Patent US6246115B1 successfully refreshed from Google Patents.
US6246115B1
Expired / Lapsed
US
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Semiconductor package having a heat sink with an exposed surface
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 1999-10-21
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Granted: 2001-06-12
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Expires: 2019-10-21
Abstract
Abstract An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant. With this integrated circuit package, no jig is required in the assembly of the integrated circuit package. Moreover, since there is no need to use adhesives to adhere the supportive legs onto the substrate, the integrated circuit package would not suffer from delamination as in the case of the prior art. The fully-exposed heat sink allows an increased heat-dissipating efficient as compared to the prior art.
Inventors
- 👤 Tom Tang
- 👤 Chien Ping Huang
- 👤 Kevin Chiang
- 👤 Jeng-Yuan Lai
- 👤 Candy Tien
- 👤 Vicky Liu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:29
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
223 words
An integrated circuit package, which comprises: a substrate having a first side and a second side opposing the first side; first conductive traces formed on the first side of the substrate; second conductive traces formed on the second side of the substrate, which is electrically connected to the first conductive traces; at least one chip, which is mounted on the first side of the substrate and electrically connected to the first conductive traces; a plurality of solder balls provided at the terminal ends of the second conductive traces to allow external connection of the chip; a heat sink mounted on the first side of the substrate and, being formed with a plurality of supporting legs downwardly extending from sides of the heat sink and arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a top wall of a cavity in a mold; a plurality of positioning tongues formed on the heat sink for securing the heat sink in position when performing a molding process; and an encapsulant which hermetically encloses the chip and part of the heat sink therein in a manner that the top surface of the heat sink is exposed to the outside of the encapsulant.
Claim 2
Dependent Claim
223 words
An integrated circuit package, which comprises: a substrate having a first side and a second side opposing the first side; first conductive traces formed on the first side of the substrate; second conductive traces formed on the second side of the substrate, which is electrically connected to the first conductive traces; at least one chip, which is mounted on the first side of the substrate and electrically connected to the first conductive traces; a plurality of solder balls provided at the terminal ends of the second conductive traces to allow external connection of the chip; a heat sink mounted on the first side of the substrate and, being formed with a plurality of supporting legs downwardly extending from sides of the heat sink and arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a top wall of a cavity in a mold; a plurality of positioning tongues formed on the heat sink for securing the heat sink in position when performing a molding process; and an encapsulant which hermetically encloses the chip and part of the heat sink therein in a manner that the top surface of the heat sink is exposed to the outside of the encapsulant.
Claim 3
Dependent Claim
27 words
The integrated circuit package of claim 1 , wherein the supportive legs are integrally formed with the heat sink and arranged on sides of the heat sink.
Claim 4
Dependent Claim
30 words
The integrated circuit package of claim 2 , wherein the supportive legs are each formed with a hole to help enforce the bonding between the heat sink and the encapsulant.
Claim 5
Dependent Claim
37 words
The integrated circuit package of claim 1 , wherein the heat sink is further formed with a plurality of openings each being used for receiving an injection pin of the mold for use in the molding process.
Claim 6
Dependent Claim
24 words
The integrated circuit package of claim 4 , wherein the openings in the heat sink are formed near the corners of the heat sink.
Claim 7
Dependent Claim
23 words
The integrated circuit package of claim 4 , wherein the openings in the heat sink are each formed with a toothed inner wall.
Claim 8
Dependent Claim
23 words
The integrated circuit package of claim 1 , wherein the edge of the heat sink is formed with at least a recessed portion.
Claim 9
Dependent Claim
54 words
The integrated circuit package of claim 1 , wherein the heat sink is formed in such a manner that the distance from a bottom of each of the supportive legs to the top side of the heat sink is greater than the depth of the cavity in the mold used to form the encapsulant.
Claim 10
Dependent Claim
25 words
The integrated circuit package of claim 1 , wherein the chip is electrically connected to the first conductive traces via a plurality of gold wires.
Claim 11
Dependent Claim
23 words
The integrated circuit package of claim 1 , wherein the chip is electrically connected to the first conductive traces by using flip-chip technology.
Claim 12
Dependent Claim
31 words
The integrated circuit package of claim 1 , wherein the substrate is formed with a plurality of conductive vias to electrically interconnect the first conductive traces and the second conductive traces.
Claim 13
Dependent Claim
31 words
The integrated circuit package of claim 1 , wherein the gap between the sides of the heat sink and the outer walls of the encapsulant is no greater than 0.1 mm.
Claim 14
Dependent Claim
31 words
The integrated circuit package of claim 1 , wherein the heat sink is made of a heat-conductive material selected from the group consisting of copper, copper alloy, aluminum, and aluminum alloy.
Claim 15
Dependent Claim
22 words
The integrated circuit package of claim 1 , wherein the heat sink is secured to the substrate without use of an adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-06-11 | 2004-12-11 | 2005-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-06-11 | 2008-12-11 | 2009-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-06-11 | 2012-12-11 | 2013-06-12 | $7700.00 | Window Closed / Lapsed |