US5889323A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package and method of manufacturing the same
Assignee: NEC Corp
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Filing: 1997-08-18
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Granted: 1999-03-30
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Expires: 2017-08-18
Abstract
Abstract A cap that functions as a heat sink is affixed to the obverse surface of a semiconductor chip having ball bumps attached to the wiring pads on its surface, following which the semiconductor chip with the affixed cap is mounted on the bottom surface of a depression in a case and the opening of the depression in the case is simultaneously sealed by the cap.
Inventors
- 👤 Hirofumi Tachibana
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:53
CPC Classifications
H; H10; H10W; H10W95/00; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W76/00; H10W76/10; H10W76/12; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W76/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
133 words
A semiconductor package comprising: a case having a first depression; internal wirings formed on a bottom surface of said first depression; external terminals disposed on an outside of said case and electrically connected to said internal wirings; a semiconductor chip accommodated in said first depression in said case; a cap serving as a heat sink, said cap covering an opening formed by said first depression; a second depression formed in said cap, said semiconductor chip being accommodated in said second depression; holes formed in either said cap or said case at an edge of the opening formed by said first depression; and projections that mate with said holes, said projections being formed in an opposite one of said cap or said case at the edge of the opening formed by said first depression.
Claim 2
Dependent Claim
133 words
A semiconductor package comprising: a case having a first depression; internal wirings formed on a bottom surface of said first depression; external terminals disposed on an outside of said case and electrically connected to said internal wirings; a semiconductor chip accommodated in said first depression in said case; a cap serving as a heat sink, said cap covering an opening formed by said first depression; a second depression formed in said cap, said semiconductor chip being accommodated in said second depression; holes formed in either said cap or said case at an edge of the opening formed by said first depression; and projections that mate with said holes, said projections being formed in an opposite one of said cap or said case at the edge of the opening formed by said first depression.
Claim 3
Dependent Claim
88 words
A method of manufacturing the semiconductor package recited in claim 1, said method comprising steps of: attaching conductive hemispherical projections to wiring connection terminals on an obverse surface of said semiconductor chip; affixing a reverse surface of said semiconductor chip to a bottom surface of said cap in said second depression; placing said semiconductor chip affixed to said cap on the bottom surface of said first depression as said projections are inserted into said holes; and sealing a gap between said case and said cap with a resin.
References Cited (Backward Citations)
JPS58176979A
Cited
JPS5917270A
Cited
JPS6237950A
Cited
JPS62108545A
Cited
JPS63293958A
Cited
JPS6457738A
Cited
JPH01161736A
Cited
JPH03105950A
Cited
JPH03187247A
Cited
JPH0443671A
Cited
JPH04240751A
Cited
JPH05114662A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-29 | 2002-09-28 | 2003-03-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-29 | 2006-09-28 | 2007-03-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-29 | 2010-09-28 | 2011-03-30 | $7700.00 | Window Closed / Lapsed |