Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink

Claim 2

An electrical assembly comprising: a heat sink; an electrically insulating and heat conducting substrate mounted on said heat sink; electrical means mounted on said substrate and generating heat in response to the conduction of current through said electrical means; a printed circuit board; mounting means compressively clamping said printed circuit board to said heat sink in spaced relation above said substrate; and lead frame means operatively connected to said electrical means and extending between said printed circuit board and said substrate, said lead frame means (a) spacing said printed circuit board above said substrate, (b) receiving and transmitting compressive clamping force between said printed circuit board and said substrate and compressively forcing said substrate into intimate engagement with said heat sink to enhance heat transfer from said electrical means to said heat sink, and (c) conducting current to said electrical means.

Claim 3

The invention according to claim 1 wherein said mounting means is laterally offset and spaced from said electrical means on said substrate, and wherein said lead frame means comprises a plurality of lead frame extensions providing a series of pressure points against said substrate laterally inwardly of said mounting means and providing uniform clamping pressure and intimate engagement of said substrate and said heat sink in a compression at a plurality of distributed points enhancing heat transfer from said electrical means to said heat sink.

Claim 4

An electrical assembly comprising: a heat sink; a rigid ceramic substrate of given horizontal periphery mounted on said heat sink; electrical means mounted on said ceramic substrate and generating heat in response to the conduction of current through said electrical means; a printed circuit board; mounting means horizontally outside of said given periphery of said ceramic substrate and compressively vertically clamping said printed circuit board to said heat sink in vertically spaced relation above said ceramic substrate; and lead frame means operatively connected to said electrical means and extending rigidly and nonflexurally between said printed circuit board and said substrate at a plurality of points within said given periphery and substantially adjacent said electrical means, said lead frame means (a) spacing said printed circuit board above said ceramic substrate, (b) receiving and transmitting compressive clamping force between said printed circuit board and said ceramic substrate and compressively forcing said ceramic substrate into intimate engagement with said heat sink to enhance heat transfer from said electrical means to said heat sink, and (c) conducting current to said electrical means.

Claim 5

An electrical assembly comprising: a heat sink; a rigid ceramic substrate of given horizontal periphery mounted on said heat sink; electrical means mounted on said ceramic substrate and generating heat in response to the conduction of current through said electrical means; a printed circuit board; mounting means horizontally outside of said given periphery of said ceramic substrate and compressively vertically clamping said printed circuit board to said heat sink in vertically spaced relation above said ceramic substrate; and lead frame means operatively connected to said electrical means and extending rigidly and nonflexurally between said printed circuit board and said substrate at a plurality of points within said given periphery and substantially adjacent said electrical means, said lead frame means (a) spacing said printed circuit board above said ceramic substrate, (b) receiving and transmitting compressive clamping force between said printed circuit board and said ceramic substrate and compressively forcing said ceramic substrate into intimate engagement with said heat sink to enhance heat transfer from said electrical means to said heat sink, and (c) conducting current to said electrical means.