US4030190A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming a multilayer printed circuit board
Assignee: International Business Machines Corp
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Filing: 1976-03-30
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Granted: 1977-06-21
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Expires: 1996-03-30
Abstract
Abstract Multilayer printed circuit boards are formed by providing a plurality of board assemblies having appropriate ground, signal and voltage planes. Each assembly is built around a dimensionally stable core to enhance registration between levels and is processed in such a manner that there exists a relative dimensionally stable configuration when performing method steps important to maintain good registration. The assemblies may constitute a completed multilayer board or may be subsequently combined to provide a more complex multilayer printed circuit board.
Inventors
- 👤 Kenneth James Varker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 11:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K3/4602; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/10; H05K3/18; H05K3/181; H05K3/4644; H05K3/4661; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
86 words
A method of manufacturing a multilayer printed circuit board including at least one base plane of inherently stable, conductive material and a plurality of signal planes, comprising the steps of: adding first and second dielectric planes on the sides of said base plane; creating first and second signal planes on said first and second dielectric planes, respectively; adding third and fourth dielectric planes over said first and second signal planes, respectively; and creating respective third and fourth signal planes on said third and fourth dielectric planes.
Claim 2
Independent Claim
86 words
A method of manufacturing a multilayer printed circuit board including at least one base plane of inherently stable, conductive material and a plurality of signal planes, comprising the steps of: adding first and second dielectric planes on the sides of said base plane; creating first and second signal planes on said first and second dielectric planes, respectively; adding third and fourth dielectric planes over said first and second signal planes, respectively; and creating respective third and fourth signal planes on said third and fourth dielectric planes.
Claim 3
Dependent Claim
16 words
The invention according to claim 1 wherein said base plane is made of copper sheet material.
Claim 4
Dependent Claim
46 words
The invention according to claim 1 additionally comprising the step of creating selective blind vias through said third and fourth dielectrics to said first and second signals planes, respectively, prior to creating the respective third and fourth signal planes on said third and fourth dielectric planes.
Claim 5
Dependent Claim
16 words
The invention according to claim 1 wherein said dielectric planes are added by a lamination process.
Claim 6
Dependent Claim
17 words
The invention according to claim 1 wherein said signal planes are created by an additive plating process.
Claim 7
Dependent Claim
38 words
The invention according to claim 3 wherein the step of creating respective third and fourth signal planes on said third and fourth dielectric planes includes plating through said vias to thereby provide interconnections between said adjacent signal planes.
Claim 8
Dependent Claim
14 words
The invention according to claim 1 wherein said base plane is a ground plane.
Claim 9
Dependent Claim
14 words
The invention according to claim 1 wherein said base plane is a power plane.
Claim 10
Dependent Claim
23 words
The invention according to claim 3 wherein said selective creating of vias to said signal planes is accomplished using a laser drilling beam.
Claim 11
Dependent Claim
20 words
The invention according to claim 1 wherein each of said dielectric planes is made of epoxy glass impregnated with resin.
Claim 12
Independent Claim
142 words
A method of manufacturing a multilayer printed circuit board subassembly including at least one base plane of conductive material and a plurality of signal planes, comprising the steps of: laminating first and second dielectric planes on the sides of said base plane; curing said first and second dielectric planes; plating first and second signal planes of conductive material on said first and second dielectric planes, respectively; laminating third and fourth dielectric planes over said first and second signal planes, respectively; curing said third and fourth dielectric planes; creating selective vias through said third and fourth dielectrics to said first and second signal planes, respectively; and plating third and fourth signal planes on said third and fourth dielectric planes, respectively including plating said vias to thereby provide interconnections between said first and third signal planes and between said second and fourth signal planes.
Claim 13
Independent Claim
142 words
A method of manufacturing a multilayer printed circuit board subassembly including at least one base plane of conductive material and a plurality of signal planes, comprising the steps of: laminating first and second dielectric planes on the sides of said base plane; curing said first and second dielectric planes; plating first and second signal planes of conductive material on said first and second dielectric planes, respectively; laminating third and fourth dielectric planes over said first and second signal planes, respectively; curing said third and fourth dielectric planes; creating selective vias through said third and fourth dielectrics to said first and second signal planes, respectively; and plating third and fourth signal planes on said third and fourth dielectric planes, respectively including plating said vias to thereby provide interconnections between said first and third signal planes and between said second and fourth signal planes.
Claim 14
Dependent Claim
39 words
A method of manufacturing a composite multilayer printed circuit board comprising the steps of: making a plurality of printed circuit board subassemblies according to the method of claim 11; and laminating said plurality of printed circuit board subassemblies together.
Claim 15
Dependent Claim
32 words
The invention according to claim 12 additionally comprising: creating a plurality of through holes through said composite multilayer printed circuit board; and plating said plurality of through holes with a conductive metal.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-06-20 | 1980-12-20 | 1981-06-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-06-20 | 1984-12-20 | 1985-06-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-06-20 | 1988-12-20 | 1989-06-21 | $7700.00 | Window Closed / Lapsed |