US3673680A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of circuit board with solder coated pattern
Assignee: Cal Comp Inc
•
Filing: 1970-12-14
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Granted: 1972-07-04
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Expires: 1990-12-14
Abstract
Abstract Printed wiring boards can be fabricated so as to leave a relatively thick solder layer where electrical and mechanical connections are required. Individual soldering operations can be eliminated using any one of several batch reflow soldering techniques.
Inventors
- 👤 Edward Y Tanaka
- 👤 Darrel D Cossaart
- 👤 Norman B Edwards
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:39
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0582; H05K2203/07; H05K2203/0756; H05K2203/0776; H05K3/10; H05K3/108; H05K3/22; H05K3/24; H05K3/243; H05K3/3447; H05K3/3494; H05K3/40; H05K3/42; H05K3/425; H05K3/427; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
78 words
A method for manufacturing printed circuit boards comprising: laying down a cladding of copper on a insulating substrate board; drilling terminal holes through the clad board; plating a layer of copper over the clad board; electroplating a solder pattern on the plated cladding to interconnect component terminals; electroplating additional solder at only those locations in the solder pattern where connections to component terminals are to be made; etching away the exposed copper to leave an electroplated solder pattern.
Claim 2
Independent Claim
78 words
A method for manufacturing printed circuit boards comprising: laying down a cladding of copper on a insulating substrate board; drilling terminal holes through the clad board; plating a layer of copper over the clad board; electroplating a solder pattern on the plated cladding to interconnect component terminals; electroplating additional solder at only those locations in the solder pattern where connections to component terminals are to be made; etching away the exposed copper to leave an electroplated solder pattern.
Claim 3
Dependent Claim
52 words
The method recited in claim 1 wherein is included the steps of: inserting component terminals through the holes; applying heat over a distributed area of the board whereby the electroplated solder will be melted and the additional solder where the terminals are connected will form a solder connection to the component terminals.
Claim 4
Dependent Claim
16 words
The method recited in claim 2 wherein the heat is applied using a hot air jet.
Claim 5
Dependent Claim
16 words
The method recited in claim 2 wherein the heat is applied using a hot oil bath.
Claim 6
Dependent Claim
17 words
The method recited in claim 2 wherein the heat is applied using a hot oil waving process.
Claim 7
Dependent Claim
53 words
A process for making a printed wiring boards of the type having an electroplated solder pattern and plated holes for attaching modular components wherein the improvement comprises the steps of: plating an additional layer of solder only in the vicinity of those holes where electrical connections are to Be made to component terminals.
Claim 8
Dependent Claim
53 words
A process for making a printed wiring boards of the type having an electroplated solder pattern and plated holes for attaching modular components wherein the improvement comprises the steps of: plating an additional layer of solder only in the vicinity of those holes where electrical connections are to Be made to component terminals.
Claim 9
Dependent Claim
40 words
The improved process for making printed wiring boards recited in claim 6 wherein is included the steps of: inserting the component leads into the plated holes; batch reflowing the deposited solder to make the electrical connection to the component terminals.
References Cited (Backward Citations)
US3002481A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-04 | 1976-01-03 | 1976-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-04 | 1980-01-03 | 1980-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-04 | 1984-01-03 | 1984-07-04 | $7700.00 | Window Closed / Lapsed |