Controlled rectifier mounting assembly

Claim 2

In a mounting assembly for supporting semiconductors between first and second conductive mounting supports wherein said semiconductors have pressure contact electrodes which are clamped together to apply operative pressures thereacross, the improvement comprising: a plurality of first and second electrically and thermally conductive heat heat sink members each including cooling fins operatively carried by said first and second conductive mounting supports so as to form electrical connections therebetween; a semiconductor having oppositely disposed pressure contact electrodes positioned between each of said first and second heat sink members; means fixedly connecting said first heat sink member to one of said oppositely disposed electrodes; means including a universal joint formed by a spherical member and a spherical recessed seat receiving said spherical member movably connecting said second heat sink member to the other of said oppositely disposed electrodes whereby said semiconductor is adjustable supported by said mounting assembly for maintaining thermal and electrical conductive connections between said semiconductor and said first and second heat sink member when pressure is applied across said oppositely disposed pressure contact electrodes.

Claim 3

In a semiconductor mounting assembly including a plurality of conductive mounting supports having annular openings supporting axially aligned pressure contact semiconductors wherein the ends of said mounting supports are clamped together for applying pressure to opposite electrode ends of said semiconductors, the improvement comprising; first and second cylindrically-shaped conductive heat sink members for supporting said semiconductors between adjacent mounting supports; first end portions formed on said heat sink members engaging said electrode ends of one of said semiconductors, one of said first end portions including a concave seat portion and the other of said first end portions including a flat surface; a spherical member, said spherical member having a flat end surface and a spherical end universally movable in said seat portion whereby said spherical member is adjustable relative to said heat sink members to apply pressure evenly to said electrode ends when the ends of said mounting supports are clamped together; and second end portions respectively formed on said heat sink members and mounted within said annular openings of said mounting supports, said second end portions including a plurality of grooves extending through said second end portions and forming cooling fins to provide expanded cooling surfaces in said heat sink members, whereby said heat sink members respectively form electrical connections between said electrode ends and said mounting supports and provide cooling at the electrode ends.

Claim 4

In a semiconductor mounting assembly including a plurality of conductive mounting supports having annular openings supporting axially aligned pressure contact semiconductors wherein the ends of said mounting supports are clamped together for applying pressure to opposite electrode ends of said semiconductors, the improvement comprising; first and second cylindrically-shaped conductive heat sink members for supporting said semiconductors between adjacent mounting supports; first end portions formed on said heat sink members engaging said electrode ends of one of said semiconductors, one of said first end portions including a concave seat portion and the other of said first end portions including a flat surface; a spherical member, said spherical member having a flat end surface and a spherical end universally movable in said seat portion whereby said spherical member is adjustable relative to said heat sink members to apply pressure evenly to said electrode ends when the ends of said mounting supports are clamped together; and second end portions respectively formed on said heat sink members and mounted within said annular openings of said mounting supports, said second end portions including a plurality of grooves extending through said second end portions and forming cooling fins to provide expanded cooling surfaces in said heat sink members, whereby said heat sink members respectively form electrical connections between said electrode ends and said mounting supports and provide cooling at the electrode ends.

Claim 5

A semiconductor mounting assembly for supporting plural stacks of pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a hermetically sealed housing; a plurality of axially arranged mounting supports within said housing formed of a thermally and electrically conductive material, opposite side surfaces formed on said mounting supports respectively supporting axially adjacent electrode ends of semiconductors included in said stacks of pressure contact semiconductors; means securing said mounting supports together so that force is applied inwardly to both ends of said mounting supports; a plurality of first and second heat sink members formed of an electrically and thermally conductive material respectively engaging the electrode ends of each of said semiconductors and mounting supports disposed adjacent said electrode ends, opposite ends of said heat sink members engaging said mounting supports, said opposite ends including fins separated by groove portions extending tranversely to the axis of said plural stacks of pressure contact semiconductors; inner ends of said heat sink members respectively contacting said electrode ends of one of said semiconductors, one of said inner ends including a spherical recessed portion; a spherical member engaging one of said electrode ends and universally engaging said spherical recessed portion so that said spherical member is movable to provide evenly distributed pressure engagement of said heat sink members with said electrode ends; and an evaporative cooling system for cooling said semiconductors including a liquid coolant having a low boiling point surrounding said mounting supports and filling said groove portions of said heat sink members and further including means having a heat exchanger connected to said housing whereby coolant vapor formed in said housing passes through said heat exchanger and returns to said housing in a liquid state.

Claim 6

A semiconductor mounting assembly for supporting plural stacks of pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a hermetically sealed housing; a plurality of axially arranged mounting supports within said housing formed of a thermally and electrically conductive material, opposite side surfaces formed on said mounting supports respectively supporting axially adjacent electrode ends of semiconductors included in said stacks of pressure contact semiconductors; means securing said mounting supports together so that force is applied inwardly to both ends of said mounting supports; a plurality of first and second heat sink members formed of an electrically and thermally conductive material respectively engaging the electrode ends of each of said semiconductors and mounting supports disposed adjacent said electrode ends, opposite ends of said heat sink members engaging said mounting supports, said opposite ends including fins separated by groove portions extending tranversely to the axis of said plural stacks of pressure contact semiconductors; inner ends of said heat sink members respectively contacting said electrode ends of one of said semiconductors, one of said inner ends including a spherical recessed portion; a spherical member engaging one of said electrode ends and universally engaging said spherical recessed portion so that said spherical member is movable to provide evenly distributed pressure engagement of said heat sink members with said electrode ends; and an evaporative cooling system for cooling said semiconductors including a liquid coolant having a low boiling point surrounding said mounting supports and filling said groove portions of said heat sink members and further including means having a heat exchanger connected to said housing whereby coolant vapor formed in said housing passes through said heat exchanger and returns to said housing in a liquid state.

Claim 7

A mounting assembly for a power supply circuit formed by a plurality of stacks of pressure contact semiconductor controlled rectifiers having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of first conductive mounting supports respectively including opposite side surfaces adapted to support and provide a first predetermined electrical connection between axially adjacent electrode ends of two adjacent groups of said controlled rectifiers included in said stacks; a plurality of said second conductive mounting supports respectively including opposite side surfaces adapted to support and provide a second predetermined electrical connection between axially adjacent electrode ends of two other adjacent groups of said controlled rectifiers included in said stacks, said second mounting supports being axially aligned and alternately spaced relative to each of said first mounting supports; means for applying force to the opposite ends of the axially aligned first and second mounting supports; an enclosed housing including upper and lower openings; means mounting said first mounting supports and said second mounting supports with said housing; a plurality of pairs of first and second heat sink members formed of an electrically and thermally conductive material, said first and second heat sink members respectively engaging said oppositely disposed electrode ends of each of said controlled rectifiers, a plurality of transversely extending grooves forming a plurality of axially extending fin portions in said first and second heat sink members, said first heat sink members including a spherical recessed portion; a spherical member universally engaging said spherical seat so that said spherical member is movable relative to said first heat sink member to provide evenly distributed contact engagement of said first and second heat sink members with said electrode ends, said first and second heat sink members further engaging respectively one of said first and one of said second mounting supports to provide electrical connections between said electrode ends and said first and second mounting supports; an evaporative cooling means for cooling said semiconductors including a coolant surrounding said mounting supports and said heat sink members and further including a heat exchanger means connected with said upper and lower openings of said housing whereby coolant vapor passes through said upper opening of said housing and returns in a liquid form through said lower opening of said housing; and first and second electrical conductor means respectively connected to said first mounting supports and to said second mounting supports and between an electrical source and an electrical load, whereby said first and second mounting supports and said plurality of stacks of pressure contact semiconductor controlled rectifiers proVide a power supply circuit for supplying said electrical load from said electrical source.

Claim 8

A mounting assembly for a power supply circuit formed by a plurality of stacks of pressure contact semiconductor controlled rectifiers having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of first conductive mounting supports respectively including opposite side surfaces adapted to support and provide a first predetermined electrical connection between axially adjacent electrode ends of two adjacent groups of said controlled rectifiers included in said stacks; a plurality of said second conductive mounting supports respectively including opposite side surfaces adapted to support and provide a second predetermined electrical connection between axially adjacent electrode ends of two other adjacent groups of said controlled rectifiers included in said stacks, said second mounting supports being axially aligned and alternately spaced relative to each of said first mounting supports; means for applying force to the opposite ends of the axially aligned first and second mounting supports; an enclosed housing including upper and lower openings; means mounting said first mounting supports and said second mounting supports with said housing; a plurality of pairs of first and second heat sink members formed of an electrically and thermally conductive material, said first and second heat sink members respectively engaging said oppositely disposed electrode ends of each of said controlled rectifiers, a plurality of transversely extending grooves forming a plurality of axially extending fin portions in said first and second heat sink members, said first heat sink members including a spherical recessed portion; a spherical member universally engaging said spherical seat so that said spherical member is movable relative to said first heat sink member to provide evenly distributed contact engagement of said first and second heat sink members with said electrode ends, said first and second heat sink members further engaging respectively one of said first and one of said second mounting supports to provide electrical connections between said electrode ends and said first and second mounting supports; an evaporative cooling means for cooling said semiconductors including a coolant surrounding said mounting supports and said heat sink members and further including a heat exchanger means connected with said upper and lower openings of said housing whereby coolant vapor passes through said upper opening of said housing and returns in a liquid form through said lower opening of said housing; and first and second electrical conductor means respectively connected to said first mounting supports and to said second mounting supports and between an electrical source and an electrical load, whereby said first and second mounting supports and said plurality of stacks of pressure contact semiconductor controlled rectifiers proVide a power supply circuit for supplying said electrical load from said electrical source.

Claim 9

A semiconductor mounting assembly for supporting a plurality of axially aligned pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of mounting supports formed of a thermally and electrically conductive material and including opposite sides adapted to be disposed between the electrode ends of axially adjacent semiconductors, annular holes being formed in said mounting supports so as to extend coaxially with said axially aligned semiconductors; a plurality of heat sink members respectively disposed in sealing contact with opposite side portions of said mounting supports surrounding said annular holes, an inner portion of said heat sink members having a plurality of grooves extending transversely in each of said annular holes so that a plurality of cooling passages are formed through said heat sink members, and oppositely disposed outer portions extending radially from both sides of said inner portion of said heat sink members, said outer portions being respectively adapted to support one of said electrode ends, at least one of said outer portions including a concave recessed seat portion; a spherical member having a convex portion universally engaging said concave seat portion and a flat portion engaging one of said electrode ends; a pressure applying means clamping the ends of said mounting supports together to apply pressure to said electrode ends of each semiconductor; and a liquid cooling means including means for conducting a liquid coolant through said heat sink cooling passages within said mounting supports so that said coolant conducts heat from said heat sink members to provide cooling of the electrode ends, and said heat sink members further providing, respectively, an electrical connection between adjacent semiconductors disposed on opposite ends thereof and the respectively adjacent mounting supports supporting said heat sink members.

Claim 10

A semiconductor mounting assembly for supporting a plurality of axially aligned pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of mounting supports formed of a thermally and electrically conductive material and including opposite sides adapted to be disposed between the electrode ends of axially adjacent semiconductors, annular holes being formed in said mounting supports so as to extend coaxially with said axially aligned semiconductors; a plurality of heat sink members respectively disposed in sealing contact with opposite side portions of said mounting supports surrounding said annular holes, an inner portion of said heat sink members having a plurality of grooves extending transversely in each of said annular holes so that a plurality of cooling passages are formed through said heat sink members, and oppositely disposed outer portions extending radially from both sides of said inner portion of said heat sink members, said outer portions being respectively adapted to support one of said electrode ends, at least one of said outer portions including a concave recessed seat portion; a spherical member having a convex portion universally engaging said concave seat portion and a flat portion engaging one of said electrode ends; a pressure applying means clamping the ends of said mounting supports together to apply pressure to said electrode ends of each semiconductor; and a liquid cooling means including means for conducting a liquid coolant through said heat sink cooling passages within said mounting supports so that said coolant conducts heat from said heat sink members to provide cooling of the electrode ends, and said heat sink members further providing, respectively, an electrical connection between adjacent semiconductors disposed on opposite ends thereof and the respectively adjacent mounting supports supporting said heat sink members.

Claim 11

A semiconductor mounting assembly for supporting a plurality of axially aligned pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of conductive mounting supports including annular holes extending axially through said mounting supports in coaxial alignment with said axially aligned semiconductors, internal cooling passages extending within said mounting supports and between said annular holes and a pair of exposed passage openings; a plurality of cylindrical heat sink members including first and second parts extending respectively into either side of said axial holes and on opposite sides of said mounting supports, a plurality of grooves forming fin portions on adjacent ends of said first and second parts, said fin portions extending transversely across said annular holes with said grooves providing a plurality of passages between the internal cooling passages of said mounting supports; a radially extending outer end portion being formed on each of said first and second parts to sealingly overlap opposite sides of said mounting supports surrounding said annular holes, said outer end portions having end surfaces adapted to receive the electrode ends of said semiconductors, one of said outer end portions including a flat surface for engaging an electrode end of a semiconductor disposed on one side of said heat sink member, and the other of said outer end portions including a convex recessed portion; a spherical member having a spherical convex side engaging said recessed portion and a flat side engaging an electrode end of a semiconductor disposed on the other side of said heat sink member; means applying inward force to the opposite ends of the axially aligned semiconductors and heat sink members whereby said spherical member is adjustable to evenly distribute pressure across the electrode ends of said semiconductors when the ends of said heat sink members are forced together; and means connectEd to said passage openings of said mounting assembly for connecting said heat sink passages in a continuous conduit path including a liquid coolant to thereby cool the respective electrode ends of said semiconductors, said heat members further providing electrical connections between said electrode ends and respectively adjacent mounting supports which support said heat sink members to thereby connect said axially aligned semiconductors in a predetermined circuit arrangement.

Claim 12

A semiconductor mounting assembly for supporting a plurality of axially aligned pressure contact semiconductors having oppositely disposed electrode ends, said mounting assembly comprising: a plurality of conductive mounting supports including annular holes extending axially through said mounting supports in coaxial alignment with said axially aligned semiconductors, internal cooling passages extending within said mounting supports and between said annular holes and a pair of exposed passage openings; a plurality of cylindrical heat sink members including first and second parts extending respectively into either side of said axial holes and on opposite sides of said mounting supports, a plurality of grooves forming fin portions on adjacent ends of said first and second parts, said fin portions extending transversely across said annular holes with said grooves providing a plurality of passages between the internal cooling passages of said mounting supports; a radially extending outer end portion being formed on each of said first and second parts to sealingly overlap opposite sides of said mounting supports surrounding said annular holes, said outer end portions having end surfaces adapted to receive the electrode ends of said semiconductors, one of said outer end portions including a flat surface for engaging an electrode end of a semiconductor disposed on one side of said heat sink member, and the other of said outer end portions including a convex recessed portion; a spherical member having a spherical convex side engaging said recessed portion and a flat side engaging an electrode end of a semiconductor disposed on the other side of said heat sink member; means applying inward force to the opposite ends of the axially aligned semiconductors and heat sink members whereby said spherical member is adjustable to evenly distribute pressure across the electrode ends of said semiconductors when the ends of said heat sink members are forced together; and means connectEd to said passage openings of said mounting assembly for connecting said heat sink passages in a continuous conduit path including a liquid coolant to thereby cool the respective electrode ends of said semiconductors, said heat members further providing electrical connections between said electrode ends and respectively adjacent mounting supports which support said heat sink members to thereby connect said axially aligned semiconductors in a predetermined circuit arrangement.