US3874443A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat dissipator
Assignee: Individual
•
Filing: 1973-07-16
•
Granted: 1975-04-01
•
Expires: 1993-07-16
Abstract
Abstract Disclosed is a heat dissipator for use in soldering or desoldering dual-inline-pin integrated circuits comprising two identical heat dissipation clip members each having a notch forming a jaw. The clip members are pivotably fastened together and biased by a spring such that the jaw clamps over the integrated circuit when in use. In an alternate embodiment, the heat dissipator may be modified to function as an extractor for removing or inserting an integrated circuit on a printed circuit board, as well as functioning as a heat sink. The modified embodiment includes an adaptor member attached to each clip member having a plurality of fingers to engage the integrated circuit.
Inventors
- 👤 Joseph V Bayer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 08:47
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; H05K13/0491; B; B23; B23K; B23K3/00; B23K3/08; B23K3/085; F; F28; F28F; F28F1/00; F28F1/10; F28F1/12; F28F1/14; F28F1/20; H10; H10W; H10W40/00; H10W40/60
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
74 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of clip members pivotally connected by hinging means, each of said clip members having a notch along the lower interior edge thereof to form cooperably a jaw engageable with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; and biasing means between said clip members biasing said jaw into gripping engagement with said DIP integrated circuit.
Claim 2
Dependent Claim
74 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of clip members pivotally connected by hinging means, each of said clip members having a notch along the lower interior edge thereof to form cooperably a jaw engageable with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; and biasing means between said clip members biasing said jaw into gripping engagement with said DIP integrated circuit.
Claim 3
Dependent Claim
36 words
A heat sink as set forth in claim 1 in which each of said clip members is provided with a plurality of fins along the sides thereof to increase the surface area of said heat sink.
Claim 4
Dependent Claim
138 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of hingedly connected clip members each having a notch along the lower interior edge thereof to form a jaw capable of engagement with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; biasing means between said clip members for biasing said jaw toward gripping engagement with said DIP integrated circuit; and a pulling adaptor removably connected to each of said clip members and comprising notches along the lower interior edges thereof to form a second jaw engageable with the sides of said DIP integrAted circuit, said pulling adaptors also including fingers means projecting laterally from the lower edges thereof for disposition between the pins of said DIP integrated circuit and for engagement with the bottom of said DIP integrated circuit.
Claim 5
Dependent Claim
138 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of hingedly connected clip members each having a notch along the lower interior edge thereof to form a jaw capable of engagement with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; biasing means between said clip members for biasing said jaw toward gripping engagement with said DIP integrated circuit; and a pulling adaptor removably connected to each of said clip members and comprising notches along the lower interior edges thereof to form a second jaw engageable with the sides of said DIP integrAted circuit, said pulling adaptors also including fingers means projecting laterally from the lower edges thereof for disposition between the pins of said DIP integrated circuit and for engagement with the bottom of said DIP integrated circuit.
Claim 6
Dependent Claim
45 words
A heat sink as set forth in claim 3 in which said adaptors are provided with vertical recesses between said finger means in which said DIP integrated circuit pins may be disposed to provide greater contact area between said adaptors and said DIP integrated circuit.
Claim 7
Dependent Claim
56 words
A heat sink as set forth in claim 3 in which the lower edge of each of said adaptors is beveled inwardly and upwardly to provide wedge means by which wedging may be effected, between said DIP integrated circuit and a circuit board to which it is attached, by movement of said adaptors toward each other.
Claim 8
Dependent Claim
28 words
A heat sink as set forth in claim 3 in which said adaptors are connected to said clip members by cooperating dovetail connections within said first mentioned jaw.
Claim 9
Dependent Claim
125 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of hingedly connected clip members, said clip members cooperating to form a jaw engageable with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; biasing means between said clip members biasing said jaw into gripping engagement with said DIP integrated circuit; and finger means projecting laterally from the lower edges of said clip members for disposition between the pins of said DIP integrated circuit and for engagement with the bottom of said DIP integrated circuit, vertical recesses being provided between said finger means in which said DIP integrated circuit pins may be disposed to provide greater contact area between said heat sink and said DIP integrated circuit.
Claim 10
Dependent Claim
125 words
A heat sink for dissipating heat from integrated circuits during soldering and desoldering operations comprising: a pair of hingedly connected clip members, said clip members cooperating to form a jaw engageable with the sides and top of a DIP (Dual-Inline-Pins) integrated circuit; biasing means between said clip members biasing said jaw into gripping engagement with said DIP integrated circuit; and finger means projecting laterally from the lower edges of said clip members for disposition between the pins of said DIP integrated circuit and for engagement with the bottom of said DIP integrated circuit, vertical recesses being provided between said finger means in which said DIP integrated circuit pins may be disposed to provide greater contact area between said heat sink and said DIP integrated circuit.
Claim 11
Dependent Claim
36 words
A heat sink as set forth in claim 7 in which each of said clip members is provided with a plurality of fins along the sides thereof to increase the surface area of said heat sink.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-03-31 | 1978-09-30 | 1979-04-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-03-31 | 1982-09-30 | 1983-04-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-03-31 | 1986-09-30 | 1987-04-01 | $7700.00 | Window Closed / Lapsed |