US4700273A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit assembly with semiconductor expansion matched thermal path
Assignee: TDY Industries LLC
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Filing: 1986-06-03
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Granted: 1987-10-13
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Expires: 2006-06-03
Abstract
Abstract A copper lead frame (16) has an aperture (18) through which a molybdenum layer (20) extends to directly contact a ceramic substrate (8) therebelow. A semiconductor chip (2) is mounted on the molybdenum layer (20). Thermal conductivity is improved because of the reduced number of thermal path conduction layers between the semiconductor chip (2) and the ceramic substrate (8). The arrangement also enables the chip-expansion-matched thermal conductor (20) to contact the semiconductor chip (2) and match expansion therewith.
Inventors
- 👤 Lance R. Kaufman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H10W70/60; H10W70/62; H10W70/66
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
115 words
An electronic circuit assembly comprising: an electrically insulative thermally conductive substrate; an electrically conductive lead frame bonded on said substrate, said lead frame having an aperture therethrough; a semiconductor chip; electrically conductive material disposed in said aperture and contacting and supporting said chip and contacting said lead frame and said substrate and having a coefficient of thermal expansion matched to said semiconductor chip, such that an electrical path is provided from said chip through said chip-expansion-matched material to said lead frame, and such that a thermal path is provided from said chip through said chip-expansion-matched material directly to said substrate bypassing said lead frame which would otherwise present an extra thermal junction to be crossed.
Claim 2
Dependent Claim
115 words
An electronic circuit assembly comprising: an electrically insulative thermally conductive substrate; an electrically conductive lead frame bonded on said substrate, said lead frame having an aperture therethrough; a semiconductor chip; electrically conductive material disposed in said aperture and contacting and supporting said chip and contacting said lead frame and said substrate and having a coefficient of thermal expansion matched to said semiconductor chip, such that an electrical path is provided from said chip through said chip-expansion-matched material to said lead frame, and such that a thermal path is provided from said chip through said chip-expansion-matched material directly to said substrate bypassing said lead frame which would otherwise present an extra thermal junction to be crossed.
Claim 3
Dependent Claim
30 words
The invention according to claim 1 wherein said material has a volume greater than the volume defined by the area of said aperture times the height of said lead frame.
Claim 4
Dependent Claim
40 words
The invention according to claim 2 wherein said material has a top planar horizontal surface and wherein said chip has a planar horizontal undersurface mounted on said top planar horizontal surface of said material and spaced above said lead frame.
Claim 5
Dependent Claim
58 words
An electronic circuit assembly comprising: an electrically insulative thermally conductive substrate; an electrically conductive lead frame bonded on said substrate, said lead frame having an aperture therethrough; material selected from the group consisting of molybdenum and compounds thereof disposed in said aperture and contacting said lead frame and said substrate; and a semiconductor chip mounted on said material.
Claim 6
Dependent Claim
58 words
An electronic circuit assembly comprising: an electrically insulative thermally conductive substrate; an electrically conductive lead frame bonded on said substrate, said lead frame having an aperture therethrough; material selected from the group consisting of molybdenum and compounds thereof disposed in said aperture and contacting said lead frame and said substrate; and a semiconductor chip mounted on said material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-12 | 1991-04-13 | 1991-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-12 | 1995-04-13 | 1995-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-12 | 1999-04-13 | 1999-10-13 | $7700.00 | Window Closed / Lapsed |