US5176309A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing circuit board
Assignee: Toshiba Corp
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Filing: 1991-05-22
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Granted: 1993-01-05
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Expires: 2011-05-22
Abstract
Abstract According to this invention, there is provided a method of manufacturing a highly reliable circuit board in which a copper member is strongly, directly bonded to a substrate made of an aluminum nitride sintered body, thereby obtaining high peel strength. The method of manufacturing the circuit board includes the steps of bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body, and heating the substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuporus oxide composition, and directly bonding the copper member to the substrate.
Inventors
- 👤 Akihiro Horiguchi
- 👤 Mitsuo Kasori
- 👤 Fumio Ueno
- 👤 Hiroshi Komorita
- 👤 Mitsuyoshi Endo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
133 words
A method of manufacturing a circuit board comprising the steps of: a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a, cuprous oxide composition, and directly bonding said copper member to said substrate.
Claim 2
Independent Claim
133 words
A method of manufacturing a circuit board comprising the steps of: a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a, cuprous oxide composition, and directly bonding said copper member to said substrate.
Claim 3
Dependent Claim
24 words
A method according to claim 1, wherein said aluminum nitride sintered body is obtained by sintering an aluminum nitride powder containing a sintering aid.
Claim 4
Dependent Claim
17 words
A method according to claim 1, wherein said copper member contains 150 to 600 ppm of oxygen.
Claim 5
Dependent Claim
18 words
A method according to claim 1, wherein said inert gas atmosphere contains 1 to 50 ppm of oxygen.
Claim 6
Dependent Claim
24 words
A method according to claim 1, wherein copper is substantially exposed from a surface of said copper member which is bonded to said substrate.
Claim 7
Dependent Claim
26 words
A method according to claim 1, wherein a peel strength of said copper member which is bonded to said substrate is not less than 5 kgf/cm.
Claim 8
Independent Claim
118 words
A method of manufacturing a circuit board, comprising the steps of: bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with a substrate made of an aluminum oxide sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuprous oxide composition, and directly bonding said copper member to said substrate.
Claim 9
Independent Claim
118 words
A method of manufacturing a circuit board, comprising the steps of: bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with a substrate made of an aluminum oxide sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuprous oxide composition, and directly bonding said copper member to said substrate.
Claim 10
Dependent Claim
17 words
A method according to claim 7, wherein said copper member contains 100 to 600 ppm of oxygen.
Claim 11
Dependent Claim
18 words
A method according to claim 7, wherein said inert gas atmosphere contains 1 to 50 ppm of oxygen.
Claim 12
Dependent Claim
24 words
A method according to claim 7, wherein copper is substantially exposed from a surface of said copper member which is bonded to said substrate.
Claim 13
Dependent Claim
26 words
A method according to claim 7, wherein a peel strength of said copper member which is bonded to said substrate is not less than 5 kgf/cm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-05 | 1996-07-06 | 1997-01-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-05 | 2000-07-06 | 2001-01-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-05 | 2004-07-06 | 2005-01-05 | $7700.00 | Window Closed / Lapsed |