US4413766A
Expired / Lapsed
US
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Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
Assignee: Intersil Corp
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Filing: 1981-04-03
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Granted: 1983-11-08
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Expires: 2001-04-03
Abstract
Abstract Methods of forming a conductor pattern including fine conductor runs direct bonded, using a eutectic composition, to a ceramic substrate are disclosed. These methods provide grooves in the side of a metallic sheet to be bonded to the ceramic substrate, the grooves serving as vent passages for any otherwise entrapped gas between the metallic sheet and the ceramic substrate.
Inventors
- 👤 Harold F. Webster
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 07:20
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B37/00; C04B37/02; C04B37/021; C04B41/45; C04B41/50; C04B41/51; C04B41/5127; C04B41/80; C04B41/81; C04B41/85; C04B41/88; H; H05; H05K; H05K3/00; H05K3/38; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; C04B2237/00; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/343; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/52; C04B2237/64; H05K1/00; H05K1/02; H05K1/0272; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/11; H05K2203/1178; H05K3/02; H05K3/06; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
85 words
A method of forming a conductor pattern including fine conductor runs on a ceramic substrate, comprising: (a) forming a plurality of grooves in a first side of a metallic sheet, said grooves not crossing portions of said metallic sheet which are to be formed into said fine conductor runs; (b) direct bonding using an eutectic composition said first side of said metallic sheet onto said ceramic substrate; and (c) selectively removing metal from a second side of said metallic sheet to form said conductor pattern.
Claim 2
Independent Claim
85 words
A method of forming a conductor pattern including fine conductor runs on a ceramic substrate, comprising: (a) forming a plurality of grooves in a first side of a metallic sheet, said grooves not crossing portions of said metallic sheet which are to be formed into said fine conductor runs; (b) direct bonding using an eutectic composition said first side of said metallic sheet onto said ceramic substrate; and (c) selectively removing metal from a second side of said metallic sheet to form said conductor pattern.
Claim 3
Dependent Claim
38 words
The method of claim 1 wherein said conductor pattern defines a pair of interdigitated electrodes, the digits of said electrodes being substantially straight and parallel to each other, and wherein said grooves comprise substantially parallel, substantially straight grooves.
Claim 4
Dependent Claim
18 words
The method of claim 1 or 2 wherein said forming a plurality of grooves comprises wet chemical etching.
Claim 5
Dependent Claim
22 words
The method of claim 3 wherein said selectively removing metal from a second side of said metallic sheet comprises wet chemical etching.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein each of said fine conductor runs have widths between about 6 and 60 mils and thicknesses between about 3 and 10 mils.
Claim 7
Dependent Claim
11 words
The method of claim 5 wherein said metallic sheet comprises copper.
Claim 8
Dependent Claim
32 words
The method of claim 1, 2 or 5 wherein each of said plurality of grooves is spaced between about 3 and 30 mils from the center of each adjacent fine conductor run.
Claim 9
Dependent Claim
19 words
The method of claim 1 wherein said ceramic substrate comprises one of the group consisting of alumina and beryllia.
Claim 10
Independent Claim
72 words
A method of forming a conductor pattern including fine conductor runs on a ceramic substrate, comprising: (a) selectively removing metal from a first side of a metallic sheet to define an outline of said conductor pattern; (b) direct bonding using a eutectic composition said first side of said metallic sheet onto said ceramic substrate; and (c) selectively removing metal from a second side of said metallic sheet to form said conductor pattern.
Claim 11
Independent Claim
72 words
A method of forming a conductor pattern including fine conductor runs on a ceramic substrate, comprising: (a) selectively removing metal from a first side of a metallic sheet to define an outline of said conductor pattern; (b) direct bonding using a eutectic composition said first side of said metallic sheet onto said ceramic substrate; and (c) selectively removing metal from a second side of said metallic sheet to form said conductor pattern.
Claim 12
Dependent Claim
31 words
The method of claim 9 wherein said selectively removing metal from said first side of said metallic sheet comprises removing approximately one-quarter to one-third of the thickness of said metallic sheet.
Claim 13
Dependent Claim
33 words
The method of claim 9 or 10 further comprising prior to said direct bonding selectively removing metal from a second side of said metallic sheet to define an outline of said conductor pattern.
Claim 14
Dependent Claim
39 words
The method of claim 11 wherein said selectively removing metal from said second side of said metallic sheet to define an outline of said conductor pattern comprises removing approximately one-quarter to one-third of the thickness of said metallic sheet.
Claim 15
Dependent Claim
71 words
The method of claim 11 wherein: (a) said selectively removing metal from said first side of said metallic sheet comprises wet chemical etching; (b) said selectively removing metal from said second side of said metallic sheet to define an outline of said conductor pattern comprises wet chemical etching; and (c) said selectively removing metal from said second side of said metallic sheet to form said conductor pattern comprises wet chemical etching.
Claim 16
Dependent Claim
11 words
The method of claim 11 wherein said metallic sheet comprises copper.
Claim 17
Dependent Claim
26 words
The method of claim 14 wherein said fine conductor runs have widths between about 5 and 60 mils and thicknesses between about 3 and 10 mils.
Claim 18
Dependent Claim
19 words
The method of claim 9 wherein said ceramic substrate comprises one of the group consisting of alumina and beryllia.
Claim 19
Dependent Claim
22 words
The method of claim 9 wherein said selectively removing metal from said first side of said metallic sheet comprises wet chemical etching.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-11-07 | 1987-05-09 | 1987-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-11-07 | 1991-05-09 | 1991-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-11-07 | 1995-05-09 | 1995-11-08 | $7700.00 | Window Closed / Lapsed |