US5703398A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
Assignee: Fujitsu Ltd
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Filing: 1996-06-20
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Granted: 1997-12-30
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Expires: 2016-06-20
Abstract
Abstract A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
Inventors
- 👤 Michio Sono
- 👤 Kazuto Tsuji
- 👤 Hideharu Sakoda
- 👤 Yoshimi Suzuki
- 👤 Masao Sakuma
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:37
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
75 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; heat conducting supporting members, supporting the first and second heat radiating members away from the stage; and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
Claim 2
Dependent Claim
75 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; heat conducting supporting members, supporting the first and second heat radiating members away from the stage; and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
Claim 3
Dependent Claim
23 words
The semiconductor integrated circuit device as claimed in claim 1, wherein the first and second sides of the semiconductor device oppose each other.
Claim 4
Dependent Claim
24 words
The semiconductor integrated circuit device as claimed in claim 1, wherein each of the first and second heat radiating members has a plate shape.
Claim 5
Dependent Claim
62 words
The semiconductor integrated circuit device as claimed in claim 1, wherein a space between the first heat radiating member and the first side of the semiconductor chip is filled with resin of the resin package body, and a space between the second heat radiating member and the second side of the semiconductor chip is filled with resin of the resin package body.
Claim 6
Dependent Claim
42 words
The semiconductor integrated circuit device as claimed in claim 1, wherein the supporting members includes upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member.
Claim 7
Dependent Claim
116 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and supporting members supporting the first and second heat radiating members from the stage; wherein the supporting members include upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member; and wherein the stage and the lower supporting members are integrally formed.
Claim 8
Dependent Claim
116 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and supporting members supporting the first and second heat radiating members from the stage; wherein the supporting members include upper supporting members provided on the side of the first heat radiating member and lower supporting members provided on the side of the second heat radiating member; and wherein the stage and the lower supporting members are integrally formed.
Claim 9
Dependent Claim
34 words
The semiconductor integrated circuit device as claimed in claim 1, wherein a surface of the first heat radiating member is externally exposed, and a surface of the second heat radiating member is externally exposed.
Claim 10
Dependent Claim
23 words
The semiconductor integrated circuit device as claimed in claim 1, wherein the stage has a length greater than that of the semiconductor chip.
Claim 11
Dependent Claim
82 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and a relay member having terminals, and wherein the leads are electrically connected to the semiconductor chip via the terminals of the relay member.
Claim 12
Dependent Claim
82 words
A semiconductor integrated circuit device comprising: a semiconductor chip supported by a stage; leads electrically connected to the semiconductor chip; first and second heat radiating members provided on first and second sides of the semiconductor chip; a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members; and a relay member having terminals, and wherein the leads are electrically connected to the semiconductor chip via the terminals of the relay member.
Claim 13
Dependent Claim
30 words
The semiconductor integrated circuit device as claimed in claim 9, wherein the relay member is mounted on the stage so that the relay member surrounds sides of the semiconductor chip.
Claim 14
Dependent Claim
34 words
The semiconductor integrated circuit device as claimed in claim 9, further comprising first wires connecting the leads to the terminals of the relay member and second wires connecting the terminals to the semiconductor chip.
Claim 15
Dependent Claim
17 words
The semiconductor integrated circuit device as claimed in claim 1, wherein said supporting members include calk members.
Claim 16
Dependent Claim
17 words
The semiconductor integrated circuit device of claim 1, wherein said heat conducting supporting members are supporting bars.
Claim 17
Dependent Claim
18 words
The semiconductor integrated circuit device of claim 1, wherein said heat conducting supporting members are made of metal.
Claim 18
Dependent Claim
16 words
The semiconductor integrated circuit device of claim 14, wherein said heat conducting supporting members include Ni-Fe.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-29 | 2001-06-30 | 2001-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-29 | 2005-06-30 | 2005-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-29 | 2009-06-30 | 2009-12-30 | $7700.00 | Window Closed / Lapsed |