Semiconductor heat sink and/or cooler

Claim 1

IN HEAT DISSIPATION APPARATUS FOR A SEMICONDUCTOR CASE HAVING UPPER AND LOWER ENDS AND A PERIPHERAL OUTER SIDE, THE COMBINATION WHICH COMPRISES CASE SUPPORTING STRUCTURE FORMING AN OPENING AND HAVING A SHOULDER TO SUPPORT THE LOWER END OF THE CASE, AN INSERT BODY IN SAID OPENING BEING RECESSED INTERIORLY UPWARDLY, SAID RECESS BEING FORMED BY A SPLIT BODY WALL TO RECEIVE SAID CASE INWARDLY OF SAID SPLIT BODY WALL, THE BODY HAVING AN INTERIOR SHOULDER LOCATED TO FORCIBLY ENGAGE THE UPPER END OF THE CASE AND THEREBY LIMIT UPWARD RECEPTION OF THE CASE INTO THE BODY RECESS WITHOUT PREVENTING INWARD DEFLECTION OF SAID WALL EXTENT, THE BODY AND SAID STRUCTURE RESPECTIVELY HAVING OUTER AND INNER THREAD MEANS PRESENTED FOR CAMMING INTERENGAGEMENT ACTING TO FLEX SAID BODY WALL EXTENT INTO FORCIBLE CONTACT WITH THE OUTER SIDE OF THE SEMICONDUCTOR CASE THEREBY ESTABLISHING AN EXTENSIVE HEAT DISSIPATION PATH THROUGH SAID BODY AND BETWEEN SAID CASE AND STRUCTURE DURING SAID FORCIBLE ENGAGEMENT OF THE UPPER END OF THE CASE WITH SAID BODY INTERIOR SHOULDER.