US4388136A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a polyimide/glass hybrid printed circuit board
Assignee: Unisys Corp
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Filing: 1980-09-26
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Granted: 1983-06-14
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Expires: 2000-09-26
Abstract
Abstract A method of fabricating a "hybrid" multilayer printed circuit board combining two dissimilar plastic layers of polyimide resin/glass and of epoxy resin/glass laminates. The finished hybrid multilayer printed circuit board is for, e.g., the support of and electrical interconnection to a plurality of magnetizable memory cores. The method includes sandwiching a plurality of epoxy-glass printed circuit boards having the desired copper patterns on both sides between two polyimide-glass printed circuit boards, each having the desired copper pattern on only one side. All the printed circuit boards are laminated with epoxy-glass prepreg to form a single hybrid multilayer printed circuit board consisting of the sandwiched epoxy-glass printed circuit boards and the sandwiching polyimide-glass printed circuit boards. Interconnections between patterned layers are formed by copper-plate throughholes.
Inventors
- 👤 Jaken Y. Huie
- 👤 Dan Jacobus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 21:26
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; B32B27/08; H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/114; B32B7/00; B32B7/04; B32B7/12; H05K3/00; H05K3/46; H05K3/4688; B32B2379/00; B32B2379/08; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1057; Y10T156/108
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
129 words
A method of fabricating a hybrid multilayer printed circuit board comprising: trimming to rough size a plurality of double-copper-clad epoxy-glass-base boards; forming circuit patterns in the top and bottom copper layers of said epoxy-glass-base boards; trimming to rough size two single-copper-clad polyimide-glass-base boards: forming a pre-laminated structure by sandwiching said plurality of said epoxy-glass-base boards between said two polyimide-glass-base boards with the copper layers thereon exposed and with one or more layers of B stage prepreg containing an epoxy resin inserted between each of said sandwiched and said sandwiching boards; forming a laminated structure of said pre-laminated structure by applying pressure and heat thereto; forming through-holes in said laminated structure; forming circuit patterns in the copper layers of said polyimide-glass-base boards; and, trimming said laminated structure to final size.
Claim 2
Independent Claim
129 words
A method of fabricating a hybrid multilayer printed circuit board comprising: trimming to rough size a plurality of double-copper-clad epoxy-glass-base boards; forming circuit patterns in the top and bottom copper layers of said epoxy-glass-base boards; trimming to rough size two single-copper-clad polyimide-glass-base boards: forming a pre-laminated structure by sandwiching said plurality of said epoxy-glass-base boards between said two polyimide-glass-base boards with the copper layers thereon exposed and with one or more layers of B stage prepreg containing an epoxy resin inserted between each of said sandwiched and said sandwiching boards; forming a laminated structure of said pre-laminated structure by applying pressure and heat thereto; forming through-holes in said laminated structure; forming circuit patterns in the copper layers of said polyimide-glass-base boards; and, trimming said laminated structure to final size.
Claim 3
Independent Claim
69 words
A method of fabricating a hybrid multilayer printed circuit board comprising: forming a plurality of printed circuit-pattern-supporting epoxy-glass-base boards; forming two printed circuit-pattern-supporting polyimide-glass-base boards; forming a pre-laminated structure by sandwiching said plurality of said epoxy-glass-base boards between said two polyimide-glass-base boards with one or more layers of an insulative adhesive between each of said sandwiched and said sandwiching boards; and, forming a laminated structure of said pre-laminated structure.
Claim 4
Independent Claim
69 words
A method of fabricating a hybrid multilayer printed circuit board comprising: forming a plurality of printed circuit-pattern-supporting epoxy-glass-base boards; forming two printed circuit-pattern-supporting polyimide-glass-base boards; forming a pre-laminated structure by sandwiching said plurality of said epoxy-glass-base boards between said two polyimide-glass-base boards with one or more layers of an insulative adhesive between each of said sandwiched and said sandwiching boards; and, forming a laminated structure of said pre-laminated structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-06-13 | 1986-12-13 | 1987-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-06-13 | 1990-12-13 | 1991-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-06-13 | 1994-12-13 | 1995-06-14 | $7700.00 | Window Closed / Lapsed |