US5994168A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing semiconductor device
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1998-11-18
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Granted: 1999-11-30
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Expires: 2018-11-18
Abstract
Abstract A method of manufacturing a semiconductor device which allows reliability of connection to be improved and manufacturing time to be reduced includes sandwiching a sheet-shaped unhardended hardenable material between a semiconductor chip and an interposer or substrate. The hardenable material is then melted, thereby bonding the semiconductor chip and the interposer, the surface of the semiconductor chip opposite the interposer being covered with the hardening resin. The hardenable material is then hardened in an appropriate manner.
Inventors
- 👤 Yoshimi Egawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/01321; H10W72/01325; H10W72/071; H10W72/073; H10W72/07311; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
58 words
A method of manufacturing a semiconductor device comprising: placing a sheet-shaped hardening resin between a semiconductor chip and a substrate; melting said hardening resin; and re-hardening said melted hardening resin, thereby bonding said semiconductor chip and said substrate by said hardening resin, the surface of the semiconductor chip opposite to said substrate being covered with the hardening resin.
Claim 2
Independent Claim
58 words
A method of manufacturing a semiconductor device comprising: placing a sheet-shaped hardening resin between a semiconductor chip and a substrate; melting said hardening resin; and re-hardening said melted hardening resin, thereby bonding said semiconductor chip and said substrate by said hardening resin, the surface of the semiconductor chip opposite to said substrate being covered with the hardening resin.
Claim 3
Dependent Claim
30 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin placed between said semiconductor chip and said substrate is hardening resin in a solid state.
Claim 4
Dependent Claim
19 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin is a thermosetting resin.
Claim 5
Dependent Claim
19 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin is a UV-hardening resin.
Claim 6
Dependent Claim
40 words
The method of manufacturing a semiconductor device according to claim 1, further comprising placing connection terminals, which electrically connect said semiconductor chip and said substrate, between said semiconductor chip and substrate, the connection terminals being sealed by said hardening resin.
Claim 7
Dependent Claim
19 words
The method of manufacturing a semiconductor device according to claim 13, wherein said hardening resin is a UV-hardening resin.
Claim 8
Dependent Claim
29 words
The method of manufacturing a semiconductor device according to claim 1, wherein the surface of the semiconductor chip opposite to said substrate is completely covered with the hardening resin.
Claim 9
Dependent Claim
28 words
The method of manufacturing a semiconductor device according to claim 1, wherein said melting includes melting all of the hardening resin between the semiconductor chip and the substrate.
Claim 10
Dependent Claim
28 words
The method of manufacturing a semiconductor device according to claim 7, wherein said melting includes melting all of the hardening resin between the semiconductor chip and the substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-29 | 2003-05-31 | 2003-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-29 | 2007-05-31 | 2007-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-29 | 2011-05-31 | 2011-11-30 | $7700.00 | Window Closed / Lapsed |