US5125451A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat exchanger for solid-state electronic devices
Assignee: Microunity Systems Engineering Inc
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Filing: 1991-04-02
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Granted: 1992-06-30
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Expires: 2011-04-02
Abstract
Abstract A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.
Inventors
- 👤 James A. Matthews
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 21:39
CPC Classifications
F; F28; F28F; F28F3/00; F28F3/12; H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; F28D; F28D21/00; F28D2021/0019; F28D2021/0028; F28D2021/0029; F28F2260/00; F28F2260/02; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/4935; Y10T29/49366; Y10T29/49368
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
77 words
A heat exchanger for cooling a heat generating device comprising: a plurality of plates each having a microscopic recessed portion along at least one face, said plates being laminated together to form a block wherein a corresponding plurality of enclosed microscopic slots are formed by the recessed portions of said plates within said block; coolant manifold means for flowing a coolant fluid through said enclosed slots, said device being cooled when placed in contact with said block.
Claim 2
Dependent Claim
77 words
A heat exchanger for cooling a heat generating device comprising: a plurality of plates each having a microscopic recessed portion along at least one face, said plates being laminated together to form a block wherein a corresponding plurality of enclosed microscopic slots are formed by the recessed portions of said plates within said block; coolant manifold means for flowing a coolant fluid through said enclosed slots, said device being cooled when placed in contact with said block.
Claim 3
Dependent Claim
38 words
The heat exchanger of claim 1 wherein said block includes a front face having an exposed recessed portion and wherein said heat exchanger further comprises a cover plate for sealing said exposed recessed portion along said front face.
Claim 4
Dependent Claim
17 words
The heat exchanger of claim 2 wherein said plates comprise a material having a high thermal conductivity.
Claim 5
Dependent Claim
11 words
The heat exchanger of claim 3 wherein said plates comprise copper.
Claim 6
Dependent Claim
62 words
The heat exchanger of claim 1 wherein said coolant manifold means comprises: an intake manifold for applying said coolant to a first side of said enclosed microscopic slots; an exhaust manifold for removing said coolant from a second side of said slots; and means for pumping said coolant through said slots in a direction from said intake manifold to said exhaust manifold.
Claim 7
Dependent Claim
33 words
The heat exchanger of claim 5 wherein said intake and exhaust manifolds each comprise a pile fitted to a hole in said block, said hole providing an opening to said enclosed microscopic slots.
Claim 8
Dependent Claim
26 words
The heat exchanger of claim 6 wherein the depth of said recessed portion of each of said plates is approximately twice the thermal boundary layer thickness.
Claim 9
Dependent Claim
15 words
The heat exchanger of claim 7 wherein said coolant is distributed uniformly through said slots.
Claim 10
Dependent Claim
32 words
The heat exchange of claim 8 further comprising baffling means for altering the flow of said coolant within said slots to provide more efficient heat transfer between said coolant and said block.
Claim 11
Dependent Claim
15 words
The heat exchanger of claim 8 wherein said recessed portions are approximately 50 microns deep.
Claim 12
Dependent Claim
22 words
The heat exchanger of claim 5 wherein said recessed portions are centrally located along said at least one face of said plates.
Claim 13
Dependent Claim
22 words
The heat exchanger of claim 11 wherein said heat generating device comprises a semiconductor substrate upon which is fabricated an integrated circuit.
Claim 14
Dependent Claim
84 words
A heat exchanger for cooling a heat generating device comprising: a core element containing a plurality of microscopic channels enclosed therein, said core element comprising a plurality of laminated plates, each plate having a microscopic recessed portion along at least one face, wherein the recessed portions of said plates correspond to said plurality of enclosed microscopic channels; and a coolant manifold means for flowing a coolant fluid through said enclosed microscopic channels, said device being cooled when placed in contact with said core element.
Claim 15
Dependent Claim
84 words
A heat exchanger for cooling a heat generating device comprising: a core element containing a plurality of microscopic channels enclosed therein, said core element comprising a plurality of laminated plates, each plate having a microscopic recessed portion along at least one face, wherein the recessed portions of said plates correspond to said plurality of enclosed microscopic channels; and a coolant manifold means for flowing a coolant fluid through said enclosed microscopic channels, said device being cooled when placed in contact with said core element.
Claim 16
Dependent Claim
17 words
The heat exchanger of 13 wherein said core element comprises a material having a high thermal conductivity.
Claim 17
Dependent Claim
17 words
The heat exchanger of 13 wherein said core element comprises a material having a high thermal conductivity.
Claim 18
Dependent Claim
12 words
The heat exchanger of claim 14 wherein said core element comprises copper.
Claim 19
Dependent Claim
62 words
The heat exchanger of claim 14 wherein said coolant manifold means comprises: an intake manifold for applying said coolant to a first side of said microscopic channels; an exhaust manifold for removing said coolant from the second side of said channels; and a means for pumping said coolant through said channels in a direction from said intake manifold to said exhaust manifold.
Claim 20
Dependent Claim
32 words
The heat exchanger of claim 16 wherein said intake and exhaust manifolds each comprise a tube fitted within a hole in said core element which provides an opening to said microscopic channels.
Claim 21
Dependent Claim
22 words
The heat exchanger of claim 17 wherein the width of each of said channels is approximately twice the thermal boundary layer thickness.
Claim 22
Dependent Claim
34 words
The heat exchanger of claim 18 further comprising baffling means for altering the flow of said coolant in said slots thereby providing a more efficient heat transfer between said coolant and said core element.
Claim 23
Dependent Claim
15 words
The heat exchanger of claim 19 wherein said recessed portions are approximately 50 microns deep.
Claim 24
Dependent Claim
22 words
The heat exchanger of claim 19 wherein said heat generating device comprises a semiconductor substrate upon which is fabricated an integrated circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-30 | 1995-12-30 | 1996-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-30 | 1999-12-30 | 2000-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-30 | 2003-12-30 | 2004-06-30 | $7700.00 | Window Closed / Lapsed |