Chip carrier

Abstract

Abstract PURPOSE:To eliminate application of a stress to the leads of an IC and to obtain a chip carrier having low thermal resistance by providing a groove in which the edge of a cap for sealing the IC is inserted, on a substrate. CONSTITUTION:A groove 11 is previously formed on a part to be adhered with a cap 8 of a substrate 1. The edge of the cap 8 is inserted into the groove 11, and connected by adhesive 10 such as Au/Sn, Sn/Pb, etc. In this case, when a predetermined load is applied from the upper surface of the cap 8, the edge of the cap 8 is inserted to a position meeting the load in the adhesive 10 in the groove 1, and stopped on the way of the depth of the groove 11. Simultaneously, a cap between the cap 8 and an IC 5 is formed in a stable state.

Inventors

• 👤 Hikari Kimura
• 👤 光 木村

Bibliographic Details