US3934334A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating metal printed wiring boards
Assignee: Texas Instruments Inc
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Filing: 1974-04-15
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Granted: 1976-01-27
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Expires: 1994-04-15
Abstract
Abstract An additive process for producing printed wiring boards is taught. In the process metal substrates having desired hole patterns are powder coated with a dielectric material electrostatically. The dielectric powder coating is then fused on the metal substrate. Next, a continuous film of pre-catalyzed adhesive is applied to all surfaces; then a plating resist is applied to all areas on which copper is not desired. The exposed catalyzed adhesive is then activated and plated in an electroless copper bath.
Inventors
- 👤 Stephen L. Hanni
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 03:36
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K2203/00; H05K2203/10; H05K2203/105; H05K2203/13; H05K2203/1333; H05K2203/1355; H05K3/00; H05K3/0097; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/386; H05K3/387; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K3/44; H05K3/445; H05K3/46; H05K3/4602; H05K3/4608; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
64 words
A method for fabricating printed wiring boards comprising: a. forming a metal substrate having a circuit hole pattern; b. electrostatically powder coating the metal substrate and hole forming walls with a suitable dielectric; c. fusing the dielectric powder coating to electrically insulate the metal substrate including the apertures thereof from electrical circuitry; and d. forming electrical circuitry on the dielectric in conjunction with the
Claim 2
Independent Claim
64 words
A method for fabricating printed wiring boards comprising: a. forming a metal substrate having a circuit hole pattern; b. electrostatically powder coating the metal substrate and hole forming walls with a suitable dielectric; c. fusing the dielectric powder coating to electrically insulate the metal substrate including the apertures thereof from electrical circuitry; and d. forming electrical circuitry on the dielectric in conjunction with the
Claim 3
Independent Claim
77 words
A method for fabricating printed wiring boards comprising: a. blanking sheet metal to form a sheet of metal substrates having circuit hole patterns; b. electrostatically powder coating the metal substrates and hole forming walls with a suitable dielectric; c. fusing the dielectric powder coating to electrically insulate the metal substrates including the apertures thereof from electrical circuitry; d. coating the dielectric with a catalyzed adhesive; and e. forming electrical circuitry on the dielectric in conjunction with the
Claim 4
Independent Claim
77 words
A method for fabricating printed wiring boards comprising: a. blanking sheet metal to form a sheet of metal substrates having circuit hole patterns; b. electrostatically powder coating the metal substrates and hole forming walls with a suitable dielectric; c. fusing the dielectric powder coating to electrically insulate the metal substrates including the apertures thereof from electrical circuitry; d. coating the dielectric with a catalyzed adhesive; and e. forming electrical circuitry on the dielectric in conjunction with the
Claim 5
Independent Claim
195 words
A method for fabricating printed wiring boards comprising: a. blanking sheet metal for outlining a plurality of metal substrates, forming hole patterns within said plurality of outlined metal substrates, and forming lead frames adjacent horizontally disposed edges of the sheet metal with holes therein for use in advancing the sheet metal and outlines of metal tabs; b. preparing the sheet metal for coating with a layer of insulating material; c. electrostatically powder coating surfaces of the metal substrates of the sheet metal with a dielectric; d. fusing the coating for thermosetting the dielectric for electrically insulating the metal substrates; e. coating all the dielectric insulating coating with an adhesive coating in preparation for forming conductor patterns and through hole interconnections by metallization; f. forming conductor patterns on the adhesive coating; g. partially removing the adhesive coating from the conductor patterns to form metal plating locking micropores; h. electrolessly plating the conductor patterns with an electrically conducting material; i. selectively forming soldering patterns; j. removing any oxide forming on the exposed soldering patterns; and k. sealing the exposed soldering patterns to prevent oxidation of the soldering pattern whereby a plurality of printed wiring boards are formed
Claim 6
Independent Claim
195 words
A method for fabricating printed wiring boards comprising: a. blanking sheet metal for outlining a plurality of metal substrates, forming hole patterns within said plurality of outlined metal substrates, and forming lead frames adjacent horizontally disposed edges of the sheet metal with holes therein for use in advancing the sheet metal and outlines of metal tabs; b. preparing the sheet metal for coating with a layer of insulating material; c. electrostatically powder coating surfaces of the metal substrates of the sheet metal with a dielectric; d. fusing the coating for thermosetting the dielectric for electrically insulating the metal substrates; e. coating all the dielectric insulating coating with an adhesive coating in preparation for forming conductor patterns and through hole interconnections by metallization; f. forming conductor patterns on the adhesive coating; g. partially removing the adhesive coating from the conductor patterns to form metal plating locking micropores; h. electrolessly plating the conductor patterns with an electrically conducting material; i. selectively forming soldering patterns; j. removing any oxide forming on the exposed soldering patterns; and k. sealing the exposed soldering patterns to prevent oxidation of the soldering pattern whereby a plurality of printed wiring boards are formed
Claim 7
Dependent Claim
36 words
A method for fabricating printed wiring boards according to claim 3 further including winding the printed wiring boards into a coil, placing the coil on a pallet, and wrapping the coil and pallet with heat shrink
Claim 8
Dependent Claim
57 words
A method for fabricating printed wiring boards according to claim 3 further including feeding the lead frame and plurality of printed wiring boards through a blanking press for removing the lead frame from the plurality of printed wiring boards, separating the printed wiring boards one from another, stacking them on a pallet, and covering the pallet and
Claim 9
Dependent Claim
33 words
A method for fabricating printed wiring boards according to claim 3 wherein the sheet metal blanked is ferrous or non-ferrous metals selected from the group consisting of steel, aluminum and copper and alloys
Claim 10
Dependent Claim
83 words
A method for fabricating printed wiring boards according to claim 3 wherein the sheet metal is prepared for the coating of insulating material by vapor degreasing both sides of the metal sheet, dipping the metal sheet in an acid solution to remove oxidized metal, rinsing the sheet metal to remove excess acid, dipping the metal sheet in an alkaline solution and rinsing to remove excess alkaline solution, phosphatizing the metal sheet, vapor degreasing until dry, and sand blasting the metal sheet to debur
Claim 11
Dependent Claim
77 words
A method for fabricating printed wiring boards according to claim 3 wherein said fused insulating coat is a smooth, substantially free pin hole coat insulating the metal sheet surfaces including the aperture forming walls, corners, and edges, and having a dielectric strength of not less than about 500 V per mil, and a temperature stability continuous between about 120°C and 130°C and a temperature stability for about 30 seconds at 260°C whereby the metal substrate can be
Claim 12
Dependent Claim
27 words
A method according to claim 3 wherein the metal tabs outlined in the lead frames are bent to form metal spacers for spacing the loops of the
Claim 13
Dependent Claim
21 words
A method according to claim 3 wherein the sealing of the exposed soldering patterns includes coating the epoxy soldering patterns with
Claim 14
Dependent Claim
14 words
A method according to claim 3 wherein the fabricating cycle is an automated cycle.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-01-26 | 1979-07-28 | 1980-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-01-26 | 1983-07-28 | 1984-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-01-26 | 1987-07-28 | 1988-01-27 | $7700.00 | Window Closed / Lapsed |