High terminal count integrated circuit device package

Claim 1

A surface mounted high terminal count integrated circuit device package for solder attachment to a substrate comprising: (a) a support member having a centrally disposed chip connect area, top and bottom surfaces and periphery forming sides and walls forming notches in the sides of said support member and a plurality of holes in said support member in preselected patterns adjacent to the notched periphery thereof; (b) electrical metallizations on the walls of said notches and plurality of holes of the support member, said metallization of the notches forming metallized notches and said metallization of the holes forming cylindrically shaped electrical leads therethrough, said metallized notches and holes for forming solderable connections between the package and substrate; (c) a plurality of wire bonding terminals selectively positioned on the support member adjacent said chip connect area; (d) a plurality of trace conductors having first and second ends, said first ends electrically connected to said plurality of wire bonding terminals; and (e) a plurality of expanded terminal pads mounted on the top and bottom surfaces of the support member, said expanded pads of the top surface electrically connected to the second ends of the trace conductors and together with the expanded pads of the bottom surface electrically connected to the notch and hole metallizations of the support member in open communication with the metallized notches and holes thereof whereby when the bottom pads are soldered to the substrate, solder rises up the open metallized notches and holes to form solder fillets therein for electrical connection of the substrate and for visual inspection thereof.