Heat sink for integrated circuit package

Claim 2

A heat exchange device for an IC pin chip package comprising: (a) gripping means for attachment to said chip package and having a central aperture, wherein said gripping means includes: (a1) a flexible planar area around said central aperture; (a2) first and second legs extending at right angles to said planar area, said legs acting to grip said chip package; (b) cover unit means including: (b1) a beryllium oxide disk connected to the top of said chip package; (b2) a metallic base plate for covering the top of said chip package, and having a threaded central aperture; (c) metallic fin means having a threaded extension cylinder for insertion through said gripping means and said metallic base plate for contact with said beryllium oxide disk.

Claim 3

The device of claim 1, wherein each of said first and second legs include: (a) a strip foot extending inwardly at right angles to each of said legs for grasping said chip package.

Claim 4

The device of claim 2, wherein each said strip foot includes: serrated edge cut-outs for avoidance of contact with pins situated on the underside of said chip package.

Claim 5

In a heat sink apparatus for an integrated circuit pin chip array package, wherein each package supports a centrally located beryllium disk attached to the top of said chip package, the combination comprising: (a) gripping means having two legs for clasping said chip package and including: (a1) a first central aperture for enabling passage of a threaded extension cylinder; (b) a metallic base plate for covering the top of said chip package and including: (b1) a second central aperture above said beryllium disk and including internal circumferential threads for engaging said threaded extension cylinder; (c) metallic cooling fin means which includes: (c1) said threaded extension cylinder for insertion through said gripping means and for threaded engagement through said metallic base plate for physical contact with said beryllium oxide disk.

Claim 6

In a heat sink apparatus for an integrated circuit pin chip array package, wherein each package supports a centrally located beryllium disk attached to the top of said chip package, the combination comprising: (a) gripping means having two legs for clasping said chip package and including: (a1) a first central aperture for enabling passage of a threaded extension cylinder; (b) a metallic base plate for covering the top of said chip package and including: (b1) a second central aperture above said beryllium disk and including internal circumferential threads for engaging said threaded extension cylinder; (c) metallic cooling fin means which includes: (c1) said threaded extension cylinder for insertion through said gripping means and for threaded engagement through said metallic base plate for physical contact with said beryllium oxide disk.

Claim 7

The combination of claim 4, wherein said two legs of said gripping means each include: (a) feet extension strips for attachment to the underside of said pin grid package.

Claim 8

The combination of claim 5, wherein each of said feet extension strips include: (a) serrated cut-outs for non-interference with pin arrays on the underside of said pin grid package.

Claim 9

In a heat sink apparatus for integrated circuit chip packages having a centrally located beryllium oxide disk attached to the top of said chip package, the combination comprising: (a) a snap-on unit for attachment to an IC package, said unit including: (a1) a flexible planar area having a central aperture and two opposite ends wherein each end supports a lip extension at right angles to said planar area, said lip extension being capable of gripping said chip package; (b) metallic cooling fin means having a threaded extension means for screw attachment to a base plate; (c) a metallic base for covering said IC chip package and including: (c1) a central aperture having a threaded internal circumference for screw-attachment of said threaded extension means.

Claim 10

In a heat sink apparatus for integrated circuit chip packages having a centrally located beryllium oxide disk attached to the top of said chip package, the combination comprising: (a) a snap-on unit for attachment to an IC package, said unit including: (a1) a flexible planar area having a central aperture and two opposite ends wherein each end supports a lip extension at right angles to said planar area, said lip extension being capable of gripping said chip package; (b) metallic cooling fin means having a threaded extension means for screw attachment to a base plate; (c) a metallic base for covering said IC chip package and including: (c1) a central aperture having a threaded internal circumference for screw-attachment of said threaded extension means.

Claim 11

In a heat sink apparatus for an integrated circuit chip package with conductive pins on the underside, and having an outer heat-conductive jacket, the combination comprising: (a) a snap-on unit for attachment to said chip package, said unit including: (a1) a flexible planar area having a central aperture and two opposite ends wherein each end supports a lip extension means at right angles to said planar area, said lip extension means being capable of gripping said chip package; (a2) first and second lip extension means wherein each said lip extension means includes: (a2a) an upper lip section responsive to finger pressure for flexing outwardly a lower lip section; (a2b) said lower lip section for returning to and holding a fixed position against said integrated circuit chip package, and wherein each said lower lip section includes: (i) a strip foot extending inwardly and parallel to said planar area, said strip foot having a series of cut-outs for avoidance of contact with conductive pins on the underside of said chip package; (b) heat conductive cooling fin means having a threaded extension means for screw attachment to a base plate; (c) a heat conductive base plate for contacting said jacket of said chip package and including: (c1) a central aperture having a threaded internal circumference for screw-attachment of said threaded extension means.

Claim 12

In a heat sink apparatus for an integrated circuit chip package with conductive pins on the underside, and having an outer heat-conductive jacket, the combination comprising: (a) a snap-on unit for attachment to said chip package, said unit including: (a1) a flexible planar area having a central aperture and two opposite ends wherein each end supports a lip extension means at right angles to said planar area, said lip extension means being capable of gripping said chip package; (a2) first and second lip extension means wherein each said lip extension means includes: (a2a) an upper lip section responsive to finger pressure for flexing outwardly a lower lip section; (a2b) said lower lip section for returning to and holding a fixed position against said integrated circuit chip package, and wherein each said lower lip section includes: (i) a strip foot extending inwardly and parallel to said planar area, said strip foot having a series of cut-outs for avoidance of contact with conductive pins on the underside of said chip package; (b) heat conductive cooling fin means having a threaded extension means for screw attachment to a base plate; (c) a heat conductive base plate for contacting said jacket of said chip package and including: (c1) a central aperture having a threaded internal circumference for screw-attachment of said threaded extension means.