Method and device for cooling an integrated circuit package

Claim 1

A method of cooling an integrated circuit package for mounting on a substrate, the method consisting in: providing the outside surface of the bottom of the integrated circuit package with a tinnable area suitable for fixing by soldering; providing the substrate in the zone where the integrated circuit package is to be positioned, with two tinnable areas overlying each other on opposite faces of the substrate, with the first tinnable area being placed facing the tinnable area on the bottom of the integrated circuit package and with the second tinnable are communicating with the first via at least one plated-through hole going through the substrate; and soldering the bottom of the integrated circuit package on top of the substrate by means of the tinnable areas being brought face to face, and soldering a peg underneath the substrate level with the integrated circuit package, the peg having a tinnable surface enabling it to be soldered to the second tinnable area of the substrate, and being pierced by at least one metal-walled channel terminating at one end in a capillary which opens out into the tinnable surface and terminating at its other end by a solder receptacle, said channel serving to absorb any excess solder between the substrate and the bottom of the integrated circuit package via the, or each, plated-through hole.

Claim 2

A method of cooling an integrated circuit package for mounting on a substrate, the method consisting in: providing the outside surface of the bottom of the integrated circuit package with a tinnable area suitable for fixing by soldering; providing the substrate in the zone where the integrated circuit package is to be positioned, with two tinnable areas overlying each other on opposite faces of the substrate, with the first tinnable area being placed facing the tinnable area on the bottom of the integrated circuit package and with the second tinnable are communicating with the first via at least one plated-through hole going through the substrate; and soldering the bottom of the integrated circuit package on top of the substrate by means of the tinnable areas being brought face to face, and soldering a peg underneath the substrate level with the integrated circuit package, the peg having a tinnable surface enabling it to be soldered to the second tinnable area of the substrate, and being pierced by at least one metal-walled channel terminating at one end in a capillary which opens out into the tinnable surface and terminating at its other end by a solder receptacle, said channel serving to absorb any excess solder between the substrate and the bottom of the integrated circuit package via the, or each, plated-through hole.

Claim 4

A device for cooling an integrated circuit package mounted on a substrate, said device comprising a heat-dissipating peg soldered together with the bottom of the integrated circuit package respectively, at a common location on opposite faces of said substrate, said substrate including tinnable areas disposed on each of said opposite faces, and said tinnable areas on the substrate being in communication with each other via reflow solder extending through at least one plated-through hole and said heat-dissipating peg being pierced by at least one metal-walled channel terminating at one end in a capillary opening out adjacent to the substrate and terminating at another end in at least one solder receptacle bearing excess reflow solder such that in soldering the heat-dissipating peg and the integrated circuit package to said substrate by reflow solder, excess reflow solder is sucked up by the capillary into said at least one solder receptacle resulting in the integrated circuit package being intimately pressed against the surface of the substrate to thereby facilitate proper soldering of connecting pads of the integrated circuit package to corresponding connecting pads of the substrate.

Claim 5

A device for cooling an integrated circuit package mounted on a substrate, said device comprising a heat-dissipating peg soldered together with the bottom of the integrated circuit package respectively, at a common location on opposite faces of said substrate, said substrate including tinnable areas disposed on each of said opposite faces, and said tinnable areas on the substrate being in communication with each other via reflow solder extending through at least one plated-through hole and said heat-dissipating peg being pierced by at least one metal-walled channel terminating at one end in a capillary opening out adjacent to the substrate and terminating at another end in at least one solder receptacle bearing excess reflow solder such that in soldering the heat-dissipating peg and the integrated circuit package to said substrate by reflow solder, excess reflow solder is sucked up by the capillary into said at least one solder receptacle resulting in the integrated circuit package being intimately pressed against the surface of the substrate to thereby facilitate proper soldering of connecting pads of the integrated circuit package to corresponding connecting pads of the substrate.