← Back to Patent Explorer
US4849292A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for directly bonding ceramic and metal members and laminated body of the same

Assignee: Toshiba Corp
•
Filing: 1987-04-22
•
Granted: 1989-07-18
•
Expires: 2007-04-22
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A laminated body comprising a ceramic member and a metal member, and a method of forming the laminated body are described. The laminated body is characterized in that the ceramic member contains in its surface portion a bonding agent and the metal member is directly bonded to the surface of the ceramic member. The method of forming the laminated body is characterized in that a bonding agent-containing layer is first formed in the surface of the ceramic member and then the bonding agent-containing layer is heated while being contacted with the metal member.

Inventors

  • 👤 Nobuyuki Mizunoya
  • 👤 Hajime Kohama
  • 👤 Yasuyuki Sugiura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 11:18
CPC Classifications
B; B32; B32B; B32B9/00; B32B9/04; B32B9/041; B32B15/00; B32B15/04; B32B38/00; B32B38/0036; B32B7/00; B32B7/04; B32B7/12; B32B9/005; C; C04; C04B; C04B37/00; C04B37/02; C04B37/021; C04B37/023; C04B37/025; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; B32B2307/00; B32B2307/30; B32B2307/302; B32B2310/00; B32B2310/04; B32B2310/0445; B32B2310/0463; B32B2310/0472; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/06; C04B2237/062; C04B2237/064; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/341; C04B2237/345; C04B2237/348; C04B2237/36; C04B2237/365; C04B2237/366; C04B2237/368; C04B2237/40; C04B2237/403; C04B2237/405; C04B2237/406; C04B2237/407; C04B2237/50; C04B2237/54; C04B2237/70; C04B2237/708; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/38; Y; Y10; Y10S; Y10S228/00; Y10S228/903

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 45 words
A heat conductive substrate comprising an aluminum nitride ceramic plate having a surface oxidized at a thickness of 20 microns or less and a copper layer directly bonded to said oxidized surface, a eutectic crystal being formed between the copper layer and said oxidized surface.
Claim 2
Dependent Claim 45 words
A heat conductive substrate comprising an aluminum nitride ceramic plate having a surface oxidized at a thickness of 20 microns or less and a copper layer directly bonded to said oxidized surface, a eutectic crystal being formed between the copper layer and said oxidized surface.
Claim 3
Dependent Claim 18 words
A heat conductive substrate according to claim 1, wherein said aluminum nitride ceramic plate contains a sintering auxiliary.
Claim 4
Dependent Claim 29 words
A heat conductive substrate according to claim 2, wherein said sintering auxiliary is selected from the group consisting of: oxides and carbonates of yttrium, aluminum, calcium, strontium or beryllium.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-07-17 1993-01-16 1993-07-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-07-17 1997-01-16 1997-07-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-07-17 2001-01-16 2001-07-18 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag