US5863815A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing semiconductor device
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1997-10-08
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Granted: 1999-01-26
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Expires: 2017-10-08
Abstract
Abstract A method of manufacturing a semiconductor device which allows reliability of connection to be improved and manufacturing time to be reduced includes sandwiching a sheet-shaped unhardended hardenable material between a semiconductor chip and an interposer or substrate. The hardenable material is then melted, thereby sealing the semiconductor chip and the interposer, including along connection terminals therebetween. The hardenable material is then hardened in an appropriate manner.
Inventors
- 👤 Yoshimi Egawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/01321; H10W72/01325; H10W72/071; H10W72/073; H10W72/07311; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/30; H10W72/321; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
94 words
A method of manufacturing a semiconductor device wherein a semiconductor chip is connected to a substrate by connection terminals, and said semiconductor chip and said substrate are bonded together, comprising: placing a sheet-shaped hardening resin between said semiconductor chip and said substrate; bonding said semiconductor chip to said connection terminals such that melted hardening resin is sandwiched between said substrate and said semiconductor chip, and sealing said semiconductor chip to said substrate with said melted hardening resin, including sealing along said connection terminals with said melted hardening resin; and re-hardening said melted hardening resin.
Claim 2
Independent Claim
94 words
A method of manufacturing a semiconductor device wherein a semiconductor chip is connected to a substrate by connection terminals, and said semiconductor chip and said substrate are bonded together, comprising: placing a sheet-shaped hardening resin between said semiconductor chip and said substrate; bonding said semiconductor chip to said connection terminals such that melted hardening resin is sandwiched between said substrate and said semiconductor chip, and sealing said semiconductor chip to said substrate with said melted hardening resin, including sealing along said connection terminals with said melted hardening resin; and re-hardening said melted hardening resin.
Claim 3
Dependent Claim
35 words
The method of manufacturing a semiconductor device according to claim 1, wherein said sheet-shaped hardening resin is placed before or after said semiconductor chip is bonded to said substrate with said connection terminals interposed therebetween.
Claim 4
Dependent Claim
32 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin is a thermosetting resin and wherein resin sealing is achieved by heating and hardening said thermosetting resin.
Claim 5
Dependent Claim
30 words
The method of manufacturing a semiconductor device according to claim 1, further comprising forming said sheet-shaped hardening resin to a thickness which corresponds to the thickness of said connection terminals.
Claim 6
Dependent Claim
40 words
The method of manufacturing a semiconductor device according to claim 1, wherein said sheet-shaped hardening resin is formed with clearance holes for adjusting the amount of the resin during sealing with the resin at the positions of said connection terminals.
Claim 7
Dependent Claim
39 words
The method of manufacturing a semiconductor device according to claim 1, further comprising providing a guard ring at a peripheral portion of said sheet-shaped hardening resin for preventing the resin from flowing out during the sealing with the resin.
Claim 8
Dependent Claim
44 words
The method of manufacturing a semiconductor device according to claim 1, further comprising forming said sheet-shaped hardening resin to include recesses for alignment and providing protrusions for achieving positioning in cooperation with said recesses on the surface of the substrate that faces said recesses.
Claim 9
Dependent Claim
18 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin is UV-hardening resin.
Claim 10
Dependent Claim
26 words
The method of manufacturing a semiconductor device according to claim 1, wherein said hardening resin placed on said substrate is hardening resin in a solid state.
Claim 11
Independent Claim
96 words
A method of manufacturing a semiconductor device comprising: placing a sheet-shaped hardening resin on a substrate; bonding a semiconductor chip to said substrate such that said hardening resin is sandwiched between said semiconductor chip and said substrate with connection terminals provided on the surface of said substrate interposed therebetween; thereafter, melting said hardening resin, thereby sealing said semiconductor chip including sealing along said connection terminals on said substrate with melted hardening resin; and re-hardening said melted hardening resin, thereby bonding said semiconductor chip to said substrate with said connection terminals and said hardening resin interposed therebetween.
Claim 12
Independent Claim
96 words
A method of manufacturing a semiconductor device comprising: placing a sheet-shaped hardening resin on a substrate; bonding a semiconductor chip to said substrate such that said hardening resin is sandwiched between said semiconductor chip and said substrate with connection terminals provided on the surface of said substrate interposed therebetween; thereafter, melting said hardening resin, thereby sealing said semiconductor chip including sealing along said connection terminals on said substrate with melted hardening resin; and re-hardening said melted hardening resin, thereby bonding said semiconductor chip to said substrate with said connection terminals and said hardening resin interposed therebetween.
Claim 13
Dependent Claim
27 words
The method according to claim 10, wherein said hardening resin is a thermosetting resin and wherein resin sealing is achieved by heating and hardening said thermosetting resin.
Claim 14
Dependent Claim
25 words
The method according to claim 10, further comprising forming said sheet-shaped hardening resin to a thickness which corresponds to the thickness of said connection terminals.
Claim 15
Dependent Claim
37 words
The method according to claim 10, further comprising forming said sheet-shaped hardening resin is formed with clearance holes for adjusting the amount of the resin during sealing with the resin at the positions of said connection terminals.
Claim 16
Dependent Claim
34 words
The method according to claim 10, further comprising providing a guard ring at a peripheral portion of said sheet-shaped hardening resin for preventing the resin from flowing out during the sealing with the resin.
Claim 17
Dependent Claim
39 words
The method according to claim 10, further comprising forming said sheet-shaped hardening resin to include recesses for alignment and providing protrusions for achieving positioning in cooperation with said recesses on the surface of the substrate that faces said recesses.
Claim 18
Dependent Claim
13 words
The method according to claim 10, wherein said hardening resin is UV-hardening resin.
Claim 19
Dependent Claim
21 words
The method according to claim 10, wherein said hardening resin placed on the substrate is hardening resin in a solid state.
Claim 20
Independent Claim
91 words
A method of manufacturing a semiconductor device comprising: bonding a semiconductor chip to a substrate with connection terminals provided on a surface of said substrate interposed therebetween; thereafter, placing a sheet-shaped hardening resin between said semiconductor chip and said substrate and on said substrate; thereafter, melting the hardening resin, thereby sealing said semiconductor chip on said substrate including sealing along said connection terminals with melted hardening resin; and re-hardening said melted hardening resin: thereby bonding said semiconductor chip to said substrate with said connection terminals and said hardening resin interposed therebetween.
Claim 21
Independent Claim
91 words
A method of manufacturing a semiconductor device comprising: bonding a semiconductor chip to a substrate with connection terminals provided on a surface of said substrate interposed therebetween; thereafter, placing a sheet-shaped hardening resin between said semiconductor chip and said substrate and on said substrate; thereafter, melting the hardening resin, thereby sealing said semiconductor chip on said substrate including sealing along said connection terminals with melted hardening resin; and re-hardening said melted hardening resin: thereby bonding said semiconductor chip to said substrate with said connection terminals and said hardening resin interposed therebetween.
Claim 22
Dependent Claim
13 words
The method according to claim 18, wherein said hardening resin is UV-hardening resin.
Claim 23
Dependent Claim
21 words
The method according to claim 18, wherein said hardening resin placed on the substrate is hardening resin in a solid state.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |