Multilayer circuit board
Abstract
Abstract An improved multilayer circuit board and a method of manufacture thereof comprising a plurality of layers of conductive material separated by layers of dielectric material. Selected dielectric layers include a readily, electrolessly plateable, hydrophilic material while other dielectric layers are made of a hydrophobic material which is not readily plateable. All layers are laminated, and holes are formed in the board where layers of conductive material are to be interconnected. An electroless plating interconnects only those layers of conductive material separated by hydrophilic dielectric material, leaving other layers separated by hydrophobic dielectric material isolated. Embodiments are also disclosed in which all layers of conductive material are interconnected regardless of the type of dielectric material separating them.
Inventors
- 👤 J Cannizzaro
- 👤 C Emery
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-17 | 1977-03-19 | 1977-09-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-17 | 1981-03-19 | 1981-09-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-17 | 1985-03-19 | 1985-09-18 | $7700.00 | Window Closed / Lapsed |