Cooling container for cooling a semiconductor element

Claim 1

In a cooling container for cooling a semiconductor element exhibiting main external surfaces, wherein said main surfaces of said semiconductor element are maintained in contact with said cooling container by means of a pressure contact, said container formed of at least two parts which define a flow path therebetween through which flows a cooling liquid, preferably oil, the improvement comprising: said two container parts comprising identical complementary halves, each having a bottom portion and a rim, said rims having formed therein diametrically opposed inlet and outlet openings by which said liquid passes through said cooling container, the inlet and output openings defining a longitudinal axis of said flow path, a plurality of square cross-sectional pins extending perpendicularly from said bottom portions, the corresponding pins of each container half tightly connected in rows diagonally oriented with respect to said longitudinal axis such that a plurality of generally zigzag cooling channels are formed in the flow path between said openings, said square pins oriented with the opposed corners thereof respectively parallel and perpendicular to said longitudinal axis of said flow path, whereby said pins are disposed with one pair of opposed corners facing upstream and downstream of liquid flow in said flow path.