US4420364A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High-insulation multi-layer device formed on a metal substrate
Assignee: Sharp Corp
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Filing: 1982-05-19
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Granted: 1983-12-13
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Expires: 2002-05-19
Abstract
Abstract A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.
Inventors
- 👤 Takashi Nukii
- 👤 Shigeo Nakabu
- 👤 Masaru Iwasaki
- 👤 Katsunobu Awane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:54
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/467; H05K3/4697; H10P14/65; H10P14/6502; H10P14/6506; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/6875; H05K3/10; H05K3/20; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
152 words
A method for fabricating a multi-layer substrate comprising the steps of: preparing a provisional supporting plate; forming bottom thin-film conductors on said provisional supporting plate in a desired pattern; attaching a high-insulation adhesive sheet to said provisional supporting plate so as to cover said bottom thin-film conductors; half-curing said high-insulation adhesive sheet; separating said high-insulation adhesive sheet from said provisional supporting plate in such a manner that said bottom thin-film conductors are mounted on said high-insulation adhesive sheet; disposing said separated high-insulation adhesive sheet on a metal plate in such a manner that said bottom thin-film conductors face outward; disposing high-insulation organic film on said high-insulation adhesive sheet in such a manner that said high-insulation organic film covers said bottom thin-film conductors; curing said high-insulation adhesive sheet to tightly connect said high-insulation adhesive sheet to said metal plate and said high-insulation organic film; and forming top conductors on said high-insulation organic film.
Claim 2
Independent Claim
152 words
A method for fabricating a multi-layer substrate comprising the steps of: preparing a provisional supporting plate; forming bottom thin-film conductors on said provisional supporting plate in a desired pattern; attaching a high-insulation adhesive sheet to said provisional supporting plate so as to cover said bottom thin-film conductors; half-curing said high-insulation adhesive sheet; separating said high-insulation adhesive sheet from said provisional supporting plate in such a manner that said bottom thin-film conductors are mounted on said high-insulation adhesive sheet; disposing said separated high-insulation adhesive sheet on a metal plate in such a manner that said bottom thin-film conductors face outward; disposing high-insulation organic film on said high-insulation adhesive sheet in such a manner that said high-insulation organic film covers said bottom thin-film conductors; curing said high-insulation adhesive sheet to tightly connect said high-insulation adhesive sheet to said metal plate and said high-insulation organic film; and forming top conductors on said high-insulation organic film.
Claim 3
Independent Claim
73 words
A method for fabricating a multi-layer structure comprising the steps of: providing a metal plate; attaching a partially cured high-insulation adhesive sheet to said plate; forming bottom thin-film conductors on said partially cured high-insulation adhesive sheet; covering said bottom thin-film conductors with a high-insulation organic film; completely curing said high-insulation adhesive sheet; forming through holes; forming a conductor pattern on said high-insulation orgnanic film subsequent to said step of forming said through holes.
Claim 4
Independent Claim
73 words
A method for fabricating a multi-layer structure comprising the steps of: providing a metal plate; attaching a partially cured high-insulation adhesive sheet to said plate; forming bottom thin-film conductors on said partially cured high-insulation adhesive sheet; covering said bottom thin-film conductors with a high-insulation organic film; completely curing said high-insulation adhesive sheet; forming through holes; forming a conductor pattern on said high-insulation orgnanic film subsequent to said step of forming said through holes.
Claim 5
Dependent Claim
25 words
The method of claim 2 wherein said step of completely curing said high-insulation adhesive sheet is performed by the application of high temperatures and pressures.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-12-12 | 1987-06-13 | 1987-12-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-12-12 | 1991-06-13 | 1991-12-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-12-12 | 1995-06-13 | 1995-12-13 | $7700.00 | Window Closed / Lapsed |