US4882454A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal interface for a printed wiring board
Assignee: Texas Instruments Inc
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Filing: 1988-02-12
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Granted: 1989-11-21
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Expires: 2008-02-12
Abstract
Abstract A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.
Inventors
- 👤 Robert K. Peterson
- 👤 Larry J. Mowatt
- 👤 Aaron D. Poteet
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:17
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K3/00; H05K3/40; H05K3/403; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/09536; H05K2201/09654; H05K2201/09709; H05K2201/09781; H05K3/44; H05K3/445; H05K3/46; H05K3/4602; H05K3/4608; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49155
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
126 words
A printed wiring board for mounting components thereto, said printed wiring board including: a thermally conductive core; and a first thermal interface region having a first outer surface, said first thermal interface disposed over and in thermal contact with said core for conducting heat generated by said components to said core via said first thermal interface region; said first thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said first outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said first outer surface of said first thermal interface region.
Claim 2
Dependent Claim
126 words
A printed wiring board for mounting components thereto, said printed wiring board including: a thermally conductive core; and a first thermal interface region having a first outer surface, said first thermal interface disposed over and in thermal contact with said core for conducting heat generated by said components to said core via said first thermal interface region; said first thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said first outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said first outer surface of said first thermal interface region.
Claim 3
Dependent Claim
17 words
The printed wiring board as claimed in claim 1 wherein said core is substantially composed of metal.
Claim 4
Dependent Claim
21 words
The printed wiring board as claimed in claim 1 wherein said core is substantially composed of a thermally conductive composite material.
Claim 5
Dependent Claim
19 words
The printed wiring board as claimed in claim 1 wherein said core is substantially composed of metal-clad composite material.
Claim 6
Dependent Claim
26 words
The printed wiring board as claimed in claim 1 wherein said printed wiring board is further plated with a durable metal over said thermal interface region.
Claim 7
Dependent Claim
18 words
The printed wiring board as claimed in claim 5 wherein said durable metal is substantially comprised of nickel.
Claim 8
Dependent Claim
30 words
The printed wiring board as claimed in claim 5 wherein said plated metal is disposed on the exterior of said board, is thermally conductive and contacts said thermally conductive layers.
Claim 9
Dependent Claim
38 words
The printed wiring board as claimed in claim 6 wherein said plated metal is disposed on the exterior of said board, is thermally conductive and contacts said thermally conductive layers and said vias on said first outer surface.
Claim 10
Dependent Claim
20 words
The printed wiring board as claimed in claim 1 wherein said vias on adjacent ones of said layers are staggered.
Claim 11
Dependent Claim
27 words
The printed wiring board as claimed in claim 1 further including an electrically conductive pattern disposed on said first outer surface and electrically insulated from said vias.
Claim 12
Dependent Claim
20 words
The printed wiring board as claimed in claim 1, further including component mounting means disposed on said first outer surface.
Claim 13
Dependent Claim
131 words
The printed wiring board as claimed in claim 1, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
Claim 14
Dependent Claim
131 words
The printed wiring board as claimed in claim 7, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
Claim 15
Dependent Claim
131 words
The printed wiring board as claimed in claim 8, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
Claim 16
Dependent Claim
131 words
The printed wiring board as claimed in claim 9, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
Claim 17
Dependent Claim
131 words
The printed wiring board as claimed in claim 10, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
Claim 18
Dependent Claim
131 words
The printed wiring board as claimed in claim 11, further including a second thermal interface region having a second outer surface, said second thermal interface disposed over and in thermal contact with said core and disposed on a side of said core opposite said first thermal interface for conducting heat generated by said components to said core via said second thermal interface region; said second thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said second outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said second outer surface of said second thermal interface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-11-20 | 1993-05-22 | 1993-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-11-20 | 1997-05-22 | 1997-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-11-20 | 2001-05-22 | 2001-11-21 | $7700.00 | Window Closed / Lapsed |