Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
135 words
A heat exchanger assembly, which comprises; a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second oxygen-rich copper layer joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 2
Dependent Claim
135 words
A heat exchanger assembly, which comprises; a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second oxygen-rich copper layer joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 3
Dependent Claim
13 words
The assembly set forth in claim 1 wherein the oxygen-rich copper is C11000.
Claim 4
Dependent Claim
13 words
The assembly set forth in claim 1 wherein the oxygen-rich copper is C11004.
Claim 5
Dependent Claim
13 words
The assembly set forth in claim 1 wherein the oxygen-free copper is C10100.
Claim 6
Dependent Claim
142 words
A high performance heat exchanger assembly, which comprises: a first base layer of oxygen-rich copper direct bonded to a first layer of beryllium oxide; a first oxygen-rich copper layer direct bonded to the first beryllium oxide layer; a second beryllium oxide layer bonded to the first oxygen-rich copper layer; a second oxygen-rich copper layer direct bonded to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure direct bonded to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being direct bonded to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 7
Dependent Claim
142 words
A high performance heat exchanger assembly, which comprises: a first base layer of oxygen-rich copper direct bonded to a first layer of beryllium oxide; a first oxygen-rich copper layer direct bonded to the first beryllium oxide layer; a second beryllium oxide layer bonded to the first oxygen-rich copper layer; a second oxygen-rich copper layer direct bonded to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure direct bonded to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being direct bonded to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 8
Independent Claim
142 words
A method of making a heat exchanger assembly, which comprises the steps of: joining a first base layer of oxygen-rich copper to a first layer of beryllium oxide; joining a first oxygen-rich copper layer to the first beryllium oxide layer; joining a second beryllium oxide layer to the first oxygen-rich copper layer; joining a second oxygen-rich copper layer to the second beryllium oxide layer; joining a second base layer of oxygen-rich copper to the second oxygen-rich copper layer; and joining a heat exchanger structure to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 9
Independent Claim
142 words
A method of making a heat exchanger assembly, which comprises the steps of: joining a first base layer of oxygen-rich copper to a first layer of beryllium oxide; joining a first oxygen-rich copper layer to the first beryllium oxide layer; joining a second beryllium oxide layer to the first oxygen-rich copper layer; joining a second oxygen-rich copper layer to the second beryllium oxide layer; joining a second base layer of oxygen-rich copper to the second oxygen-rich copper layer; and joining a heat exchanger structure to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 10
Independent Claim
128 words
A method of making a heat exchanger assembly, which comprises the steps of: joining a heat exchanger structure to a first oxygen-rich copper base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber; joining a first beryllium oxide layer to the first base layer; joining, a first oxygen-rich copper layer to the first beryllium oxide layer; joining a second beryllium oxide layer to the intermediate oxygen-rich copper layer; and joining a second oxygen-rich copper base layer to the second layer of beryllium oxide.
Claim 11
Independent Claim
128 words
A method of making a heat exchanger assembly, which comprises the steps of: joining a heat exchanger structure to a first oxygen-rich copper base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber; joining a first beryllium oxide layer to the first base layer; joining, a first oxygen-rich copper layer to the first beryllium oxide layer; joining a second beryllium oxide layer to the intermediate oxygen-rich copper layer; and joining a second oxygen-rich copper base layer to the second layer of beryllium oxide.
Claim 12
Dependent Claim
146 words
A heat exchanger assembly, which comprises: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second oxygen-rich copper layer joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.
Claim 13
Dependent Claim
146 words
A heat exchanger assembly, which comprises: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second oxygen-rich copper layer joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.
Claim 14
Dependent Claim
12 words
The assembly set forth in claim 8 wherein the fluid is air.
Claim 15
Dependent Claim
14 words
The assembly set forth in claim 8 wherein the fluid is a dielectric fluid.
Claim 16
Dependent Claim
19 words
The assembly set forth in claim 8 wherein the cooling chambers have a liquid region and a vapor region.
Claim 17
Dependent Claim
140 words
A heat exchanger assembly, which comprises: a first base layer of Alloy C11004 joined to a first layer of beryllium oxide; a first layer of Alloy C11004 joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first layer of Alloy C11004; a second layer of Alloy C11004 joined to the second beryllium oxide layer; a second base layer of Alloy C11004 joined to the second layer of Alloy C11004; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of fins of Alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 18
Dependent Claim
140 words
A heat exchanger assembly, which comprises: a first base layer of Alloy C11004 joined to a first layer of beryllium oxide; a first layer of Alloy C11004 joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first layer of Alloy C11004; a second layer of Alloy C11004 joined to the second beryllium oxide layer; a second base layer of Alloy C11004 joined to the second layer of Alloy C11004; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of fins of Alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 19
Dependent Claim
148 words
A high performance heat exchanger assembly which comprises: a first base layer of Alloy C11004 direct bonded to a first layer of beryllium oxide; a first layer of Alloy C11004 direct bonded to a first beryllium oxide layer; a second beryllium oxide layer direct bonded to the first layer of Alloy C11004; a second layer of Alloy C11004 direct bonded to the second beryllium oxide layer; a second base layer of Alloy C11004 joined to the second layer of Alloy C11004; and a heat exchanger structure direct bonded to the second base layer, the structure comprising a plurality of fins of alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being direct bonded to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 20
Dependent Claim
148 words
A high performance heat exchanger assembly which comprises: a first base layer of Alloy C11004 direct bonded to a first layer of beryllium oxide; a first layer of Alloy C11004 direct bonded to a first beryllium oxide layer; a second beryllium oxide layer direct bonded to the first layer of Alloy C11004; a second layer of Alloy C11004 direct bonded to the second beryllium oxide layer; a second base layer of Alloy C11004 joined to the second layer of Alloy C11004; and a heat exchanger structure direct bonded to the second base layer, the structure comprising a plurality of fins of alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being direct bonded to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 21
Dependent Claim
63 words
A heat exchanger structure joined to an oxygen-rich copper layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 22
Dependent Claim
63 words
A heat exchanger structure joined to an oxygen-rich copper layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 23
Dependent Claim
65 words
A heat exchanger structure joined to a layer of Alloy C11004, the structure comprising a plurality of fins of Alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 24
Dependent Claim
65 words
A heat exchanger structure joined to a layer of Alloy C11004, the structure comprising a plurality of fins of Alloy C11004 stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 25
Dependent Claim
75 words
A heat exchanger structure joined to an oxygen-rich copper first layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber, and being at least partially filled with a selected coolant fluid.
Claim 26
Dependent Claim
75 words
A heat exchanger structure joined to an oxygen-rich copper first layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber, and being at least partially filled with a selected coolant fluid.
Claim 27
Dependent Claim
12 words
The structure set forth in claim 16 wherein the fluid is air.
Claim 28
Dependent Claim
14 words
The structure set forth in claim 16 wherein the fluid is a dielectric fluid.
Claim 29
Dependent Claim
19 words
The structure set forth in claim 16 wherein the cooling chambers have a liquid region and a vapor region.
Claim 30
Dependent Claim
72 words
A heat exchanger base having: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a second oxygen-rich copper base layer joined to the second beryllium oxide layer.
Claim 31
Dependent Claim
72 words
A heat exchanger base having: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a second oxygen-rich copper base layer joined to the second beryllium oxide layer.
Claim 32
Dependent Claim
21 words
The heat exchanger base of claim 20 wherein the first base layer has a member for connection to a heat source.
Claim 33
Dependent Claim
22 words
The heat exchanger base of claim 20 wherein the intermediate oxygen-rich copper layer has a member for connection to a heat source.
Claim 34
Dependent Claim
20 words
The heat exchanger base of claim 20 wherein the first base layer is a controlled oxygen content copper clad laminate.
Claim 35
Dependent Claim
20 words
The heat exchanger base of claim 20 wherein the second base layer is a controlled oxygen content copper clad laminate.
Claim 36
Dependent Claim
19 words
The heat exchanger base of claim 20 wherein the oxygen-rich copper layers are joined to one another by cladding.
Claim 37
Dependent Claim
30 words
The heat exchanger base of claim 23 or claim 24 wherein at least one of the oxygen-rich copper layers is joined to at least one oxygen-free copper layer by cladding.
Claim 38
Dependent Claim
28 words
The heat exchanger base of claim 20 wherein at least one of the oxygen-rich copper layers is joined to at least one oxygen-free copper layer by direct bonding.
Claim 39
Dependent Claim
28 words
The heat exchanger base of claim 20 wherein at least one of the oxygen-rich copper layers is joined to at least one beryllium oxide layer by direct bonding.
Claim 40
Dependent Claim
19 words
The heat exchanger base of claim 20 wherein at least one of the oxygen-rich copper layers is Alloy C11004.
Claim 41
Dependent Claim
167 words
A vehicle propelled by an electric motor, the motor comprising a motor control module having a series of power transistor switches, each effecting an increment of vehicle acceleration upon activation, and corresponding heat exchanger assemblies for dissipating heat energy generated upon activation of the switches, each of the assemblies comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 42
Dependent Claim
167 words
A vehicle propelled by an electric motor, the motor comprising a motor control module having a series of power transistor switches, each effecting an increment of vehicle acceleration upon activation, and corresponding heat exchanger assemblies for dissipating heat energy generated upon activation of the switches, each of the assemblies comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.
Claim 43
Dependent Claim
20 words
The vehicle set forth in claim 30 wherein at least one of the layers of oxygen-rich copper is Alloy C11004.
Claim 44
Dependent Claim
191 words
A vehicle propelled by an electric motor, the motor comprising a motor control module having a series of power transistor switches, each effecting an increment of vehicle acceleration upon activation, and corresponding heat exchanger assemblies for dissipating heat energy generated upon activation of the switches, each of the assemblies comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second layer of oxygen-rich copper joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.
Claim 45
Dependent Claim
191 words
A vehicle propelled by an electric motor, the motor comprising a motor control module having a series of power transistor switches, each effecting an increment of vehicle acceleration upon activation, and corresponding heat exchanger assemblies for dissipating heat energy generated upon activation of the switches, each of the assemblies comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second layer of oxygen-rich copper joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.
Claim 46
Dependent Claim
165 words
An ultra high performance microprocessor in combination with a heat exchanger assembly adapted for dissipating heat energy generated by the microprocessor, the assembly comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second layer of oxygen-rich copper joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.
Claim 47
Dependent Claim
165 words
An ultra high performance microprocessor in combination with a heat exchanger assembly adapted for dissipating heat energy generated by the microprocessor, the assembly comprising: a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide; a first oxygen-rich copper layer joined to the first beryllium oxide layer; a second beryllium oxide layer joined to the first oxygen-rich copper layer; a second layer of oxygen-rich copper joined to the second beryllium oxide layer; a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; and a heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber and being at least partially filled with a selected coolant fluid.