EP0228017A2
Expired / Lapsed
EP
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Metal net
Assignee: Perstorp AB
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Filing: 1986-12-16
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Granted: —
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Expires: 2006-12-16
Abstract
Abstract Metal net, mainly intended for the production of printed circuit boards. Said net is made of covar, molybdenum, invar or wolfram and is possibly coated with copper.
Inventors
- 👤 Hans Tommy Hertzberg
- 👤 Bernt Ekström
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 23:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09681
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
23 words
Metal net mainly intended for the production of printed circuit boards, characterized in that it is made of covar, molybdenum, invar or wolfram.
Claim 2
Dependent Claim
23 words
Metal net mainly intended for the production of printed circuit boards, characterized in that it is made of covar, molybdenum, invar or wolfram.
Claim 3
Dependent Claim
15 words
Net according to claim 1, characterized in that it is provided with a copper coating.
Claim 4
Dependent Claim
16 words
Net according to claim 2, characterized in that the copper coating is electro-plated or chemically deposited.
Claim 5
Dependent Claim
21 words
Net according to any one of claims 1-3, characterized in that it has a thickness of 50-2000 µ, preferably 50-500 µ.
Claim 6
Dependent Claim
27 words
Net according to any one of claims 1-4, characterized in that it is coated with a partially cured resin such as epoxy resin, polyimide or phenolic resin.
Claim 7
Dependent Claim
51 words
Use of a net of covar, molybdenum, invar or wolfram, optionally provided with a copper coating, as a ground plane, a power plane and/or as a layer reducing the thermal expansion of a printed circuit board, preferably a multilayer board with a coefficient of thermal expansion of 5-9, preferably 6-8 ppm/°C.
Claim 8
Dependent Claim
51 words
Use of a net of covar, molybdenum, invar or wolfram, optionally provided with a copper coating, as a ground plane, a power plane and/or as a layer reducing the thermal expansion of a printed circuit board, preferably a multilayer board with a coefficient of thermal expansion of 5-9, preferably 6-8 ppm/°C.
References Cited (Backward Citations)
No citation records indexed.
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