Patent US5776512A successfully refreshed from Google Patents.
US5776512A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for encapsulating electronic packages
Assignee: Interconnect Systems Inc
•
Filing: 1996-10-16
•
Granted: 1998-07-07
•
Expires: 2016-10-16
Abstract
Abstract A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.
Inventors
- 👤 Patrick O. Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:16
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10S; Y10S425/00; Y10S425/228
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
163 words
An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising: a first mold platen having a first recessed portion for accommodating the laminate substrate having the heat sink thereon; a second mold platen for mating with the first mold platen to form a mold cavity, said second mold platen having a second recessed portion with a width greater than the laminate substrate; a member having a third recessed portion and a planar surface surrounding the third recessed portion for supporting the laminate substrate, the member being movable translationally in the second recessed portion of the second mold platen; and biasing means located in the second recessed portion of the second mold platen contacting a surface of the member opposite of the planar surface for forcing said heat sink against a surface of the first recessed portion of the first mold platen when the substrate is supported on the planar surface and centered over the third recessed portion of the member.
Claim 2
Independent Claim
163 words
An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising: a first mold platen having a first recessed portion for accommodating the laminate substrate having the heat sink thereon; a second mold platen for mating with the first mold platen to form a mold cavity, said second mold platen having a second recessed portion with a width greater than the laminate substrate; a member having a third recessed portion and a planar surface surrounding the third recessed portion for supporting the laminate substrate, the member being movable translationally in the second recessed portion of the second mold platen; and biasing means located in the second recessed portion of the second mold platen contacting a surface of the member opposite of the planar surface for forcing said heat sink against a surface of the first recessed portion of the first mold platen when the substrate is supported on the planar surface and centered over the third recessed portion of the member.
Claim 3
Dependent Claim
27 words
The apparatus of claim 1 further comprising: at least one depression in the planar surface of the member for receiving electrical contacts extending from the laminate substrate.
Claim 4
Dependent Claim
17 words
The apparatus of claim 1 wherein the third recessed portion of the member is an annular cavity.
Claim 5
Dependent Claim
18 words
The apparatus of claim 1 wherein the third recessed portion of the member forms a second mold cavity.
Claim 6
Dependent Claim
151 words
A transfer mold for encapsulating a laminate substrate having a heat sink attached thereto, comprising: a first mold platen having a first recess configured to accommodate the laminate substrate having the heat sink attached thereto; and a second mold platen for mating with the first recess of the first mold platen to form a mold cavity; the first mold platen having a cavity contiguous with the first recess, the cavity containing a plug and a biasing means for pressing said plug against the heat sink when the laminate substrate is located between the mated first mold platen and second mold platen, the second mold platen having a second recess with a width no greater than a width of the heat sink such that the laminate substrate extending across the recess of the second mold platen does not deflect when the first mold platen and the second mold platen are mated together.
Claim 7
Dependent Claim
151 words
A transfer mold for encapsulating a laminate substrate having a heat sink attached thereto, comprising: a first mold platen having a first recess configured to accommodate the laminate substrate having the heat sink attached thereto; and a second mold platen for mating with the first recess of the first mold platen to form a mold cavity; the first mold platen having a cavity contiguous with the first recess, the cavity containing a plug and a biasing means for pressing said plug against the heat sink when the laminate substrate is located between the mated first mold platen and second mold platen, the second mold platen having a second recess with a width no greater than a width of the heat sink such that the laminate substrate extending across the recess of the second mold platen does not deflect when the first mold platen and the second mold platen are mated together.
Claim 8
Dependent Claim
28 words
The transfer mold of claim 5 wherein said second mold platen has at least one depression for receiving at least one electrical contact attached to the laminate substrate.
References Cited (Backward Citations)
US4043027A
Cited
US3930114A
Cited
JPS5433665A
Cited
US4470786A
Cited
US4437141A
Cited
US4460537A
Cited
US4455274A
Cited
US4823234A
Cited
US4961105A
Cited
US4890152A
Cited
US4935581A
Cited
US4778641A
Cited
US4688152A
Cited
US4893172A
Cited
US4859722A
Cited
US4861251A
Cited
US5093282A
Cited
US4868349A
Cited
US4972253A
Cited
US4975765A
Cited
US4954877A
Cited
US5108955A
Cited
US5049526A
Cited
US4954878A
Cited
US5019673A
Cited
US5132778A
Cited
US5370517A
Cited
US5136366A
Cited
US5216278A
Cited
US5241133A
Cited
US5191511A
Cited
US5218759A
Cited
US5153385A
Cited
US5296738A
Cited
US5328870A
Cited
US5395226A
Cited
US5355283A
Cited
US5609889A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-06 | 2002-01-05 | 2002-07-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-06 | 2006-01-05 | 2006-07-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-06 | 2010-01-05 | 2010-07-07 | $7700.00 | Window Closed / Lapsed |