US4424251A
Expired / Lapsed
US
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Thick-film multi-layer wiring board
Assignee: Hitachi Ltd
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Filing: 1981-07-28
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Granted: 1984-01-03
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Expires: 2001-07-28
Abstract
Abstract A thick-film multi-layer wiring board in which the thick-film resistor provided in the inner layer is coated with a glass material selected from (a) and (b) below: (a) crystallized glass which is crystallized at 850 DEG C. or above, and (b) amorphous glass having a softening temperature of 750 DEG C. or above and composed of glass and at least one refractory oxide selected from Al2O3 and SiO2.
Inventors
- 👤 Nobuyuki Sugishita
- 👤 Akira Ikegami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:52
CPC Classifications
C; C03; C03C; C03C10/00; H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
137 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the first resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layer of crystallized glass of BaO-ZnO-MgO-Al 2 O 3 -TiO 2 -SiO 2 -B 2 O 3 system, crystallized at 850° C. or above, which crystallized glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 2
Dependent Claim
137 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the first resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layer of crystallized glass of BaO-ZnO-MgO-Al 2 O 3 -TiO 2 -SiO 2 -B 2 O 3 system, crystallized at 850° C. or above, which crystallized glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 3
Dependent Claim
59 words
A thick-film multi-layer wiring board according to claim 1, wherein said second resistor circuit has at least one insulating layer with through-holes on said second resistor circuit and one resistor circuit on said at least one insulating layer, said one resistor circuit being connected to the underlying resistor circuits through the through-holes of the at least one insulating layer.
Claim 4
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 1 or 2, wherein said first resistor circuit and said second resistor circuit consist of the thick film conductor and the thick film resistor.
Claim 5
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 1, wherein the thick film resistor is composed of conductive RuO 2 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 6
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 1, wherein the thick film resistor is composed of conductive RuO 2 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 7
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 1, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 8
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 1, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 9
Dependent Claim
22 words
A thick-film multi-layer wiring board according to claim 2, wherein the at least one insulating layer is made of said crystallized glass.
Claim 10
Dependent Claim
142 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layer of crystallized glass of PbO-CaO-MgO-Al 2 O 3 -SiO 2 -B 2 O 3 system, Al 2 O 3 and CaZrO 3 , crystallized at 850° C. or above, which crystallized glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 11
Dependent Claim
142 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layer of crystallized glass of PbO-CaO-MgO-Al 2 O 3 -SiO 2 -B 2 O 3 system, Al 2 O 3 and CaZrO 3 , crystallized at 850° C. or above, which crystallized glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 12
Dependent Claim
59 words
A thick-film multi-layer wiring board according to claim 9, wherein said second resistor circuit has at least one insulating layer with through-holes on said second resistor circuit and one resistor circuit on said at least one insulating layer, said one resistor circuit being connected to the underlying resistor circuits through the through-holes of the at least one insulating layer.
Claim 13
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 9 or 10, wherein said first resistor circuit and said second resistor circuit consist of the thick film conductor and the thick film resistor.
Claim 14
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 9, wherein the thick film resistor is composed of conductive RuO 2 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 15
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 9, wherein the thick film resistor is composed of conductive RuO 2 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 16
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 9, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 17
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 9, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 18
Dependent Claim
22 words
A thick-film multi-layer wiring board according to claim 10, wherein the at least one insulating layer is made of said crystallized glass.
Claim 19
Dependent Claim
148 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the first resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layers of amorphous glass of PbO-Cao-Al 2 O 3 -SiO 2 -B 2 O 3 system, and at least one of Al 2 O 3 and SiO 2 , softened at 750° C. or above, which amorphous glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 20
Dependent Claim
148 words
In a thick-film multi-layer wiring board which comprises a substrate, a first resistor circuit comprising a thick film conductor and a thick film resistor, said first resistor circuit being provided on the substrate, a first insulating layer with through-holes being provided on the first resistor circuit, a second resistor circuit comprising a thick film conductor and a thick film resistor being provided on the first insulating layer and being connected to the first resistor circuit through said through-holes, an improvement which comprises forming the first insulating layers of amorphous glass of PbO-Cao-Al 2 O 3 -SiO 2 -B 2 O 3 system, and at least one of Al 2 O 3 and SiO 2 , softened at 750° C. or above, which amorphous glass is sparingly reactive to the binder glass of the resistor circuits, whereby rate of change of resistivity of the thick film resistor is reduced.
Claim 21
Dependent Claim
59 words
A thick-film multi-layer wiring board according to claim 17, wherein said second resistor circuit has at least one insulating layer with through-holes on said second resistor circuit and one resistor circuit on said at least one insulating layer, said one resistor circuit being connected to the underlying resistor circuits through the through-holes of the at least one insulating layer.
Claim 22
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 17 or 18, wherein said first resistor circuit and said second resistor circuit consist of the thick film conductor and the thick film resistor.
Claim 23
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 17, wherein the thick film resistor is composed of conductive RuO 2 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 24
Dependent Claim
32 words
A thick-film multi-layer wiring board according to claim 17, wherein the thick film resistor is composed of conductive RuO 2 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 25
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 17, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-ZnO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 26
Dependent Claim
36 words
A thick-film multi-layer wiring board according to claim 17, wherein the thick film resistor is composed of conductive Bi 2 Ru 2 O 7 and PbO-CdO-Al 2 O 3 -SiO 2 -B 2 O 3 glass.
Claim 27
Dependent Claim
22 words
A thick-film multi-layer wiring board according to claim 18, wherein the at least one insulating layer is made of said amorphous glass.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-01-02 | 1987-07-04 | 1988-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-01-02 | 1991-07-04 | 1992-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-01-02 | 1995-07-04 | 1996-01-03 | $7700.00 | Window Closed / Lapsed |