US5609889A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for encapsulating electronic packages
Assignee: Interconnect Systems Inc
•
Filing: 1995-05-26
•
Granted: 1997-03-11
•
Expires: 2015-05-26
Abstract
Abstract A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.
Inventors
- 👤 Patrick O. Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:32
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; Y; Y10; Y10S; Y10S425/00; Y10S425/228
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
155 words
An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising: a first mold platen having a recessed portion; a second mold platen for mating with the first mold platen to form a mold cavity adapted to receive the laminate substrate with the heat sink thereon, the second mold platen having a recessed portion and a support surface surrounding the recessed portion for supporting the laminate substrate; a member located in a cavity contiguous with the recessed portion in the first mold platen, the member having a width greater than the recessed portion of the second mold platen; and biasing means located in the contiguous cavity for urging the member into contact with the heat sink such that mold compound entering the apparatus is prevented from covering a surface of the heat sink in contact with the member and holding the laminate substrate flat against the support surface of the second mold platen.
Claim 2
Independent Claim
155 words
An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising: a first mold platen having a recessed portion; a second mold platen for mating with the first mold platen to form a mold cavity adapted to receive the laminate substrate with the heat sink thereon, the second mold platen having a recessed portion and a support surface surrounding the recessed portion for supporting the laminate substrate; a member located in a cavity contiguous with the recessed portion in the first mold platen, the member having a width greater than the recessed portion of the second mold platen; and biasing means located in the contiguous cavity for urging the member into contact with the heat sink such that mold compound entering the apparatus is prevented from covering a surface of the heat sink in contact with the member and holding the laminate substrate flat against the support surface of the second mold platen.
Claim 3
Dependent Claim
29 words
The apparatus of claim 1 further comprising: at least one depression in the support surface of the second mold platen for receiving electrical contacts extending from the laminate substrate.
Claim 4
Dependent Claim
18 words
The apparatus of claim 1 wherein the recessed portion of the second mold platen is an annular cavity.
Claim 5
Dependent Claim
19 words
The apparatus of claim 1 wherein the recessed portion of the second mold platen forms a second mold cavity.
References Cited (Backward Citations)
US4043027A
Cited
US3930114A
Cited
JPS5433665A
Cited
US4470786A
Cited
US4437141A
Cited
US4460537A
Cited
US4455274A
Cited
US4823234A
Cited
US4961105A
Cited
US4890152A
Cited
US4935581A
Cited
US4778641A
Cited
US4688152A
Cited
US4893172A
Cited
US4859722A
Cited
US4861251A
Cited
US5093282A
Cited
US4868349A
Cited
US4972253A
Cited
US4975765A
Cited
US4954877A
Cited
US5108955A
Cited
US5049526A
Cited
US4954878A
Cited
US5019673A
Cited
US5132778A
Cited
US5370517A
Cited
US5136366A
Cited
US5216278A
Cited
US5241133A
Cited
US5191511A
Cited
US5218759A
Cited
US5153385A
Cited
US5296738A
Cited
US5328870A
Cited
US5395226A
Cited
US5355283A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-10 | 2000-09-09 | 2001-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-10 | 2004-09-09 | 2005-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-10 | 2008-09-09 | 2009-03-11 | $7700.00 | Window Closed / Lapsed |