at least one electrically conductive pathway 59, the process further comprising the step of electrically to said electrically conductive material.
Claim 69
Dependent Claim
39 words
A support structure, as claimed in claim 59, the process further comprising the step of connecting said at least one electrically conductive pathway to contact means of one or more circuitry components to be supported by the support structure.
Claim 70
Dependent Claim
59 words
A support structure, as claimed in claim 59, the process further comprising the step of substantially vertically aligning at least one of said one or more voids with contact means of one or more circuitry components to be supported by the support structure and electrically connecting said contact means to one of said at least one electrically conductive pathway.
Claim 71
Dependent Claim
63 words
A support structure, as claimed in claim 59, wherein: said electrically conductive material that is provided through said at least one void is formed from a first conductive material suspended in a first binder; said at least one electrically conductive pathway is formed from a second conductive material suspended in a second binder; and said dielectric material is suspended in a third binder.
Claim 72
Dependent Claim
43 words
A support structure, as claimed in claim 64, the process further comprising the step of: heating the support structure in the absence of substantial volatilization of said dielectric material and said electrically conductive substrate to a temperature sufficient to remove said third binder.
Claim 73
Dependent Claim
45 words
A support structure, as claimed in claim 64, the process further comprising the step of: heating the support structure in the absence of substantial volatilization of said dielectric material and said electrically conductive substrate to a temperature sufficient to remove said first and second binders.
Claim 74
Dependent Claim
46 words
A support structure, as claimed in claim 64, the process further comprising the step of: heating the support structure in the absence of substantial volatilization of said dielectric material and said electrically conductive substrate to a temperature sufficient to remove said first, second and third binders.
Claim 75
Dependent Claim
47 words
A support structure, as claimed in claim 64, the process further comprising the step of: heating the support structure in the absence of substantial volatilization of said dielectric material and said electrically conductive substrate to a temperature sufficient to simultaneously remove said first, second and third binders.
Claim 76
Dependent Claim
36 words
A support structure, as claimed in claim 63, wherein said dielectric material is characterized by having a coefficient of thermal expansion which is substantially matched to said coefficient of thermal expansion of said electrically conductive substrate.
References Cited (Backward Citations)
US3165672A
Cited
US3202591A
Cited
US3334395A
Cited
US3296099A
Cited
US3514538A
Cited
US3873756A
Cited
US3934334A
Cited
US4254172A
Cited
US4420364A
Cited
US4248075A
Cited
US4256796A
Cited
US4355115A
Cited
US4328614A
Cited
US4496793A
Cited
US4383270A
Cited
US4365168A
Cited
US4424251A
Cited
FR2511193A1
Cited
US4509096A
Cited
US4677252A
Cited
US4679122A
Cited
JPS61295692A
Cited
JPS61295693A
Cited
EP0224922A2
Cited
EP0228017A2
Cited
US4700273A
Cited
US4811166A
Cited
US4997698A
Cited
US4882454A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-16 | 1995-06-17 | 1995-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-16 | 1999-06-17 | 1999-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-16 | 2003-06-17 | 2003-12-17 | $7700.00 | Window Closed / Lapsed |