US5313099A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink assembly for solid state devices
Assignee: TE Connectivity Solutions GmbH
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Filing: 1993-03-04
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Granted: 1994-05-17
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Expires: 2013-03-04
Abstract
Abstract A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. An alternate embodiment shows the heat sink which has a snap on flange to attach the heat sink to the adaptor.
Inventors
- 👤 Peter D. Tata
- 👤 William B. Rife
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:13
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/641; H10W40/20; H10W40/231; H10W40/235
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
201 words
A heat sink assembly for removing heat from an electronic device package comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each other and being capable of slidably receiving said electronic device package, first and second planes lying respectively in the top and bottom of the grooves defining a space therebetween, the groove being adapted to clampingly receive opposite marginal portions of an electronic device package when inserted therein, a bore centrally located in the top wall and extending therethrough, a heat sink member having a cylindrical base member with a flat bottom surface adapted to be received through the bore in the top wall, the base member formed with means to engage with the periphery of the bore to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed in the space between the first and second planes whereby an electronic device package slidably inserted in the grooves will cause the top wall to bow through engagement with the flat bottom surface of the base.
Claim 2
Dependent Claim
201 words
A heat sink assembly for removing heat from an electronic device package comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each other and being capable of slidably receiving said electronic device package, first and second planes lying respectively in the top and bottom of the grooves defining a space therebetween, the groove being adapted to clampingly receive opposite marginal portions of an electronic device package when inserted therein, a bore centrally located in the top wall and extending therethrough, a heat sink member having a cylindrical base member with a flat bottom surface adapted to be received through the bore in the top wall, the base member formed with means to engage with the periphery of the bore to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed in the space between the first and second planes whereby an electronic device package slidably inserted in the grooves will cause the top wall to bow through engagement with the flat bottom surface of the base.
Claim 3
Dependent Claim
111 words
A heat sink assembly according to claim 1 in which the means to attach the heat sink member to the adaptor comprises a circular flange extending radially outwardly from the base member, the flange having a diameter slightly larger than the bore in the top wall and having a tapered edge portion to facilitate insertion of the base member through the bore and to serve as a cam surface to force the base upwardly and concomitantly the top wall to bow when an electronic device package is inserted in the grooves; said base member being in communication with the periphery of said bore to secure said base member to the adaptor.
Claim 4
Dependent Claim
49 words
A heat sink assembly according to claim 1 in which the means to attach the heat sink member to the adaptor comprises a male thread formed on the base member and a female thread formed in the bore of the top wall to directly threadably receive the base member.
Claim 5
Dependent Claim
44 words
A heat sink assembly according to claim 1 including a stop surface depending downwardly from the top wall to limit the sliding travel in a direction perpendicular to the longitudinal axis of said base member of an electronic device package inserted in the grooves.
Claim 6
Dependent Claim
31 words
A heat sink assembly according to claim 1 in which the heat sink comprises a plurality of generally circular fin members spaced along a generally cylindrical core and extending radially therefrom.
Claim 7
Dependent Claim
71 words
A heat sink assembly according to claim 3 in which the plane extending through the bottom of the grooves is a selected distance from the upper surface of the top wall and the thread formed on the cylindrical base member extends for a distance along the longitudinal axis of the base member a distance less than the selected distance to prevent excessive forces from being exerted on the electronic device package.
Claim 8
Dependent Claim
65 words
A heat sink assembly according to claim 3 in which the top wall is formed with a boss portion having a greater thickness than the remainder of the top wall, the threaded bore extending through the boss portion to threadably receive said base member to enable said base member to extend slightly below said top wall to provide frictional communication with said electronic device package.
Claim 9
Dependent Claim
176 words
A heat sink assembly for removing heat from an electronic device package having an outer peripheral edge and an array of pins comprising an adaptor having a top wall and having a pair of opposed side walls depending therefrom, each side wall having a distal end portion and having an inwardly laterally extending lip, forming a groove adapted to receive between each lip and the top wall the marginal portions of an electronic device package inserted therein, a threaded bore formed through the top wall, each of said lips extend inward a distance less than the distance from the outer edge of said electronic device package to said pins; and a heat sink member having a threaded base portion with a substantially flat bottom surface adapted to be threadably received in the threaded bore in the top wall whereby the base of the heat sink can be screwed down through the bore in the top wall with a flat bottom surface in engagement with a top surface of the electronic device package received in the adaptor.
Claim 10
Dependent Claim
176 words
A heat sink assembly for removing heat from an electronic device package having an outer peripheral edge and an array of pins comprising an adaptor having a top wall and having a pair of opposed side walls depending therefrom, each side wall having a distal end portion and having an inwardly laterally extending lip, forming a groove adapted to receive between each lip and the top wall the marginal portions of an electronic device package inserted therein, a threaded bore formed through the top wall, each of said lips extend inward a distance less than the distance from the outer edge of said electronic device package to said pins; and a heat sink member having a threaded base portion with a substantially flat bottom surface adapted to be threadably received in the threaded bore in the top wall whereby the base of the heat sink can be screwed down through the bore in the top wall with a flat bottom surface in engagement with a top surface of the electronic device package received in the adaptor.
Claim 11
Dependent Claim
78 words
A heat sink assembly according to claim 8 in which the top wall of the adaptor has a selected thickness and the threaded base portion has a longitudinal axis, the threaded base portion of the heat sink having a length taken along the longitudinal axis greater than the selected thickness to enable it, upon being screwed down, to exert sufficient pressure on the top surface of the electronic device to secure the assembly on the electronic device package.
Claim 12
Dependent Claim
31 words
A heat sink assembly according to claim 8 in which the heat sink comprises a plurality of generally circular fin members spaced along a generally cylindrical core and extending radially therefrom.
Claim 13
Dependent Claim
41 words
A heat sink assembly according to claim 8 in which the adaptor has a stop surface to limit sliding motion in a direction perpendicular to the longitudinal axis of said base portion of an electronic device package inserted into the adaptor.
Claim 14
Dependent Claim
26 words
A heat sink assembly according to claim 1 in which the heat sink comprises a continuous helically shaped fin member extending radially outwardly from a core.
Claim 15
Dependent Claim
26 words
A heat sink assembly according to claim 8 in which the heat sink comprises a continuous helically shaped fin member extending radially outwardly from a core.
Claim 16
Dependent Claim
119 words
A heat sink assembly according to claim 1 in which the side walls have a lower distal end portion formed with a tapered surface so that the adaptor can be pushed downwardly onto an electronic device package with the tapered surfaces camming the side walls apart to allow the electronic device package to pass by the tapered surface; said adaptor being capable of being pushed downwardly onto an electronic device package when the heat sink member is not threaded into the bore in the top wall and when said heat sink member is partially threaded into said bore to provide pressure onto the top surface of the electronic device package to secure the assembly to the electronic device package.
Claim 17
Dependent Claim
119 words
A heat sink assembly according to claim 8 in which a tapered surface is formed on the distal end portions of the side walls so that the adaptor can be pushed downwardly onto an electronic device package with the tapered surfaces camming the side walls apart to allow the electronic device package to pass by the tapered surface; said adaptor being capable of being pushed downwardly onto an electronic device package when the heat sink member is not threaded into the bore in the top wall and when said heat sink member is partially threaded into said bore to provide pressure onto the top surface of the electronic device package to secure the assembly to the electronic device package.
Claim 18
Dependent Claim
158 words
A heat sink assembly for removing heat from an electronic device package comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom to a lower distal end portion, a lip extending laterally inwardly from each lower distal end portion aligned with and facing each other, an aperture formed in the top wall extending therethrough, said adaptor being capable of slidably receiving the electronic device package; a heat sink member having a base member with a flat bottom surface adapted to be received through the aperture in the top wall, the base member formed with means to directly engage the periphery of the aperture to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed below the top wall whereby an electronic device package held between the side walls above the lips will be disposed in heat transfer relation with the heat sink member.
Claim 19
Dependent Claim
158 words
A heat sink assembly for removing heat from an electronic device package comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom to a lower distal end portion, a lip extending laterally inwardly from each lower distal end portion aligned with and facing each other, an aperture formed in the top wall extending therethrough, said adaptor being capable of slidably receiving the electronic device package; a heat sink member having a base member with a flat bottom surface adapted to be received through the aperture in the top wall, the base member formed with means to directly engage the periphery of the aperture to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed below the top wall whereby an electronic device package held between the side walls above the lips will be disposed in heat transfer relation with the heat sink member.
Claim 20
Dependent Claim
58 words
A heat sink assembly according to claim 16 in which the base member and the aperture are generally cylindrical and the means to attach the heat sink member to the adaptor comprises a male thread formed on the base member and a female thread formed in the aperture in the top wall to threadably receive the base member.
Claim 21
Dependent Claim
87 words
A heat sink assembly according to claim 16 in which the means to attach the heat sink member to the adaptor comprises a flange extending outwardly from the base member, the flange having an outer configuration shaped to correspond to that of the aperture but being slightly larger than the aperture and having a tapered edge portion to facilitate insertion of the base member through the aperture; whereby the base member is attached to the periphery of said aperture to secure the base member to the adaptor.
Claim 22
Dependent Claim
122 words
A heat sink assembly according to claim 16 in which the lips on the lower distal end portions of the side walls are formed with a tapered surface so that the adaptor can be pushed downwardly onto an electronic device package with the tapered surfaces camming the side walls apart to allow the electronic device package to pass by the lips; and adaptor being capable of being pushed downwardly onto an electronic device package when the heat sink member is not threaded into the bore in the top wall and when said heat sink member is partially threaded into said bore to provide pressure onto the top surface of the electronic device package to secure the assembly to the electronic device package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-16 | 1997-11-15 | 1998-05-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-16 | 2001-11-15 | 2002-05-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-16 | 2005-11-15 | 2006-05-17 | $7700.00 | Window Closed / Lapsed |