EP0224922A2
Expired / Lapsed
EP
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Invar foil
Assignee: Perstorp AB
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Filing: 1986-12-04
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Granted: —
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Expires: 2006-12-04
Abstract
Abstract Invar foil, mainly intended for the production of printed circuit boards. Said foil comprises an electro-plated invar layer.
Inventors
- 👤 Hans Tommy Hertzberg
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 15:00
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/06; H05K2201/068; H05K2203/00; H05K2203/03; H05K2203/0323; H05K3/02; H05K3/022; H05K3/025
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
17 words
Invar foil mainly intended for the production of printed circuit boards, which comprises an electro-plated invar layer.
Claim 2
Dependent Claim
17 words
Invar foil mainly intended for the production of printed circuit boards, which comprises an electro-plated invar layer.
Claim 3
Dependent Claim
24 words
Foil according to claim 1, wherein the invar layer is provided on at least one side with a chemical and/or an electro-plated copper layer.
Claim 4
Dependent Claim
20 words
Foil according to claim 1 or 2, wherein the invar layer has a thickness of 1-100 µ, preferably 10-75 µ.
Claim 5
Dependent Claim
17 words
Foil according to claim 2 or 3, wherein the copper layer has a thickness of 1-200 µ.
Claim 6
Dependent Claim
22 words
Foil according to any one of claims 1-4, wherein the invar layer is provided on both sides with an electro-plated copper layer.
Claim 7
Dependent Claim
25 words
Foil according to any one of claims 1-5, wherein the invar layer and/or the copper layer or layers are provided with an adhesion promoting layer.
Claim 8
Dependent Claim
56 words
Use of an invar foil comprising an electro-plated invar layer optionally provided with a copper layer on at least one side, as a ground plane, a power plane and/or as a layer reducing the thermal expansion of a printed circuit board, preferably a multilayer board with a coefficient of thermal expansion of 5-9, preferably 6-8 ppm/°C.
Claim 9
Dependent Claim
56 words
Use of an invar foil comprising an electro-plated invar layer optionally provided with a copper layer on at least one side, as a ground plane, a power plane and/or as a layer reducing the thermal expansion of a printed circuit board, preferably a multilayer board with a coefficient of thermal expansion of 5-9, preferably 6-8 ppm/°C.
References Cited (Backward Citations)
No citation records indexed.
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