Method for interconnecting contact layers of a circuit board
Abstract
Abstract A method for interconnecting contact layers of a circuit board having an interposed insulating layer of epoxy resin characterized by superimposing a layer of epoxy resin with reinforcing glass fibers between two conducting layers carried on layers of insulating material, each of the conducting layers including at least one contact point provided with a coating of bonding metal, heating the stack to a temperature above the curing temperature of the epoxy resin and below the melting point of the bonding metal so the resin becomes liquid and begins to jell, and then applying pressure to the stack to press the contact points against the jelling epoxy resin to force it and its reinforcing glass fibers from between the points to obtain engagement of the surfaces of the coatings of bonding metal which coatings of bonding metal is due to the temperature and pressure conditions form an integral bond between the contact point to form a connection between its separated conducting layers.
Inventors
- 👤 W Schmidt
- 👤 H Zukier
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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