US5468910A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device package and method of making
Assignee: Motorola Solutions Inc
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Filing: 1995-01-19
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Granted: 1995-11-21
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Expires: 2015-01-19
Abstract
Abstract A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the supportive substrate (10, 12), over the semiconductor die (16). The protective lid (20) is partially encapsulated with molding compound (28). The protective lid (20) prevents the molding compound (30) from contacting the semiconductor die (16), and associated wirebonded wires (18). A portion (30) of the protective lid (20) remains exposed. Thus, a molded package compatible with current product designs and assembly processes is provided, yet disadvantages caused by molding compound contacting the die (16) and wires (18) are avoided. Furthermore, the exposed protective lid (30) provides superior heat dissipation for the package.
Inventors
- 👤 James H. Knapp
- 👤 Keith E. Nelson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 00:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W76/00; H10W76/40; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
176 words
A method for making a semiconductor device package, comprising the steps of: providing a supportive substrate comprising a printed wire board, the printed wire board comprising a plurality of edges and a plurality of exterior electrical leads extending laterally from the plurality of edges; attaching a first semiconductor die to a first surface of the supportive substrate; electrically connecting the semiconductor die to the printed wire board with a plurality of wires; covering the plurality of wires and the first semiconductor die with a first protective lid of a uniform thickness having a raised portion shaped to conform to the plurality of wires and having a lowered portion overlying the first semiconductor die and parallel to the first semiconductor die, the first protective lid attached to the first surface of the supportive substrate thereby sealing the semiconductor die and the plurality of wires; and partially encapsulating the first protective lid and a portion of the electrical leads with a molding compound such that a portion of the first protective lid overlying the semiconductor die remains exposed.
Claim 2
Independent Claim
176 words
A method for making a semiconductor device package, comprising the steps of: providing a supportive substrate comprising a printed wire board, the printed wire board comprising a plurality of edges and a plurality of exterior electrical leads extending laterally from the plurality of edges; attaching a first semiconductor die to a first surface of the supportive substrate; electrically connecting the semiconductor die to the printed wire board with a plurality of wires; covering the plurality of wires and the first semiconductor die with a first protective lid of a uniform thickness having a raised portion shaped to conform to the plurality of wires and having a lowered portion overlying the first semiconductor die and parallel to the first semiconductor die, the first protective lid attached to the first surface of the supportive substrate thereby sealing the semiconductor die and the plurality of wires; and partially encapsulating the first protective lid and a portion of the electrical leads with a molding compound such that a portion of the first protective lid overlying the semiconductor die remains exposed.
Claim 3
Dependent Claim
43 words
The method of claim 1, wherein the step of covering the plurality of wires and first semiconductor die further comprises the first protective lid having a locking portion and wherein the step of encapsulating comprises encapsulating the locking portion of the protective lid.
Claim 4
Dependent Claim
24 words
The method of claim 1, wherein the step of covering further comprises providing a structure comprising iron and aluminum as the first protective lid.
Claim 5
Dependent Claim
34 words
The method of claim 1, further comprising the steps of, attaching a second semiconductor die to a second surface of the supportive substrate, and covering the second semiconductor die with a second protective lid.
Claim 6
Dependent Claim
16 words
The method of claim 4, further comprising the step of partly encapsulating the second protective lid.
Claim 7
Dependent Claim
16 words
The method of claim 4, further comprising the step of completely encapsulating the second protective lid.
Claim 8
Independent Claim
129 words
A method for making a semiconductor device package comprising the steps of: providing a semiconductor die; attaching the semiconductor die to a supportive substrate comprising a plurality of edges and a plurality of exterior leads extending laterally from the plurality of edges; covering the semiconductor die with a protective lid of a uniform thickness, the protective lid including a locking portion and a lowered portion overlying the semiconductor die, the lowered portion being lower than a raised portion overlying a plurality of wire bond wires electrically connecting the semiconductor die to the exterior leads; and partly encapsulating the protective lid and a portion of the leads with a molding compound such that a portion of the protective lid overlying the semiconductor die remains exposed, thereby sealing the semiconductor die.
Claim 9
Independent Claim
129 words
A method for making a semiconductor device package comprising the steps of: providing a semiconductor die; attaching the semiconductor die to a supportive substrate comprising a plurality of edges and a plurality of exterior leads extending laterally from the plurality of edges; covering the semiconductor die with a protective lid of a uniform thickness, the protective lid including a locking portion and a lowered portion overlying the semiconductor die, the lowered portion being lower than a raised portion overlying a plurality of wire bond wires electrically connecting the semiconductor die to the exterior leads; and partly encapsulating the protective lid and a portion of the leads with a molding compound such that a portion of the protective lid overlying the semiconductor die remains exposed, thereby sealing the semiconductor die.
Claim 10
Dependent Claim
25 words
The method of claim 7, wherein the step of attaching the semiconductor die comprises providing a printed wire board as part of the supportive substrate.
Claim 11
Dependent Claim
22 words
The method of claim 7, wherein the step of covering comprises providing a structure comprising iron and aluminum as the protective lid.
Claim 12
Dependent Claim
135 words
A semiconductor device package comprising: a supportive substrate comprising a plurality of edges and a plurality of exterior leads extending laterally from the plurality of edges; a semiconductor die attached to a first surface of the supportive substrate and electrically connected, with a plurality of wire bonds, to the plurality of leads; a protective lid of a uniform thickness covering the semiconductor die, the protective lid having a raised portion shaped to conform to the wire bonds and having a lowered portion overlying the semiconductor die parallel to the semiconductor die, the protective lid attached to the first surface thereby sealing the semiconductor die and the plurality of wires; and molded material partially encapsulating the protective lid and a portion of the leads, a portion of the protective lid overlying the semiconductor die remaining exposed.
Claim 13
Dependent Claim
135 words
A semiconductor device package comprising: a supportive substrate comprising a plurality of edges and a plurality of exterior leads extending laterally from the plurality of edges; a semiconductor die attached to a first surface of the supportive substrate and electrically connected, with a plurality of wire bonds, to the plurality of leads; a protective lid of a uniform thickness covering the semiconductor die, the protective lid having a raised portion shaped to conform to the wire bonds and having a lowered portion overlying the semiconductor die parallel to the semiconductor die, the protective lid attached to the first surface thereby sealing the semiconductor die and the plurality of wires; and molded material partially encapsulating the protective lid and a portion of the leads, a portion of the protective lid overlying the semiconductor die remaining exposed.
Claim 14
Dependent Claim
18 words
The package of claim 10, wherein the protective lid comprises a locking feature extending into the molded material.
Claim 15
Dependent Claim
12 words
The package of claim 10, wherein the supportive substrate comprises a leadframe.
Claim 16
Dependent Claim
14 words
The package of claim 10, wherein the supportive substrate comprises a printed wire board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-11-20 | 1999-05-22 | 1999-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-11-20 | 2003-05-22 | 2003-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-11-20 | 2007-05-22 | 2007-11-21 | $7700.00 | Window Closed / Lapsed |